A glass plate module according to the present invention includes: a glass body; an electrical conductor laminated on the glass body; at least one connection terminal fixed to the conductive layer, and formed of a conductive material; and a lead-free solder for fixing the connection terminal to the conductive layer, and the connection terminal includes a base portion, at least one installation portion coupled to the base portion, and fixed to the conductive layer via the lead-free solder, a power supply portion coupled to the base portion, and to be connected to a cable for supplying power to the conductive layer, and a connection portion that is disposed between the base portion and the power supply portion, and that connects the connection portion to the base portion in a bendable manner.

A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.

A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.

In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.

A method for manufacturing electrical connector assemblies is disclosed. The electrical connector assemblies include an electrical interposer and a first electrical receptacle. The method includes positioning a fixture coupled to or including an array of the first electrical receptacles such that each of the first electrical receptacles aligns with one of the electrical interposers on an assembly with an array of the electrical interposers. The method further includes reflowing solder to mechanically and electrically couple the array of the first electrical receptacles to the array of the electrical interposers.

An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.

A high frequency connector includes a case, a circuit board, a component protecting member and a cable. The circuit board is configured in the case and includes an electronic component and a plurality of solder pads. The component protecting member includes a case body and is configured on the circuit board. One side of the case body has an opening, and a containing space is formed between the opening and the inner face of the case body. A crossing structure is formed by the outer surface of the other side of the case body. When the component protecting member is configured on the circuit board, the component protecting member covers the electronic component in the containing space to maintain the transmission characteristics of the electronic component.

An electrical interconnect including slotted lug with a receiving end for connecting to a flat electrical conductor and a fastening end for connecting to a surface mount terminal extending from the surface of a circuit, such as an integrated metal substrate (IMS) circuit board or a circuit card assembly. The interconnect provides a secure connection capable of transmitting a current of at least 100 Arms, to give a non-limiting example value. The interconnect further provides low contact resistance and ease of manufacturing.

The invention relates to an electric contact assembly for electrically contacting a printed circuit board or the like, comprising an installation ring (3) with an opening (3a), said installation ring (3) being designed to be fixed to the printed circuit board (11), and comprising a press-in pin (2) with a first zone (21) and a second zone (22), wherein the first zone (21) has a greater degree of mechanical flexibility than the second zone (22), and the first zone (21) is designed to be connected to another electronic component. The second zone (22) is assembled in the opening (3a) of the installation ring (3) by means of a first interference fit (4).