A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.

A method for inserting preformed solder members into connector pins for use with electrical connectors. The method generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are substantially eliminated. The method allows for inserting solder members in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that solder members can be inserted into large numbers of connector pins that are pre-installed in connector grommets, largely simultaneously.

An electrical connector includes: an insulating body, provided with multiple accommodating holes; multiple terminals, respectively accommodated in the accommodating holes, where each of the terminals is provided with a clamping portion; and multiple solder posts, each being clamped by the clamping portion of one of the terminals. A height of each solder post is greater than a maximum width of each solder post. Each solder post is formed by a first base and a second base connected with each other. The clamping portion clamps the first base. The second base is located outside the clamping portion. A height of the first base and a height of the second base are both greater than one half of the maximum width of each solder post. The height of the second base is greater than 0.15 mm.

An electronic control connector (30) including at least an input orifice (32a), at least a fixing leg (33) and at least a terminal (34), the terminal (34) being inserted inside the input orifice (32a), the electronic control connector (30) being fixed to a printed circuit board (10) of an electronic control (50), by a fixing between the fixing leg (33) and a fixing orifice (16) disposed on the printed circuit board (10) of the electronic control (50), the fixing of the electronic control connector (30) to the printed circuit board (10) also establishing an electrical connection between the terminal (34) of the electronic control connector (30) and the tracks of the printed circuit board (10) of the electronic control (50).

Provided is a soldering method for soldering a tip end of an electric wire to a soldering portion of a metallic terminal which allows the soldering to be performed with excellent workability. The method includes a damming structure forming step forming a damming structure at a periphery of the soldering portion to dam a solder which is supplied in a molten state with a flux to the soldering portion to keep the solder at the soldering portion, an electric wire setting step setting the tip end of the electric wire at the soldering portion ready for soldering, and a solder supplying step supplying the solder in the molten state with the flux to the soldering portion to perform the soldering.

A terminal (20) includes a bottom surface (23) and solder holding portions (25, 25). A solder member (30) is placed on the bottom surface (23) of the terminal (20) and the solder holding portions (25, 25) are deformed to hold the solder member (30) in place. A conductor (12) of a wire (11) is placed on solder member (30). The solder member (30) then is melted by heating to connect the conductor (12) of the wire (11) to the terminal (20).

An electrically connecting device (1) includes a linking part defining an internal channel (12) that opens onto the exterior of the linking part. The internal channel (12) is able to receive two end segments of two superconducting wires (2, 3) that lie parallel in the internal channel (12) over a segment of common length; and an aperture (13) in the external jacket of the linking part. The aperture (13) is in communication with the internal channel (12) in order to allow a brazing material in liquid form to be inserted into the internal channel (12) around the two end segments of the two superconducting wires (2, 3).

In a method for attaching a connector to a coaxial cable a solder preform is placed upon an end of an outer conductor of the cable. A connector body of the connector is seated upon an interface pedestal and the end of the outer conductor is inserted into a bore of the connector body against the interface pedestal. The outer conductor, the connector body and the interface pedestal contribute sidewalls to form a solder cavity, and the solder preform is heated. A seat may be applied to the interface pedestal to provide a thermal barrier and/or enhanced seal characteristics that are cost efficiently replaceable upon degradation.

A method for manufacturing an electrical connector, including: S1: providing a bearing tray, where the bearing tray is concavely provided with multiple holding slots at intervals; S2: providing multiple solders correspondingly placed in the multiple holding slots; S3: heating the bearing tray, so as to soften the solders; S4: providing an insulating body and multiple terminals disposed at the insulating body, where each of the terminals has a soldering portion exposed from the insulating body, and moving the insulating body and the terminals entirely to the bearing tray, so that the soldering portion of each of the terminals is correspondingly inserted into a corresponding one of the softened solders; and S5: sticking the solder to the soldering portion, moving the insulating body away from above the bearing tray, and separating the solders from the bearing tray. The electrical connector has good electrical connection performance.

In one embodiment, the present invention includes an interface apparatus for semiconductor testing. The interface apparatus includes a housing. The housing includes a lower housing substrate and an upper housing substrate. The lower housing substrate has a plurality of apertures arranged according to a fine pitch, and the upper housing substrate has a plurality of apertures arranged according to a coarse pitch. A plurality of wires passes through the plurality of apertures from the lower housing substrate to the upper housing substrate. Each wire has plated conductive ends emanating from opposing sides of the housing. The plurality of apertures of the lower housing substrate corresponds to the plurality of apertures of the upper housing substrate. The interface apparatus transforms a pattern having a course pitch to a pattern having a fine pitch.