Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.

A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias.

A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via the solder pads. The solder pads may include a plurality of outer solder pads and at least one inner solder pad for connecting to respective contact portions of the coaxial connector.

A method for producing a connection contact for a sensor or an actuator of a vehicle, the method including: providing a printed circuit board having at least one electronic component arranged thereon and having an opening; inserting a contact bushing into the opening; and combined soldering the at least one component to the printed circuit board and the contact bushing to the printed circuit board in one task. Also described are a related circuit board and a vehicle control unit.

Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.

A cable connection structure includes an electric cable, an end face of a core wire of which is exposed, a first electrode that covers the end face, a substrate, a terminal of which is exposed on a principal surface, and a second electrode bonded to the first electrode without another member interposed between the first electrode and the second electrode, the second electrode covering the terminal and having substantially same Vickers hardness as Vickers hardness of the first electrode.

A shield connector includes a shield member for covering an outer periphery of a terminal, and a substrate mounting surface provided on the shield member and fixed to a surface of a substrate via solder, wherein the substrate mounting surface has a reference surface and a stepped surface having a different height with respect to the reference surface. For example, the stepped surface is formed by at least one of a convex portion protruding from the reference surface of the substrate mounting surface and a concave portion recessed from the reference surface of the substrate mounting surface.

A connector structure with improved terminal coplanarity includes a housing and terminal assemblies. The housing has sockets and a coplanar track. The coplanar track is defined by two inner flanges of the housing. The two flanges extend longitudinally and parallel to each other. Each terminal assembly includes a connector body, terminals and a guider. The connector body is disposed inside the housing by the sockets. The terminals are disposed by penetrating through the connector body. The guider is disposed close to soldering ends of the terminals. The soldering end of each terminal protrudes out of the guider. The guider has two opposite grooves. Each groove is engaged with the corresponding flange. The coplanar track has a coplanar datum surface. Soldering portions of the soldering ends of the terminals protruding out of the guider are separated from the coplanar datum surface by the same distance.

Systems and methods for simultaneously coupling a plurality of high speed electrical connectors to a Printed Wiring Board (“PWB”). The methods comprise: obtaining a composite electrical connector comprising the plurality of high speed electrical connectors which are serially arranged in a side-by-side manner and coupled to each other; automatedly engaging a smooth surface of the composite electrical connector; placing the composite electrical connector on the PWB so that pins of the plurality of high speed electrical connectors are concurrently inserted into vias formed in the PWB; and coupling the composite electrical connector to the PWB by soldering the pins in the vias.