A connection system for a quantum computer that employs constant impedance connectors with attenuation or filtering components or both embedded therein or within an adaptor removably insertable within an adaptor housing for use in a cryogenically cooled quantum computer. The connection system provides a higher density of cables traversing through a hermetic sealed top plate, and which are accessible to chill blocks to reduce the thermal energy from the signal lines. Attenuators or filter circuits are embedded in the constant impedance connector housings, or provided in adaptors that connect on each end to form mating constant impedance connections, in order to reduce signal strength as the signal progresses through the cryogenic environment and to remove extraneous electrical signal noise.

A connector assembly of two low temperature superconducting cable terminals and manufacturing method thereof. A connector assembly comprises a copper layer having one side which is conducted with one low temperature superconducting cable and another side which is conducted with another low temperature superconducting cable, two welding material layers, wherein each the welding material layer is provided between the copper layer and either of the two low temperature superconducting cable, and a clip mechanism covered the outer surface of either of the low temperature superconducting cable to tightly clamp the copper layer, the two welding material layers and the two low temperature superconducting cable form the inside to the outside of the connector assembly. The connector assembly of the present invention has compact structure. The saddle-shaped copper block is compressed by a clamp mechanism is use to weld with two low temperature superconducting terminals.

A connector assembly of two low temperature superconducting cable terminals and manufacturing method thereof. A connector assembly comprises a copper layer having one side which is conducted with one low temperature superconducting cable and another side which is conducted with another low temperature superconducting cable, two welding material layers, wherein each the welding material layer is provided between the copper layer and either of the two low temperature superconducting cable, and a clip mechanism covered the outer surface of either of the low temperature superconducting cable to tightly clamp the copper layer, the two welding material layers and the two low temperature superconducting cable form the inside to the outside of the connector assembly. The connector assembly of the present invention has compact structure. The saddle-shaped copper block is compressed by a clamp mechanism is use to weld with two low temperature superconducting terminals.

According to a first aspect of the present invention, there is provided a method of forming a superconducting joint between ReBCO tapes. Two or more ReBCO tapes are provided, each having an exposed ReBCO region. A bridge is provided, comprising an exposed ReBCO layer and an oxygen-permeable backing on the exposed ReBCO layer. Each exposed ReBCO region is bonded to the exposed ReBCO layer of the bridge by heating to a first temperature (T1) in an environment where the partial pressure of oxygen is sufficiently low that the melting point of the ReBCO (T.sub.R) is less than the melting point of silver (T.sub.Ag), the temperature (T1) being between the melting point of the ReBCO (T.sub.R) and the melting point of silver (T.sub.Ag), (T.sub.R<T1<T.sub.Ag). The resulting joint is annealed at a second temperature (T2) which is less than the melting point of ReBCO (T.sub.R) (T2<T.sub.R), for a time (t), in an environment where the partial pressure of oxygen is sufficient to reoxygenate the ReBCO at the second temperature (T2).

According to a first aspect of the present invention, there is provided a method of forming a superconducting joint between ReBCO tapes. Two or more ReBCO tapes are provided, each having an exposed ReBCO region. A bridge is provided, comprising an exposed ReBCO layer and an oxygen-permeable backing on the exposed ReBCO layer. Each exposed ReBCO region is bonded to the exposed ReBCO layer of the bridge by heating to a first temperature (T1) in an environment where the partial pressure of oxygen is sufficiently low that the melting point of the ReBCO (T.sub.R) is less than the melting point of silver (T.sub.Ag), the temperature (T1) being between the melting point of the ReBCO (T.sub.R) and the melting point of silver (T.sub.Ag), (T.sub.R<T1<T.sub.Ag). The resulting joint is annealed at a second temperature (T2) which is less than the melting point of ReBCO (T.sub.R) (T2<T.sub.R), for a time (t), in an environment where the partial pressure of oxygen is sufficient to reoxygenate the ReBCO at the second temperature (T2).

Superconducting interconnects with ultra-low thermal conductivity capable of providing a direct connection between a millikelvin temperature environment and a 70 K temperature environment.

Superconducting interconnects with ultra-low thermal conductivity capable of providing a direct connection between a millikelvin temperature environment and a 70 K temperature environment.

A superconductive conductor and method of using the superconductive conductor is described. The superconductive conductor includes a plurality of first conductive strips with a first width and a plurality of second conductive strips with a second width, and a strip stack formed from the first and second conductive strips that has a cruciform-shaped cross section.

A superconductive conductor and method of using the superconductive conductor is described. The superconductive conductor includes a plurality of first conductive strips with a first width and a plurality of second conductive strips with a second width, and a strip stack formed from the first and second conductive strips that has a cruciform-shaped cross section.

Superconducting articles are disclosed which comprise at least two superconducting tapes (10, 20), each tape comprising a stabilizer layer (15, 25), a superconductor layer (13, 23), and a buffer layer (12, 22) formed in that order on a substrate (11, 21), and at least one metal tape (1) attached to the superconducting tapes via a solder layer (2) along at least twice the length of a joint region where the two superconducting tapes overlap or are overlapped by a bridge (30).