An antenna structure according to an embodiment of the present disclosure includes a dielectric layer, and a plurality of antenna units arranged on a top surface of the dielectric layer. Each of the plurality of antenna units includes a radiator, a transmission line including a first transmission line and a second transmission line that extend in different directions to be connected to the radiator, an upper parasitic element adjacent to an upper portion of the radiator, and a lower parasitic element adjacent to a lower portion of the radiator and the transmission line. Feeding signals of different phases are applied to the first transmission line and the second transmission line.

An antenna package according to an embodiment includes a plurality of antenna units including first antenna units and second antenna units, a circuit board electrically connected to the antenna units. The circuit board includes a core layer including a first surface and a second surface facing each other, a first circuit wiring disposed on the first surface of the core layer and electrically connected to the first antenna units, and a second circuit wiring distributed on the first and second surfaces of the core layer and electrically connected to the second antenna units. Antenna units of different resonance frequencies can be efficiently included in the package using the circuit wiring design.

An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier, an antenna portion, a first portion and a second portion. The antenna portion is located on the carrier. The first portion is located on the carrier. The second portion is located on the carrier and is configured for blocking a material from entering the antenna area, wherein the material covers a lateral surface of the carrier.

Provided is an electronic device having an antenna according to one embodiment. The electronic device may comprise: an antenna disposed on a substrate disposed inside the electronic device and operable to resonate in a plurality of frequency bands; and a feeding unit disposed on the substrate and composed of a feeding line feeding a signal to the antenna and a ground line operating as a ground. The antenna may comprise: a first radiator in which a first metal pattern connected to the feeding line and a second metal pattern connected to the ground line are formed in a first axial direction of the substrate; and a second radiator in which a third metal pattern connected to the feeding line is formed in a second axial direction of the substrate.

Provided is an electronic device having an antenna according to one embodiment. The electronic device may comprise: an antenna disposed on a substrate disposed inside the electronic device and operable to resonate in a plurality of frequency bands; and a feeding unit disposed on the substrate and composed of a feeding line feeding a signal to the antenna and a ground line operating as a ground. The antenna may comprise: a first radiator in which a first metal pattern connected to the feeding line and a second metal pattern connected to the ground line are formed in a first axial direction of the substrate; and a second radiator in which a third metal pattern connected to the feeding line is formed in a second axial direction of the substrate.

This document describes techniques and systems of a radar system with sequential two-dimensional (2D) angle estimation. The radar system can efficiently estimate angles in two dimensions for detections. For example, a radar system includes a processor and an antenna that can receive electromagnetic energy reflected by one or more objects. The antenna includes a 2D array that includes antenna elements positioned in a first dimension and a second dimension. The processor can determine, using electromagnetic energy received by the 2D array, first angles in the first dimension associated with a detection of the one or more objects. The processor can then steer the 2D array to the first angle to generate a steered 1D array for each first angle. Using the steered 1D array, the processor can determine second angles associated with the first angle for the detection.

A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

An antenna device according to an embodiment includes a dielectric layer including a high transmittance area and a low transmittance area, and an antenna unit disposed on the dielectric layer. The antenna unit includes a radiator disposed on the high transmittance area of the dielectric layer and having a mesh structure, a signal pad disposed on the low transmittance area of the dielectric layer and having a solid pattern structure, and an impedance matching pattern connecting the radiator and the signal pad on the low transmittance area of the dielectric layer. The impedance matching pattern has a larger width than that of the signal pad and has a solid pattern structure.

A package board according to an embodiment of the present disclosure includes a first core layer, a feeding wiring disposed on the first core layer, and a first connector mounted on the first core layer and electrically connected to the feeding wiring through a row directional side thereof The feeding wiring includes a first portion extending in a column direction of the first core layer and a second portion bent from the first portion to extend in a row direction of the first core layer.

A package board according to an embodiment of the present disclosure includes a first core layer, a feeding wiring disposed on the first core layer, and a first connector mounted on the first core layer and electrically connected to the feeding wiring through a row directional side thereof The feeding wiring includes a first portion extending in a column direction of the first core layer and a second portion bent from the first portion to extend in a row direction of the first core layer.