An electrical connector includes an insulating body, and multiple terminals accommodated therein. Each terminal has a connecting portion, two side portions bending backward and extending from left and right sides of the connecting portion, two extending portions provided opposite to each other and extending downward from the two side portions, and two embracing arms connected to lower ends of the two extending portions. The two embracing arms jointly embrace a solder ball, which has a first vertical central plane in a front-rear direction. The two embracing arms are located on two sides of the first vertical central plane. A distance between the front ends of the two embracing arms is less than a distance between the rear ends of the two embracing arms of each terminal. The front ends of the two embracing arms are attached with solder liquid formed by melting of the solder ball during soldering.

An electrical connector includes an insulating body and multiple terminals accommodated in the insulating body. Each terminal has a base portion, a strip connecting portion extending upward from the base portion to be connected to a strip, and an elastic arm extending from the base portion. The elastic arm has a first tearing edge torn from the strip connecting portion, a second tearing edge torn from the strip, and a blanking edge blanked from the strip. The second tearing edge or the blanking edge has a dividing point. When each terminal is connected to the strip and expanded in a same vertical plane, the dividing point and a top point of the first tearing edge are vertically aligned. After the elastic arm is formed by bending, the dividing point and the first tearing edge are both located at a back side of the strip connecting portion.

A contact includes a thin plate member having elasticity and conductivity, is disposed between a first member and a second member, and electrically connects the first member and the second member via the thin plate member, and the contact includes a base portion and a movable portion. The base portion has a bonding surface to be bonded to the first member by soldering. The movable portion includes: a contact portion that contacts with the second member; and a connecting portion that connects to the base portion, and is configured to be elastically deformable with respect to the base portion. The connecting portion is gradually separated from the first member. A predetermined range from a connecting position of the connecting portion with the base portion is lower in solder wettability than the bonding surface.

A surface mount connector in which an internal terminal does not extend to a location outside an external terminal is provided. A surface mount connector includes an external terminal that includes a tubular portion that extends in a first direction, an internal terminal that is separated from the external terminal inside the tubular portion when viewed in the first direction, and an insulator that is disposed between the internal terminal and the external terminal and that has a first main surface and a second main surface opposite the first main surface. The insulator inside the tubular portion has a through-hole that extends from the first main surface to the second main surface.

Provided is a soldering method for soldering a tip end of an electric wire to a soldering portion of a metallic terminal which allows the soldering to be performed with excellent workability. The method includes a damming structure forming step forming a damming structure at a periphery of the soldering portion to dam a solder which is supplied in a molten state with a flux to the soldering portion to keep the solder at the soldering portion, an electric wire setting step setting the tip end of the electric wire at the soldering portion ready for soldering, and a solder supplying step supplying the solder in the molten state with the flux to the soldering portion to perform the soldering.

A terminal 20 includes a terminal connection portion 21 connected to a counterpart terminal and a board connection portion 24 connected to a conductive path 13 of a board 11. The board connection portion 24 has a plate shape portion 25 that is a plate shape. The plate shape portion is disposed behind the terminal connection portion 21 and is soldered to the conductive path 13 of the board 11. The board connection portion has a plate-shape first projection walls 28A to 28D that are bent from edge portions of a lateral direction side of the plate shape portion 25 and that project to an opposite side to the board 11 side. The plate shape portion 25 and the first projection walls 28A to 28D have a plating layer 37 that is formed on a plate surface of the plate shape portion and the first projection walls.

A surface mount connector in which an internal terminal does not extend to a location outside an external terminal is provided. A surface mount connector includes an external terminal that includes a tubular portion that extends in a first direction, an internal terminal that is separated from the external terminal inside the tubular portion when viewed in the first direction, and an insulator that is disposed between the internal terminal and the external terminal and that has a first main surface and a second main surface opposite the first main surface. The insulator inside the tubular portion has a through-hole that extends from the first main surface to the second main surface.

A contact includes a thin plate member having elasticity and conductivity, is disposed between a first member and a second member, and electrically connects the first member and the second member via the thin plate member, and the contact includes a base portion and a movable portion. The base portion has a bonding surface to be bonded to the first member by soldering. The movable portion includes: a contact portion that contacts with the second member; and a connecting portion that connects to the base portion, and is configured to be elastically deformable with respect to the base portion. The connecting portion is gradually separated from the first member. A predetermined range from a connecting position of the connecting portion with the base portion is lower in solder wettability than the bonding surface.

A method of manufacturing an insulated superconducting wire material comprising the steps of: removing a flux (S01) by heating a superconducting wire material at a temperature equals to or higher than a flux volatilization temperature and equals to or lower than a heatproof temperature of the superconducting wire material, the superconducting wire material comprising a channel with a channel groove and a superconducting core wire material accommodated in the channel groove of the channel, and the channel groove and the superconducting core wire material being bonded with a solder including the flux; and forming an insulated superconducting wire material (S02) of forming an insulating film on a surface of the superconducting wire material.

An electrical spring contact is provided. The electrical spring contact includes a connection portion configured to couple the electrical spring contact to a printed circuit board, a bulge portion, a bend portion having a substantially U-shaped configuration, and an inclined portion extending from the bend portion at an angle relative to a plane that is substantially parallel to the connection portion. The connection portion, the bulge portion, the bend portion, and the inclined portion are formed from a single conductive contact material.