Patent classifications
H
H01
H01R
43/00
H01R43/02
H01R43/0228
H01R43/0228
RIVET FOR USE IN SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
A method for forming a rivet for a semiconductor module arrangement comprises providing a disc, the disc comprising a hole or depression, and inserting a first end of a tubular part into the hole or depression.