A terminal connection structure for an electric wire end portion (12a) in which the electric wire end portion is soldered being exposed on a flat-plate terminal piece (11b) out from inside of a terminal main part (11a), the terminal piece being continuous with a front end of the terminal main part (11a). The electric wire end portion (12a) exposed on the terminal piece (11b) from the terminal main part (11a) includes a first end section (12a1) that is close to the terminal main part (11a) and a second end section (12a2) that is far from the terminal main part (11a). The electric wire end portion (12a) has a shape, in side view, such that the first end section (12a1) is compressed to have a gentle curved surface that approaches the terminal piece (11b) toward the second end section (12a2).

An electrical receptacle connector includes a metallic shell, an insulated housing, a plurality of first receptacle terminals, and a plurality of second receptacle terminals. The insulated housing received in the metallic shell is assembled with the first receptacle terminals and the second receptacle terminals. The tail portion of the power terminal of the second receptacle terminals is adjacent to and combined with the tail portion of the power terminal of the first receptacle terminals. The tail portion of the ground terminal of the second receptacle terminals is adjacent to and combined with the tail portion of the ground terminal of the first receptacle terminals. The combined tail portions can be inserted into the same soldering hole of a circuit board. Therefore, the cost and time for the soldering procedure of the connector manufacturing can be reduced.

In one embodiment, the present invention includes an interface apparatus for semiconductor testing. The interface apparatus includes a housing. The housing includes a lower housing substrate and an upper housing substrate. The lower housing substrate has a plurality of apertures arranged according to a fine pitch, and the upper housing substrate has a plurality of apertures arranged according to a coarse pitch. A plurality of wires passes through the plurality of apertures from the lower housing substrate to the upper housing substrate. Each wire has plated conductive ends emanating from opposing sides of the housing. The plurality of apertures of the lower housing substrate corresponds to the plurality of apertures of the upper housing substrate. The interface apparatus transforms a pattern having a course pitch to a pattern having a fine pitch.

An electrical connector for electrically connecting a chip module and a circuit board, includes an insulating body, multiple terminals, and multiple solders. The insulating body includes multiple receiving holes running therethrough and multiple resisting portions. The terminals are respectively located in the receiving holes. One end of each terminal is provided with a soldering portion, the soldering portion has a soldering surface, and the soldering surface is perpendicular to a surface of the circuit board. Left and right sides of the solder urge the soldering surface and the resisting portion respectively, a lower side of the solder is soldered onto the circuit board by reflow soldering, and the solder is soldered to the soldering surface by laser.

An assembly includes a right-angled coaxial connector, a first coaxial cable and a second coaxial cable. The right-angled coaxial connector includes a first component and a second component connected to a first coaxial cable and a second coaxial cable respectively. The inner conductor and the outer conductor of the first coaxial cable and the first inner conductor and the first outer conductor of the first component, the inner conductor and the outer conductor of the second coaxial cable and the second inner conductor and the second outer conductor of the second component, as well as the first inner conductor and the first outer conductor of the first component and the second inner conductor and the second outer conductor of the second component are permanently connected in a single welding procedure through a first soldering element, a second soldering element and a third soldering element, respectively.

A contacting device (100) for connecting an electrical conductor (11) comprises a connection contact (101) for fixing the electrical conductor (11) to the contacting device (100), wherein the connection contact (101) has a retainer (110). The retainer (110) has an accommodating region (112) for accommodating the electrical conductor (11). The accommodating region (112) tapers between an inlet opening (E112) and a base surface (B112) of the accommodating region (112) in such a way that a cross section (A11) of the electrical conductor (11) is deformed when the electrical conductor (11) is inserted into the accommodating region (112), whereby the electrical conductor is retained on the connection contact (101) in the clamping seat. The electrical conductor (11) can thus be fixed to the connection contact (101) without bending of the retainer (110).

In a method for attaching a connector to a coaxial cable a solder perform is placed upon an end of an outer conductor of the cable. A connector body of the connector is seated upon an interface pedestal and the end of the outer conductor is inserted into a bore of the connector body against the interface pedestal. The outer conductor, the connector body and the interface pedestal contribute sidewalls to form a solder cavity, and the solder perform is heated. A seat may be applied to the interface pedestal to provide a thermal barrier and/or enhanced seal characteristics that are cost efficiently replaceable upon degradation.

A wiring harness assembly is presented. The wiring harness assembly is formed by a method that includes the steps of crimping an electrical wire cable within a crimping feature of an electrical terminal having wire strands protruding from the crimping feature and fusing the wire strands of protruding portion, or wire brush so that the wire strands are in intimate contact, thereby eliminating voids between individual wire strands of the wire brush. The wires may be fused by laser welding, soldering, or brazing. The method may be especially beneficial for wire strands having an insulative oxide layer, such as aluminum. The bonding reduces the resistance between the wire strands due to insulating oxide layers on the surface of the wire strands and inhibiting of corrosion by eliminating inter-strand gaps where electrolytes in solution may enter and cause galvanic corrosion.

The present disclosure provides a radio frequency connector. The radio frequency connector is configured to connect a radio frequency cable. The radio frequency cable includes a core wire and a metal covering layer insulated to each other. The radio frequency connector includes a first main body, a second main body, and an insulating body. The first main body includes a first accommodating space and a first opening. The first opening allows a first solder to enter the first accommodating space to contact the core wire so as to electrically connect the core wire and the first main body. The second main body includes a second accommodating space and a second opening. The second opening allows a second solder to enter the second accommodating space to contact the metal covering layer so as to electrically connect the metal covering layer and the second main body.

A method for soldering to a conductor on a first substrate with a melting temperature below a soldering temperature is provided. A second substrate is attached to the first substrate around a soldering point. The second substrate is smaller than the first substrate and has a melting temperature above the soldering temperature. A soldering material is applied to the soldering point and the soldering temperature is applied to the soldering point with a soldering head smaller than the second substrate. The first substrate deforms (e.g., melts) proximate the soldering point at the soldering temperature. However, support for the first conductor is provided with the second substrate in place of the first substrate proximate the soldering point where the first substrate is deformed.