Patent classifications
H01R43/0263
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT
A connector includes lead parts and terminal parts to be connected to lands of a substrate, respectively. An anisotropic conductive joining member (ACJM) is mounted in a region where the lead parts are located. The ACJM is a resin in which solder particles are dispersed. The resin can melt at a temperature lower than the melting point of the solder particles. Cream solder is placed on the lands to be connected to the terminal parts. The substrate on which the connector is mounted is passed through a reflow oven to heat both the substrate and the connector. The connection between the terminal parts and the lands by reflow soldering and the connection between the lead parts and the lands via the ACJM 40 are performed simultaneously with each other.
Method for forming a connection between a busbar and a contact section, a busbar having a contact section and power distribution system having such busbar
A method for forming a connection between a busbar (1) and a contact section (20) comprising: providing a first conductive section (11) made from aluminum, providing a second conductive section (12) made from aluminum, wherein the second conductive section (12) includes the contact section (20) or is connected to the contact section (20) and wherein the second conductive section (12) is at least partially covered with nickel and/or tin creating a laser welding bond, in particular a laser welding seam (10), between the first conductive section (11) and the second conductive section (12), by laser welding.
Component, positioning device and method for fastening the component by soldering
A component having electrical connector elements for making contact with a circuit board, optionally having additional securing elements for mechanical stability after soldering or positioning devices for supporting components with an unfavourable center of gravity or supporting elements which can optionally be removed after the soldering process. The positioning devices or supporting elements serve to position components with different forms on a circuit board and to keep them in the correct orientation for the soldering process. Fitting takes place in a force-free manner and thus favours automation and the use of for example pick-and-place robots which take hold of and move the particular component via the positioning device connected thereto, engaging with and/or around either a contact element or a supporting element. The support of the positioning device allows a stable state during the soldering process. In a corresponding manner, methods for carrying out the soldering processes are specified.
Preformed Solder-in-Pin System
A method for inserting preformed solder members into connector pins for use with electrical connectors. The method generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are substantially eliminated. The method allows for inserting solder members in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that solder members can be inserted into large numbers of connector pins that are pre-installed in connector grommets, largely simultaneously.
COUPLING DEVICE, ASSEMBLY AND METHOD
A coupling device for coupling a plurality of cable units to a component carrier includes a base plate that is flat in at least one plane. A connecting device is disposed on a first side of the base plate and is configured to mechanically couple the base plate to the component carrier. An opening extends through the base plate for each cable end of a plurality of cable ends of the cable units. The opening in each case is disposed on the base plate at a position corresponding to the respective cable unit.
Magnet wire bonding method and bonding structure
The present invention relates to a magnet wire bonding method and a bonding structure, and more particularly to a new improvement for ultrasonically bonding a longitudinal outer peripheral surface of a magnet wire having no entangling part to a flat surface of a flat part of a terminal pin. A magnet wire bonding method and structure, comprising: using a terminal pin (11) having a flat plate part (40) provided in a pin part (11a) as a terminal pin holding part (3); placing a magnet wire (13) in a longitudinally spread state on a flat surface (40a) of the flat plate part (40) without being entangled; and ultrasonically bonding an outer peripheral surface (13E) of the magnet wire (13) onto the flat surface (40a) with an ultrasonic horn (50).
Cable connection structure, endoscope, and method of manufacturing cable connection structure
A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.
Wire sorting fixture and method of sorting wires
A wire sorting fixture includes a cable support configured to support a multi-wire cable and a wire support configured to support wires of the cable. The wire support has a top surface. The wire support has cradles open at the top surface. The wire support has separating walls between corresponding cradles. A top plate is positioned above the wire support. The top plate is moved toward the wire support to a clamping position after the wires are positioned in the corresponding cradles. The top plate holds the wires between the top plate and the wire support in the clamping position.
Terminal fitting and wire with terminal fitting
A terminal fitting includes a soldering portion (11) to which a conductor (91) of a wire (90) is to be soldered, solid solder (60) for soldering the conductor (91) to the soldering portion (11) in a solid state, and a holding portion (20) that holds the solid solder (60) until the solid solder (60) is melted and the conductor (91) is soldered. The conductor (91) is connected to the soldering portion (11) by melting the solid solder (60) held in the holding portion (20).
DEVICE FOR WELDING ROD-SHAPED CONDUCTORS
The invention relates to a device for welding rod-shaped conductors (14), comprising a compression chamber for receiving joining sections (13) of the conductors to be joined together, the compression chamber being limited in a first axial direction (z-axis) on two opposite sides by an active surface of a sonotrode (16) transmitting ultrasonic vibrations in the direction of the z-axis and by a counter surface of a counter electrode (18), the device having a knife device which is provided with a drive device and comprises a knife (24) movable in the direction of the z-axis, said knife having a cutting edge which can be moved past the compression chamber, wherein a drive motor of the drive device is arranged in an installation space arranged below the sonotrode, the drive motor being connected to a knife holder (26) via a deflection gear (31) in order for the knife to be able to perform a cutting motion, the knife being moveable in the direction of the z-axis.