A package structure includes a semiconductor die, an antenna substrate structure, and a redistribution layer. The semiconductor die is laterally wrapped by a first encapsulant. The antenna substrate structure is disposed over the semiconductor die, wherein the antenna substrate structure includes a circuit substrate and at least one antenna element inlaid in the circuit substrate. The redistribution layer is disposed between the semiconductor die and the antenna substrate structure, wherein the at least one antenna element is electrically connected with the semiconductor die through the circuit substrate and the redistribution layer. The at least one antenna element includes patch antennas.

A beamforming network for use with a plurality of antenna elements arranged in a planar array of linear sub-arrays includes first and second sets of beamforming sub-networks. Each beamforming sub-network in the first set of beamforming sub-networks is associated with a respective one of the linear sub-arrays and is adapted to generate, via the associated linear sub-array, fan beams along respective beam directions in a first set of beam directions. Each beamforming sub-network in the second set of beamforming sub-networks is associated with a respective one of the beam directions in the first set of beam directions. For each beamforming sub-network in the second set of beamforming sub-networks, each of the output port is coupled to an input port of a respective beamforming sub-network in the first set of beamforming sub-networks that corresponds to the associated beam direction. The application further relates to a multibeam antenna comprising such beamforming network.

According to one embodiment, disclosed is an antenna comprising: a first waveguide having a first signal transmission path; a second waveguide connected to the first waveguide; and an antenna unit connected to the second waveguide and having a first opening, wherein the second waveguide comprises a first separator for separating the signal transmission path, and the antenna unit comprises a first antenna unit and a second antenna unit.

Antenna device which is suitable for wireless communications according to a 5G network standard, wherein the antenna device comprises, or consists of: i) a primary layer having a top side and a bottom side, the primary layer comprising a multitude of adjacent antenna units wherein each antenna unit has a respective electrically conductive antenna plate which is present at the top side of the primary layer, and ii) a dielectric resonator body which comprises, or consists of, a resonator base layer having a top side and a bottom side, which top side is provided with a multitude of adjacent resonator units, wherein the resonator base layer and the resonator units are made of dielectric material,
wherein the bottom side of the dielectric resonator body is provided on the top side of the primary layer, and wherein above the antenna plate of each antenna unit a corresponding resonator unit is present.

Method for use in wireless communications according to a 5G network standard, comprising the step of connecting a communication circuit to an antenna device.

In an aspect, a thermoplastic composite comprises a polypropylene; a plurality of glass fibers; wherein the glass fibers comprise boric acid and CaO, both based on the total weight of the glass fibers; a plurality of clay platelets; and a plurality of clay rods; and wherein the thermoplastic composite comprises 0.5 to 10 weight percent of the of the sum of the plurality of clay platelets and the plurality of the clay nanorods based on the total weight of the thermoplastic composite. In another aspect, an article comprises an antenna array; a reflecting layer located on a surface of the antenna array; and a spacer layer comprising a thermoplastic component located in between the antenna array and the reflecting layer, wherein the thermoplastic composite comprises a thermoplastic polymer; a plurality of glass fibers; a plurality of clay platelets; and a plurality of clay rods.

An electronic assembly includes a circuit board including a plurality of electrically conductive traces, a cover layer disposed on the circuit board, and a plurality of antenna assemblies disposed on a major top surface of the cover layer and exposing the major top surface therebetween. Each of the antenna assemblies includes an antenna and an adhesive layer bonding the antenna to the major top surface of the cover layer. The antenna is electrically coupled to a corresponding different trace in the plurality of traces. The adhesive layers in the antenna assemblies have substantially a same first composition and a same average first thickness. The antennas in the antenna assemblies have substantially a same second composition and a same average second thickness greater than about 5 microns. The electronic assembly can be singulated to provide antenna assemblies. Methods of making the assemblies are also described.

A method includes sending a first orbital angular momentum (OAM) reference signal in a first beam direction. The first OAM reference signal is used to determine a second beam direction from the first beam direction. The method also includes receiving first indication information. The first indication information includes information about the second beam direction. The method also includes sending a second OAM reference signal in the second beam direction. The second OAM reference signal is used to determine antenna information and a second channel response of the second OAM reference signal. The method also includes receiving second indication information. The second indication information is determined based on the second channel response and the antenna information. The second indication information is used to determine a transmission manner. The transmission manner includes OAM wave transmission, plane wave transmission, or joint transmission of OAM and a plane wave.

A wideband direction finding (WBDF) aperture employs a limited number of extreme wideband end-fire antenna elements capable of covering a wide frequency bandwidth. Arranging variable sized antenna elements in a specific pattern, the WBDF aperture enables direction finding capability covering an extreme wide frequency band. The pattern arrangement of variable sized elements offers the signal discernment to limit ambiguities in signal angle of arrival. This small form factor design enables the WBDF aperture to be mounted on the surface of a missile, munition, or small UAS wing or fuselage. The WBDF aperture offers a combination of differing sized antenna elements arranged in a specific pattern, combined with direction finding and signal tracking to provide an unambiguous relative azimuth and elevation angle of the target.

A detector array having a plurality of detector elements (also referred to as antennas) which have a minimum perimeter length and a maximum perimeter length. A detector array with detector elements having at least the minimum perimeter length has improved analyte detection performance compared to a detector array with detector elements that do not have the minimum perimeter length. In addition, a detector array with detector elements with a perimeter length no greater than the maximum perimeter length allows the size of the detector array to be minimized while still achieving the desired detection performance.

An electromagnetic device includes: a first electromagnetic, EM, signal feed; a second EM signal feed disposed adjacent to the first EM signal feed; and, an elevated electrically conductive region disposed between and elevated relative to the first and second EM signal feeds.