Patent classifications
H01R4/025
Surface Mount Contact, Electronic Device Assembly, and Test Probe Pin Tool
A surface mount contact (100) for coupling to an electronic device (200, 300), comprising: a conductive pin (10) having an elongated pin body (12), the pin body (12) comprising a first end (122) and a second end (124) opposing to the first end (122); and a heat re-flowable bonding member (20) coupled to the first end (122); wherein the pin body (12) is integrally provided with a support portion (14) in a region of the pin body (12) adjacent to the heat re-flowable bonding member (20). The cost and time of manufacture is reduced.
GLASS PLATE MODULE
A glass plate module according to the present invention includes a glass plate, an electrically conductive layer laminated on the glass plate, at least one connection terminal fixed to the electrically conductive layer and made of an electrically conductive material, and lead-free solder for fixing the connection terminal to the electrically conductive layer. The connection terminal includes an installation portion that is fixed to the electrically conductive layer via the lead-free solder, a standing portion that extends from an end portion of the installation portion in a direction away from the glass plate, and a connection portion that is coupled to an end portion of the standing portion on the opposite side to the installation portion and extends in a direction away from the installation portion along a surface direction of the glass plate.
METHOD FOR PRODUCING A SOLDERED CONNECTION, ELECTRICAL PLUG-IN CONNECTOR FOR SOLDERING TO A COAXIAL CABLE AND USE OF SUCH A PLUG-IN CONNECTOR
A method for producing a soldered connection between at least two components is provided, in which the components are heated for melting a solder in a soldering area. The heating of the soldering area and/or the supply of solder to the soldering area is realized depending on the temperature which is determined by non-contact detection of heat radiation emitted from at least one temperature measurement zone of one of the components. In order to improve the method such that the emissivity of the at least one temperature measurement zone can be increased with high process reliability and with at most a slight adverse effect on the electrical connection between the electrical components, it is proposed that the at least one temperature measurement zone be locally heated for increasing its emissivity. Furthermore, an electrical plug-in connector for producing a soldered connection and use of such a plug-in connector are proposed.
EXOTHERMIC AND MECHANICAL ELECTRICAL CONNECTOR
An electrical connector includes an electrically conductive connector having a mechanical connector for removably receiving a conductor. The mechanical connector includes a translatable clamping member and a threaded portion. An arm extends from the electrically conductive connector. A component is connected to the arm at an interface. The interface includes an exothermic weld.
Vehicle window glass with metal terminal
A vehicle window glass with a metal terminal includes a glass plate, a conductor disposed on at least one of principal surfaces of the glass plate, and a metal terminal electrically connected to the conductor via solders. The metal terminal includes a connection portion; a first leg portion connected to the connection portion; a first base portion connected to the first leg portion; a second leg portion connected to the connection portion; a second base portion connected to the second leg portion; and a lead wire connection portion connected to the connection portion and including a rising portion and a bent portion connected to the rising portion, and a fixing portion connected to the bent portion and configured to be connected to a lead wire.