H01R12/51

ELECTRICAL UNIT

An electrical unit may include a circuit board, a plurality of first terminals having respective first tabs fixed to the circuit board, a plurality of second terminals having respective second tabs fixed to the circuit board, the second tabs offset from the first tabs in a first direction and a second direction, and/or a terminal housing disposed over the plurality of first terminals and the plurality of second terminals, and connected to the circuit board. A method of assembling an electrical unit may include connecting first tabs with the circuit board, connecting second tabs with the circuit board such that each second tab is at least partially offset from each of the first tabs the plurality of first terminals in a first direction and a second direction, and/or disposing the terminal housing over the first and second terminals.

Housing for wire to board connector

The present disclosure provides a housing for wire to board connectors. The housing comprises a main body, a first end cover, and a second end cover. The main body comprises an accommodating groove, the bottom of which is provided with a plurality of terminal openings disposed at intervals. A terminal module is disposed in the accommodating groove. A plurality of terminal groups are respectively inserted into the corresponding terminal openings. The first end cover disposed on one end edge of the main body comprises a plurality of first partition parts disposed at intervals. The second end cover disposed on the other end edge of the main body comprises a plurality of second partition parts disposed at intervals, and is opposite to the first end cover. The plurality of second partition parts and the plurality of first partition parts are alternately disposed.

SEPARATOR ASSEMBLY, BATTERY MODULE, BATTERY PACK, APARATUS AND MANUFACTURING METHOD

The application provides a separator assembly, a battery module, a battery pack, an apparatus, and a manufacturing method. The separator assembly includes: an insulating plate, a circuit board arranged on the insulating plate, busbars arranged on the insulating plate on at least one side of the circuit board, and connection sheets connected between the busbars and the circuit board. The connection sheets include an upper connection sheet and a lower connection sheet. The insulating plate includes a first surface and a second surface opposite to each other. The upper connection sheet is arranged on the first surface, and the insulating plate and the lower connection sheet are arranged to be at least partially overlapped in the height direction of the separator assembly, and at least a portion of the lower connection sheet is arranged on the second surface.

SEPARATOR ASSEMBLY, BATTERY MODULE, BATTERY PACK, APARATUS AND MANUFACTURING METHOD

The application provides a separator assembly, a battery module, a battery pack, an apparatus, and a manufacturing method. The separator assembly includes: an insulating plate, a circuit board arranged on the insulating plate, busbars arranged on the insulating plate on at least one side of the circuit board, and connection sheets connected between the busbars and the circuit board. The connection sheets include an upper connection sheet and a lower connection sheet. The insulating plate includes a first surface and a second surface opposite to each other. The upper connection sheet is arranged on the first surface, and the insulating plate and the lower connection sheet are arranged to be at least partially overlapped in the height direction of the separator assembly, and at least a portion of the lower connection sheet is arranged on the second surface.

CONNECTOR WITH INSULATING ASSEMBLY FOR PROVIDING MUTUAL INSULATION AMONG CONNECTING PINS
20220115801 · 2022-04-14 ·

Disclosed is a connector including at least: a printed circuit board including preferentially a plurality of stacked layers; a plurality of connecting pins which are spaced apart from each other and transversally pass through the printed circuit board from a bottom external surface up to an opposite top external surface of the printed circuit board; and an insulating assembly for providing insulation among the plurality of connecting pins, wherein the insulating assembly includes at least one insulator which is configured to be coupled to the printed circuit board and is configured to insulate at least a portion of each connection pin from a corresponding portion of one or more adjacent connecting pins of the plurality of connecting pins.

CONNECTOR WITH INSULATING ASSEMBLY FOR PROVIDING MUTUAL INSULATION AMONG CONNECTING PINS
20220115801 · 2022-04-14 ·

Disclosed is a connector including at least: a printed circuit board including preferentially a plurality of stacked layers; a plurality of connecting pins which are spaced apart from each other and transversally pass through the printed circuit board from a bottom external surface up to an opposite top external surface of the printed circuit board; and an insulating assembly for providing insulation among the plurality of connecting pins, wherein the insulating assembly includes at least one insulator which is configured to be coupled to the printed circuit board and is configured to insulate at least a portion of each connection pin from a corresponding portion of one or more adjacent connecting pins of the plurality of connecting pins.

Wire to board connector

The present disclosure provides a wire to board connector. The wire to board connector comprises a body, a plurality of sheet-shaped insulating bodies, a plurality of first covers, and a plurality of second covers. The body comprises an accommodating groove. The sheet insulating bodies are arranged in the accommodating groove in parallel along a first direction. Each of the sheet insulating bodies is provided with a plurality of terminal groups and a plurality of cables corresponding to the terminal groups. The plurality of terminal groups is disposed along a second direction. The first direction is perpendicular to the second direction. The plurality of first covers correspond to the plurality of second covers. The corresponding first cover and second cover respectively cover the opposite sides of the corresponding sheet-shaped insulating body in the first direction.

HARNESS COMPONENT
20220069488 · 2022-03-03 ·

A harness component includes a plurality of male terminals, a housing, a plurality of female terminals and a plurality of wires. The plurality of male terminals are connected to a circuit board. The housing includes a plurality of insertion holes and a plurality of female terminal accommodation holes. The male terminals are inserted through the insertion holes. The terminal accommodation holes communicate with the respective insertion holes and include openings on sides opposite to the insertion holes. The plurality of female terminals are inserted and arranged in the respective terminal accommodation holes through the respective openings. The female terminal contacts each male terminal while applying a resilient force in a direction intersecting an axial direction X of the terminal accommodation hole. The plurality of wires are electrically connected to the respective female terminals.

Power semiconductor device and manufacturing method thereof, and power conversion device

The object is to provide a technology capable of increasing the reliability of a power semiconductor device. A power semiconductor device includes: a substrate including an insulating layer and a circuit pattern that are disposed in this order; a power semiconductor element electrically connected to the circuit pattern; and an electrode terminal having a thinned portion including a welded portion welded to the circuit pattern by a fiber laser. A thickness of the circuit pattern is not less than 0.2 and not more than 0.5 mm, and a thickness of the thinned portion of the electrode terminal is not less than one time and not more than two times the thickness of the circuit pattern.

Power semiconductor device and manufacturing method thereof, and power conversion device

The object is to provide a technology capable of increasing the reliability of a power semiconductor device. A power semiconductor device includes: a substrate including an insulating layer and a circuit pattern that are disposed in this order; a power semiconductor element electrically connected to the circuit pattern; and an electrode terminal having a thinned portion including a welded portion welded to the circuit pattern by a fiber laser. A thickness of the circuit pattern is not less than 0.2 and not more than 0.5 mm, and a thickness of the thinned portion of the electrode terminal is not less than one time and not more than two times the thickness of the circuit pattern.