A mechanical grounding clamp includes a body, having an upper plate defining a threaded hole therethrough and having an outer surface, a lower plate spaced apart from the upper plate and having an inner surface, and a connecting plate connecting the upper plate to the lower plate, a set screw mateable with the threaded hole in the upper plate and having a proximal end and a distal end, the distal end extendable through the threaded hole of the upper plate and toward the inner surface of the lower plate. There may be a nut on the set screw for driving toward the upper plate to secure a grounding conductor to the body.

A touch protected busbar system (TP-BSYS) comprising at least one hybrid busbar (1) having a current-carrying rail profile (2) and a contact-receiving rail profile (3) providing contact openings (4) configured to receive protruding electrical contacts (6) of electrical devices (ED-A) to be connected to said touch protected busbar system (TP-BSYS), wherein the at least one hybrid busbar (1) is at least partially covered by electrical isolating touch protection elements (TPE) of said touch protected busbar system (TP-BSYS) and/or at least partially encapsulated by an electrical isolating layer.

A touch protected busbar system (TP-BSYS) comprising at least one hybrid busbar (1) having a current-carrying rail profile (2) and a contact-receiving rail profile (3) providing contact openings (4) configured to receive protruding electrical contacts (6) of electrical devices (ED-A) to be connected to said touch protected busbar system (TP-BSYS), wherein the at least one hybrid busbar (1) is at least partially covered by electrical isolating touch protection elements (TPE) of said touch protected busbar system (TP-BSYS) and/or at least partially encapsulated by an electrical isolating layer.

A copper busbar has at least one stepped hole for fastening a cable shoe vi a screw connection. The stepped hole extends from a first surface of the copper busbar to a second surface of the copper busbar. The stepped hole has at least a first region, a second region and a third region, wherein the first region of the stepped hole adjoins the first surface, with a radius of the stepped hole being constant over the length of the second region with the second radius value. The third region adjoins the second surface, wherein the third region has at least at the second surface a radius with a third radius value which is less than the second radius value.

A copper busbar has at least one stepped hole for fastening a cable shoe vi a screw connection. The stepped hole extends from a first surface of the copper busbar to a second surface of the copper busbar. The stepped hole has at least a first region, a second region and a third region, wherein the first region of the stepped hole adjoins the first surface, with a radius of the stepped hole being constant over the length of the second region with the second radius value. The third region adjoins the second surface, wherein the third region has at least at the second surface a radius with a third radius value which is less than the second radius value.

A branching circuit body includes a first electric wire, a first shield tube which covers the first electric wire, a second electric wire which is electrically connected to the first electric wire and drawn out through an opening formed in the first shield tube, a second shield tube which covers the second electric wire and has an end portion inserted into the opening, and a coupling band for joining the second shield tube to the first shield tube.

A hybrid busbar (1) for a busbar system, said hybrid busbar (1) comprising a current carrying rail profile (2) adapted to carry an electrical current with a predefined high current amplitude and at least one contact receiving rail profile (3) having a plurality of equally spaced contact openings (4) configured to receive protruding electrical contacts (6) of electrical devices (ED-A) to be connected to said busbar system, wherein the current carrying rail profile (2) and the contact receiving rail profile (3) are connected with each other to form said hybrid busbar (1) providing at least one bounding geometry with a rectangular cross section (CS), wherein the hybrid busbar (1) can be engaged from behind by hook-shaped mounting latches (7) of electrical devices (ED-B) to be connected to said busbar system.

A hybrid busbar (1) for a busbar system, said hybrid busbar (1) comprising a current carrying rail profile (2) adapted to carry an electrical current with a predefined high current amplitude and at least one contact receiving rail profile (3) having a plurality of equally spaced contact openings (4) configured to receive protruding electrical contacts (6) of electrical devices (ED-A) to be connected to said busbar system, wherein the current carrying rail profile (2) and the contact receiving rail profile (3) are connected with each other to form said hybrid busbar (1) providing at least one bounding geometry with a rectangular cross section (CS), wherein the hybrid busbar (1) can be engaged from behind by hook-shaped mounting latches (7) of electrical devices (ED-B) to be connected to said busbar system.

Provided is an electronic component (13) that can be miniaturized while including a cooling structure. The electronic component includes an electronic component main body (13a), a bus bar (31) arranged inside the electronic component main body, and a heat dissipating member (40) embedded in the electronic component main body and having one end face thermally in contact with the bus bar and the other end face exposed to an outside of the electronic component main body.

Provided is an electronic component (13) that can be miniaturized while including a cooling structure. The electronic component includes an electronic component main body (13a), a bus bar (31) arranged inside the electronic component main body, and a heat dissipating member (40) embedded in the electronic component main body and having one end face thermally in contact with the bus bar and the other end face exposed to an outside of the electronic component main body.