A method for soldering to a conductor on a first substrate with a melting temperature below a soldering temperature is provided. A second substrate is attached to the first substrate around a soldering point. The second substrate is smaller than the first substrate and has a melting temperature above the soldering temperature. A soldering material is applied to the soldering point and the soldering temperature is applied to the soldering point with a soldering head smaller than the second substrate. The first substrate deforms (e.g., melts) proximate the soldering point at the soldering temperature. However, support for the first conductor is provided with the second substrate in place of the first substrate proximate the soldering point where the first substrate is deformed.

A method for producing a soldered connection between at least two components is provided, in which the components are heated for melting a solder in a soldering area. The heating of the soldering area and/or the supply of solder to the soldering area is realized depending on the temperature which is determined by non-contact detection of heat radiation emitted from at least one temperature measurement zone of one of the components. In order to improve the method such that the emissivity of the at least one temperature measurement zone can be increased with high process reliability and with at most a slight adverse effect on the electrical connection between the electrical components, it is proposed that the at least one temperature measurement zone be locally heated for increasing its emissivity. Furthermore, an electrical plug-in connector for producing a soldered connection and use of such a plug-in connector are proposed.

A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.

A method of attaching a flat flexible cable (FFC) to a plurality of terminals of an electrical connector includes a step of arranging a plurality of terminals within a connector housing, with each terminal defining a weld area adapted to be electrically connected to a conductor of the FFC. The FFC is then positioned proximate the connector housing such that the weld areas of each terminal are arranged directly adjacent a respective one of a plurality of exposed conductors of the FFC. At least the weld areas of the plurality of terminals are heated with an inductive heating source for electrically connecting the plurality of conductors of the FFC to the plurality of terminals.

The invention relates to a device and a method for thermally treating components, in particular electronic components or the like, the device comprising a batch tray (10) and at least two groups of components placed on the batch tray, the groups of components each comprising at least a first component and a second component connected or to be connected to the first component, the batch tray having at least two tray units (11) each accommodating a group of components. The tray units each have a tray (12) and a connecting member (13) for connecting the trays to each other, the connecting member being formed by at least one connecting element (14), a material of the connecting element and/or the trays being selected in such a manner that the connecting element and/or the tray exhibits thermal expansion in at least one linear direction when thermally treated, said thermal expansion essentially corresponding to a thermal expansion of the first component and/or the second component in the linear direction.

A method for soldering to a conductor on a first substrate with a melting temperature below a soldering temperature is provided. A second substrate is attached to the first substrate around a soldering point. The second substrate is smaller than the first substrate and has a melting temperature above the soldering temperature. A soldering material is applied to the soldering point and the soldering temperature is applied to the soldering point with a soldering head smaller than the second substrate. The first substrate deforms (e.g., melts) proximate the soldering point at the soldering temperature. However, support for the first conductor is provided with the second substrate in place of the first substrate proximate the soldering point where the first substrate is deformed.

A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) by a soldering device (10) with an energy dissipation (E), a device position (P.sub.x,y,z), and/or a device acceleration (a.sub.x,y,z). The soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (P.sub.x,y,z), and/or a first device acceleration (a.sub.x,y,z). The soldering device (10) moves towards and/or away from the soldering point (20), has a second energy dissipation (E), a second device position (P.sub.x,y,z), and/or a second device acceleration (a.sub.x,y,z). The state of the soldering point (20), the substrate (12), and/or the component (14) depends on time series of the energy dissipation (E), the device position (P.sub.x,y,z), and/or the device acceleration (a.sub.x,y,z).