A radar sensor includes a flexible printed circuit board (PCB). A first antenna or antenna array is mounted on a first portion of the flexible PCB, and a second antenna or antenna array is mounted on a second portion of the flexible PCB. The first portion and the second portion of the flexible PCB are offset such that the first and second antennas/arrays have respective first and second fields-of-view (FOVs) that are offset from one another. The first and second antennas/arrays can be coupled to a same backend PCB that includes a hardware logic component. The hardware logic component is configured to receive, from the flexible PCB, radar data that is representative of the radar returns received by the first and second antennas/arrays. The hardware logic component processes the radar data to generate detections that are indicative of points on surfaces of objects in the first and second FOVs.

The size of a solid-state imaging device that captures images is reduced. The solid-state imaging device includes an array antenna. A plurality of rectifying antenna circuits is arranged in the array antenna. Each of the plurality of rectifying antenna circuits includes a rectifying antenna and a pixel signal generating unit. The pixel signal generating unit includes a floating diffusion layer, a transfer transistor that transfers charge from the rectifying antenna to the floating diffusion layer in accordance with a transfer signal, a reset transistor that initializes the amount of charge in the floating diffusion layer in accordance with a reset signal, an amplification transistor that amplifies a voltage corresponding to the amount of charge accumulated in the floating diffusion layer, and a selection transistor that outputs a signal of the amplified voltage as a pixel signal in accordance with a selection signal.

A system and method is provided in which a single-pole-double-throw switch controls whether a circular loop transmits a right-hand circular polarized signal or a left-hand circular polarized signal. The single-pole-double-throw switch is shielded from the circular loop by a metallic ground plane. An annulus of dielectric insulates the circular loop from the metallic ground plane.

Antenna arrays with three-dimensional (3D) radiating elements are provided, as well as methods of manufacturing and methods of using the same. An array can include a ground plane and a plurality of radiating elements disposed thereon, and at least a portion of the radiating elements of the plurality of radiating elements can be 3D radiating elements. The array can optionally include a substrate disposed on the ground plane and having holes for the radiating elements. The 3D radiating elements can include, for example, conical elements such as a hollow conical element, a full conical element, a hollow and discretized conical element, or a combination thereof.

Disclosed is a device for storing elements each including a first wireless communication unit, the device including: —a receiving support receiving the elements; —a second wireless communication unit generating waves and communicating with each first unit according to a communication protocol, a communication zone being a three-dimensional zone in which the second unit communicates with each first unit when each first unit is located in the zone and does not communicate with a first unit when the first unit is located outside the zone; —a waveguide able to guide the generated waves so that a dimension of the communication zone is strictly greater than a reference dimension, the reference dimension being equal to the dimension of the communication zone when the storage device is without waveguides.

The present invention relates to relates to a multi-input and multi-output antenna apparatus, and particularly, to a multi-input and multi-output antenna apparatus including a main board having an accommodation space formed in at least one region and provided in the form of a predetermined space, and a sub-board stacked on a rear surface portion of the main board and configured such that a plurality of heating elements is mounted on a front surface portion of the sub-board that is directed toward the accommodation space, in which heat generated from the heating elements is dissipated to a rear surface portion of the sub-board, which makes it possible to improve heat dissipation performance of the antenna apparatus and improve frequency filtering performance of the antenna apparatus.

Provided are antenna apparatus and a base station, where the antenna apparatus includes a first radiator configured to radiate a low-frequency signal and a second radiator configured to radiate a high-frequency signal, the first radiator comprising at least one first stub and at least one second stub; one end of the first stub is connected to a first connecting point on the first radiator, the other end of the first stub is a free end; one end of the second stub is connected to a second connecting point on the first radiator, the other end of the second stub is a free end; and a sum of a length of the first stub, a length of the second stub, and a length of the first radiator between the first connecting point and the second connecting point is determined according to a wavelength corresponding to a predefined high frequency.

The present disclosure provides an antenna packaging structure radiating e-m waves in a horizontal direction and a vertical direction and a method making the same. The method includes: providing a support substrate, forming a separation layer on a surface of the support substrate; forming a rewiring layer on the separation layer; forming an antenna array layer on the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes first antennas and second antennas arranged in an array respectively, radiating e-m waves in the horizontal direction and the vertical direction respectively; forming a molding material layer; removing the support substrate and the separation layer; forming solder ball bumps on a surface of the rewiring layer away from the antenna array layer, the solder ball bumps are electrically connected to the metal wire layer; disposing a chip on the solder ball bumps.

Apparatus and methods for wirelessly communicating using antennas are disclosed. In certain embodiments, an antenna system includes a first radio frequency signal conditioning circuit configured to condition a first radio frequency signal of a first frequency, a plurality of second radio frequency signal conditioning circuits configured to condition a plurality of second radio frequency signals of a second frequency that is greater than the first frequency, a plurality of switches operable in a first mode and a second mode, and an antenna array of including a plurality of antenna elements interconnect by the plurality of switches. The antenna array is operable to handle the first radio frequency signal in the first mode, and to handle the plurality of second radio frequency signals in the second mode.

The present disclosure relates to an array antenna arrangement comprising at least one set of at least two sub-array antennas. Each set of sub-array antennas is mounted such that a corresponding array antenna column is formed. For each polarization in each set of sub-array antennas, each sub-array antenna comprises a corresponding sub-array antenna port that is associated with a certain sub-array antenna beam pointing direction setting, and each sub-array antenna port is connected to a corresponding radio chain in a set of radio chains, where each set of radio chains is adapted to provide a corresponding digital antenna beam pointing direction setting. In at least one set of sub-array antennas, at least one sub-array beam pointing direction setting, differs from a corresponding digital antenna beam pointing direction setting.