A connection structure of the present disclosure includes first and second superconducting wires that are two superconducting wires each having a substrate in a tape shape, an intermediate layer formed on the substrate, and a superconductor layer formed on the intermediate layer, a connecting superconductor layer that connects the first and second superconducting wires in a positional relationship in which surfaces of the superconductor layers face each other, and forms a superconducting connecting section together with the first and second superconducting wires, two protective members each having a width larger than a width of the first and second superconducting wires and disposed on substrates sides of the first and second superconducting wires in a positional relationship of sandwiching the superconducting connecting section, and a metal part that joins the two protective members to each other.

A connection structure of superconducting wires includes a plurality of superconducting wires are overlapped and connected with each other, each of the plurality of superconducting wires including a substrate and a superconducting layer that are laminated. A non-superconductor is provided at a part of a surface of the superconducting layer of at least one of the superconducting wires and protrudes from the surface.

A connection structure of superconducting wires includes a plurality of superconducting wires are overlapped and connected with each other, each of the plurality of superconducting wires including a substrate and a superconducting layer that are laminated. A non-superconductor is provided at a part of a surface of the superconducting layer of at least one of the superconducting wires and protrudes from the surface.

A connecting structure of an oxide superconducting wire includes a pair of oxide superconducting wires, tip surfaces of the pair of oxide superconducting wire being disposed to face to each other; a first surface-connecting superconducting wire configured to transit and connect the pair of oxide superconducting wires; and a second surface transit connector configured to transit and connect the pair of oxide superconducting wires, wherein tensile strength of joining sections between the second surface transit connector and the pair of oxide superconducting wires is higher than tensile strength of joining sections between the first surface-connecting superconducting wire and the pair of oxide superconducting wires.

A connecting structure of an oxide superconducting wire includes a pair of oxide superconducting wires, tip surfaces of the pair of oxide superconducting wire being disposed to face to each other; a first surface-connecting superconducting wire configured to transit and connect the pair of oxide superconducting wires; and a second surface transit connector configured to transit and connect the pair of oxide superconducting wires, wherein tensile strength of joining sections between the second surface transit connector and the pair of oxide superconducting wires is higher than tensile strength of joining sections between the first surface-connecting superconducting wire and the pair of oxide superconducting wires.

The embodiments herein describe technologies of cryogenic digital systems with a power supply located in an ambient temperature domain and logic located in a cryogenic temperature domain. A pair of conductors is operable to carry current with a voltage difference between the power supply and the logic. The pair of conductors includes a first portion thermally coupled to a temperature-regulated or temperature-controlled intermediate temperature domain. The intermediate temperature domain is less than the ambient temperature domain and greater than the cryogenic temperature domain.

A superconducting circuit includes a photon detector component, a second component, and a multi-taper superconducting connector shaped to reduce current crowding, the superconducting connector electrically connecting the photon detector component and the second component. The multi-taper superconducting connector includes a first taper arranged adjacent the photon detector component and a second taper arranged adjacent the second component.

Provided is a connection structure for superconductor wires, in which two superconductor wires include respective oxide superconducting conductor layers each formed on one surface of a base material. The oxide superconducting conductor layers are conjoined with each other while facing each other at a connected end of each of the two superconductor wires. An embedment material for reinforcement is provided from one of the two superconductor wires to the other one of the two superconductor wires in a thickness direction of the two superconductor wires at the connected end of each of the two superconductor wires.

Provided is a connection structure for superconductor wires, in which two superconductor wires include respective oxide superconducting conductor layers each formed on one surface of a base material. The oxide superconducting conductor layers are conjoined with each other while facing each other at a connected end of each of the two superconductor wires. An embedment material for reinforcement is provided from one of the two superconductor wires to the other one of the two superconductor wires in a thickness direction of the two superconductor wires at the connected end of each of the two superconductor wires.

A signal connection system that employs constant impedance connectors with attenuation or filtering components or both embedded therein or within an adaptor removably insertable within an adaptor housing. The connection system provides a higher density of cables traversing through a hermetic sealed top plate, and which are accessible to chill blocks to reduce the thermal energy from the signal lines. Attenuators or filter circuits are embedded in constant impedance connector header housings, or provided in adaptors that connect on each end to form mating constant impedance connections, in order to reduce signal strength as the signal progresses through the connection system and to remove extraneous electrical signal noise.