A contact-making device (10) is used for a resistance measurement on a test object (30). The test object (30) comprises a threaded hole (31), which has an internal thread (32). The contact-making device (10) is designed to be mechanically coupled to the internal thread (32) of the threaded hole (31). The contact-making device (10) comprises a first contact (11) and a second contact (12), in order to make electrical contact with the test object (30) at, at least, two points when the contact-making device (10) is mechanically coupled to the internal thread (32). The first contact (11) and the second contact (12) are electrically insulated from one another by an insulating material (15-17) in the contact-making device (10).

A contact-making device (10) is used for a resistance measurement on a test object (30). The test object (30) comprises a threaded hole (31), which has an internal thread (32). The contact-making device (10) is designed to be mechanically coupled to the internal thread (32) of the threaded hole (31). The contact-making device (10) comprises a first contact (11) and a second contact (12), in order to make electrical contact with the test object (30) at, at least, two points when the contact-making device (10) is mechanically coupled to the internal thread (32). The first contact (11) and the second contact (12) are electrically insulated from one another by an insulating material (15-17) in the contact-making device (10).

Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Apparatus and methods for inserting and retention testing an electrically conductive contact in an electrical connector. The method includes the following steps: manually partially inserting the contact into a hole formed inside the electrical connector; inserting the contact further into the hole by pushing the contact along an axis using an insertion tip that is aligned with the axis and that displaces in a first direction along the axis during inserting; and after inserting the contact further into the hole, testing retention of the contact inside the electrical connector by pushing the contact along the axis using a test probe that is aligned with the axis and that displaces in a second direction opposite to the first direction during retention testing. The force exerted by the test probe on the contact is less than a specified contact retention force. The method further includes generating an alert signal if the test probe displaces along the axis in the second direction by more than a specified distance during retention testing.

A probe structure for inspecting characteristics of a connector having at least one terminal includes a plunger, a coaxial probe, a flange, a housing, and a spring. A first end portion of the housing and the flange are configured to restrict rotation of the housing in the circumferential direction in a state in which the first end portion of the housing is fitted into the through-hole of the flange. Thus, inspection of characteristics of the terminal of the connector can be performed with higher accuracy.

A coaxial connector includes a connector front end connectable with a circuit board and a connector rear end connectable with a coaxial cable. An outer conductor arrangement connectable with an outer conductor of a coaxial cable at the connector rear end, which has a compensator means arranged at the connector front end and has at least one cup spring having a contacting zone configured to contact a contact face of a circuit board to establish an electrical interconnection between the outer conductor arrangement and the contact face. The cup spring has a center aperture that is at least partially encircled by the contacting zone. An inner conductor arrangement includes a contacting tip configured to contact a contacting point of a circuit board via the center aperture of the compensator means to establish an electrical contact between the inner conductor and the contacting point.

Disclosed herein are connection systems for establishing electrical connections across a sterile field. An example connection system includes a sensor connector, a probe connector, and a tether having a first end connected to the sensor connector and a second end connected to the probe connector. The sensor connector includes a piercing element. The piercing element is configured to pierce a sterile side of a drape and establish a first electrical connection with a receptacle of a sensor when the piercing element is inserted into the receptacle. The probe connector includes a probe-connecting means configured for a user to establish a second electrical connection between an electrical contact of the probe connector and a wire probe. The tether is configured to convey electrical signals between the sensor connector and the probe connector. Also disclosed herein are methods of connection systems for establishing electrical connections across a sterile field.

An electrically insulative pusher pin is disclosed. In one example, an electrically insulative pusher pin includes a first plunger member, a second plunger member, and a spring. The first plunger member has a first end and an exposed second end. The second plunger member has a first end and an exposed second end. The second plunger member is movable relative to the first plunger member, where the exposed second ends of the first and second plunger members defining a length of the pusher pin. The spring disposed between the first ends of the first and second plunger members and biases the exposed second end of the first plunger member away from the exposed second end of the second plunger member. An electrically insulative path is defined between the exposed second end of the first plunger member and the exposed second end of the second plunger member through the pusher pin.

A jumper with safety fuse. The jumper includes first and second conducting wires and a fuse assembly interposed therebetween and connected thereto. A connector assembly is connected to each of the first and second conducting wires, which includes a plug section and a receptacle section. The plug section includes a body, a lead connector extending from a top of the body, and a plug extending from a base of the body. The receptacle section includes a socket configured to receive the plug and conduct electricity to its corresponding conducting wire, thereby forming an electrical connection therebetween. The jumper may be provided in a jumper kit with jumpers of different gauges and a set of interchangeable lead connectors.