H01R13/03

Stud assembly for high current applications

The subject disclosure relates to a water-tight sealed stud assembly for high current applications. The water-tight sealed stud assembly can include a stud, a sealing ring, a sleeve, and a body. The stud may have a stud base and a thickened portion having an annular groove. The sealing ring may be disposed in the annular groove. The sleeve may be disposed circumferentially around the stud and made of a conductive material. The body may be disposed circumferentially around the sleeve and made of a non-conductive material. Systems and methods are also provided.

HIGH VOLTAGE (HV) TERMINAL FRAME

A two-piece high voltage (HV) terminal frame having a terminal frame and a contact spring. The terminal frame includes at least a top portion, a bottom portion, and a middle portion forming an opening for receiving a first bus bar and a second bus bar. The contact spring is configured to engage the top portion of the terminal frame, wherein the contact spring includes a spring portion that extends into the opening of the terminal frame.

INTEGRATED CONNECTOR PORT MODULE
20220359999 · 2022-11-10 ·

A connector port module and a method of manufacturing the same. The connector port module includes a circuit board, with a connector having a plurality of connector pads formed on the circuit board configured to electrically connect to a mating connector. At least one via hole is formed in the circuit board for reinforcing the physical integrity and the heat diffusivity of the circuit board. The connector port module is capable of supporting Universal Serial Bus (USB) (e.g. USB-C) and Thunderbolt 3 connectors. The method includes: providing a circuit board; forming a plurality of connector pads on the circuit board configured to electrically connect to a mating connector; and forming at least one via hole for reinforcing physical integrity of the circuit board.

Modular high-current connector

A modular high-current connector (1) has a first housing part (7) and a second housing part (8) connected thereto. The high-current connector (1) has a pin contact (9), the pin contact (9) being substantially cylindrical and having a connection region (A′) and a contact region (K′) for making electrical contact with a device socket or a mating connector. The contact region (K′) of the pin contact (9) projects out of the high-current connector (1) on the plug-in side.

Modular high-current connector

A modular high-current connector (1) has a first housing part (7) and a second housing part (8) connected thereto. The high-current connector (1) has a pin contact (9), the pin contact (9) being substantially cylindrical and having a connection region (A′) and a contact region (K′) for making electrical contact with a device socket or a mating connector. The contact region (K′) of the pin contact (9) projects out of the high-current connector (1) on the plug-in side.

Tin-plated copper terminal material and method of manufacturing the same

A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 μm to 1.2 μm inclusive; the copper-tin alloy layer is a compound alloy layer in which Cu.sub.6Sn.sub.5 is a main ingredient and part of copper in the Cu.sub.6Sn.sub.5 is substituted with nickel, and an average crystal grain size is 0.2 μm to 1.5 μm inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 μm to 1000 μm inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.

Tin-plated copper terminal material and method of manufacturing the same

A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 μm to 1.2 μm inclusive; the copper-tin alloy layer is a compound alloy layer in which Cu.sub.6Sn.sub.5 is a main ingredient and part of copper in the Cu.sub.6Sn.sub.5 is substituted with nickel, and an average crystal grain size is 0.2 μm to 1.5 μm inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 μm to 1000 μm inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.

Metal Body, Fitting Connection Terminal, and Method for Forming Metal Body

Provided are a metal body that can be manufactured easily while whisker generation resulting from external stress is suppressed, a fitting connection terminal, and a method for forming the metal body. The metal body includes a barrier layer containing Ni as a main component formed on a metal substrate containing Cu as a main component, and a metal plating layer containing Sn as a main component formed directly on the barrier layer. An area ratio that is a ratio of the area of an intermetallic compound containing Sn and Cu in the metal plating layer to a cross section of the metal plating layer is 20% or less in the cross section of the metal body.

Metal Body, Fitting Connection Terminal, and Method for Forming Metal Body

Provided are a metal body that can be manufactured easily while whisker generation resulting from external stress is suppressed, a fitting connection terminal, and a method for forming the metal body. The metal body includes a barrier layer containing Ni as a main component formed on a metal substrate containing Cu as a main component, and a metal plating layer containing Sn as a main component formed directly on the barrier layer. An area ratio that is a ratio of the area of an intermetallic compound containing Sn and Cu in the metal plating layer to a cross section of the metal plating layer is 20% or less in the cross section of the metal body.

METALLIC PLUG CONNECTOR, AND METHOD AND DEVICE FOR PRODUCING A METALLIC PLUG CONNECTOR COMPONENT
20230095527 · 2023-03-30 ·

The invention relates to a metallic plug connector component (1), in particular an electrical contact element, or a support sleeve, of an electrical plug connector, having a main body (3) which has been coated with a coating (2) and which has been mechanically deformed in a processing portion (4). It is provided that a surface (6, 7) of the coating (2) in the processing portion (4) has a defined surface structure (8) at least in certain portions.