A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of electrical conductors removed in the machining process, resulting in a header with a high pin density. During the process of mating the first connector design to the edge-connect header, a plurality of wipers in the connector deflect, thereby causing the wipers to extend from the connector and contact the corresponding electrical conductors in the header. During the process of mating the second connector design to the edge-connect header, each of a plurality of wipers formed of low-mass, compliant metal wool, forms multiple contact points with a corresponding electrical conductor in the header.

A connector assembly comprising a shielding shell, a heat dissipating module and a clip. The shielding shell comprises a top wall and two side walls. The heat dissipating module comprises a thermal conducting plate which is provided to a top wall of the shielding shell. Side edges of the thermal conducting plate comprise rearward stopped portions toward the rear. The clip comprises an elastic pressing portion which presses against a top surface of the thermal conducting plate and outer side plates which are assembled to the corresponding side walls of the shielding shell. The outer side plate comprises a rearward displace limiting portion. The rearward displace limiting portion cooperates with the corresponding rearward stopped portion of the thermal conducting plate so as to limit relative displacement of the thermal conducting plate relative to the shielding shell toward the rear. Therefore, it may prevent the thermal conducting plate from disengaging.

An electrical connector assembly includes a seat unit and a cover unit. The seat unit defines a receiving cavity for receiving the CPU. The cover unit is pivotably mounted upon one end of the seat unit. The cover unit includes a first cover and a second cover surrounding the first cover. The first cover includes a first frame equipped with therein a floating heat sink which is located above and aligned with the receiving cavity. The heat sink forms a pair of side extensions sandwiched between a pair of pressing blocks and the first frame in a vertical direction and essentially downwardly pressed by the pair of pressing blocks of the first cover in a resilient manner. Resilient mechanism is provided between the pressing block and the heat sink to result in a downward force constantly urge the heat sink downwardly against the first frame.

An electromagnetic interference (EMI) grounding protection method for a connector assembly using a multi-directional conductive housing. The method includes the steps of: conducting the EMI generated by a source towards a metallic braided shield, the metallic braided shield being secured and mounted onto the multi-directional conductive housing by a metallic clamp; conducting the EMI from the metallic braided shield to the metallic clamp and to the multi-directional conductive housing, the multi-directional conductive housing being mounted onto a metallic device by at least a metallic bolt and the bolt being accommodated within a corresponding metallic compression limiter; and thereafter, conducting the EMI: (1) from the metallic braided shield to the multi-directional conductive housing through the metallic compression limiters and through their respective bolts, and ultimately to the metallic device, and (2) from the metallic braided shield to the multi-directional conductive housing directly through conductive pads thereof, and ultimately to the metallic device.

An electromagnetic interference (EMI) grounding protection method for a connector assembly using a multi-directional conductive housing. The method includes the steps of: conducting the EMI generated by a source towards a metallic braided shield, the metallic braided shield being secured and mounted onto the multi-directional conductive housing by a metallic clamp; conducting the EMI from the metallic braided shield to the metallic clamp and to the multi-directional conductive housing, the multi-directional conductive housing being mounted onto a metallic device by at least a metallic bolt and the bolt being accommodated within a corresponding metallic compression limiter; and thereafter, conducting the EMI: (1) from the metallic braided shield to the multi-directional conductive housing through the metallic compression limiters and through their respective bolts, and ultimately to the metallic device, and (2) from the metallic braided shield to the multi-directional conductive housing directly through conductive pads thereof, and ultimately to the metallic device.

It is aimed to improve anti-vibration performance. A connector includes a case made of metal and including an opening, and a terminal holding member made of synthetic resin for holding terminal fittings, the terminal holding member being integrated with the case while penetrating through the opening. The opening 18 includes a protruding portion protruding inward toward an outer periphery of the terminal holding member. The terminal holding member includes an inclination restricting portion to be held in contact with at least one of an outer surface and an inner surface of the protruding portion. Since the inclination restricting portion is in contact with the protruding portion, the inclination of the terminal holding member with respect to the case is suppressed even if the terminal holding member is subjected to vibration.

It is aimed to improve anti-vibration performance. A connector includes a case made of metal and including an opening, and a terminal holding member made of synthetic resin for holding terminal fittings, the terminal holding member being integrated with the case while penetrating through the opening. The opening 18 includes a protruding portion protruding inward toward an outer periphery of the terminal holding member. The terminal holding member includes an inclination restricting portion to be held in contact with at least one of an outer surface and an inner surface of the protruding portion. Since the inclination restricting portion is in contact with the protruding portion, the inclination of the terminal holding member with respect to the case is suppressed even if the terminal holding member is subjected to vibration.

A cooling device for a connector element includes a cooling channel through which a cooling fluid can flow during operation and a bearing element holding the cooling channel. The cooling channel is a component separate from the bearing element and has a shape of a hollow duct engaging around the bearing element at least in a part of a circumference of the bearing element.

A cooling device for a connector element includes a cooling channel through which a cooling fluid can flow during operation and a bearing element holding the cooling channel. The cooling channel is a component separate from the bearing element and has a shape of a hollow duct engaging around the bearing element at least in a part of a circumference of the bearing element.

An anti-vibration and heat dissipation structure for a memory socket includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board includes memory sockets for insertions of memory modules. The heat dissipation pads are disposed on upper and lower surfaces of memory modules, respectively, to upwardly conduct heat, generated by the memory modules to the topmost heat dissipation pad via a stack structure of the memory modules and the heat dissipation pads. The heat dissipation shell comprises a maintenance window, and a cover board disposed on the maintenance window and having a bottom surface abutted with the topmost heat dissipation pad, to form a vertical position-limiting and anti-vibration structure to conduct heat to the heat dissipation shell via the cover board for dissipation, and easy maintenance of the memory modules via the maintenance window is also achieved.