In one example, an optoelectronic assembly may include a laser array, an amplifier array, and a multimode interference coupler optically coupling the laser array and the amplifier array. The laser array may include at least one primary laser and at least one spare laser configured to be activated if the primary laser fails. The amplifier array may include at least two amplifiers configured to amplify optical signals received from the laser array.

The disclosure belongs to the technical field of photoelectric emission in semiconductors, and discloses an electro-absorption modulated laser chip and a fabrication method thereof, which can solve the problems of signal distortion caused by optical crosstalk between components in an existing electro-absorption modulated laser (EML) integrated with a semiconductor optical amplifier (SOA), and failure in longer-distance transmission. The laser chip includes: a laser light source; an electro-absorption modulator disposed on a light-emitting side of the laser light source; a semiconductor optical amplifier disposed on a light-emitting side of the electro-absorption modulator; and at least one isolation assembly disposed between the laser light source and the electro-absorption modulator, and/or, disposed between the electro-absorption modulator and the semiconductor optical amplifier, and configured to isolate optical crosstalk among the laser light source, the electro-absorption modulator, and the semiconductor optical amplifier. The disclosure is used for the electro-absorption modulated laser chip.

A system and method for evaluating an insurance applicant as part of an underwriting process to determine one or more appropriate terms of life or other insurance coverage, such as premiums. A processing element employing a neural network is trained to correlate aspects of appearance and/or voice with personal and/or health-related characteristic. A database of images and/or voice recordings of individuals with known personal and/or health-related characteristics is provided for this purpose. The processing element is then provided with an image and/or voice recording of the insurance applicant. The image may be an otherwise non-diagnostic image, such as an ordinary “selfie.” The trained processing element analyzes the image of the insurance applicant, with their permission or affirmative consent, to determine the personal and/or health-related characteristic for the insurance applicant, and then, based upon that analysis, facilitates the underwriting process and/or suggests the one or more appropriate terms of insurance coverage.

The disclosure belongs to the technical field of photoelectric emission in semiconductors, and discloses an electro-absorption modulated laser chip and a fabrication method thereof, which can solve the problems of signal distortion caused by optical crosstalk between components in an existing electro-absorption modulated laser (EML) integrated with a semiconductor optical amplifier (SOA), and failure in longer-distance transmission. The laser chip includes: a laser light source; an electro-absorption modulator disposed on a light-emitting side of the laser light source; a semiconductor optical amplifier disposed on a light-emitting side of the electro-absorption modulator; and at least one isolation assembly disposed between the laser light source and the electro-absorption modulator, and/or, disposed between the electro-absorption modulator and the semiconductor optical amplifier, and configured to isolate optical crosstalk among the laser light source, the electro-absorption modulator, and the semiconductor optical amplifier. The disclosure is used for the electro-absorption modulated laser chip.

A visible light source includes a substrate, a first reflector and a second reflector configured to reflect infrared light and arranged vertically to form a vertical cavity on the substrate, an active region in the vertical cavity and configured to emit infrared light, a micro-resonator on the substrate and configured to receive the infrared light emitted by the active region and generate visible light through optical parametric oscillation, and an output coupler configured to couple the visible light generated in the micro-resonator out of the micro-resonator.

A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

A vertical cavity light-emitting element includes a first multilayer film reflecting mirror, a light transmissive first electrode, a first semiconductor layer having a first conductivity type, a light-emitting layer, a second semiconductor layer having a second conductivity type opposite to the first conductivity type, a second multilayer film reflecting mirror, and a semiconductor substrate. The second multilayer film reflecting mirror includes a plurality of semiconductor layers having the second conductivity type and constitutes a resonator together with the first multilayer film reflecting mirror. The semiconductor substrate is formed on the second multilayer film reflecting mirror, has an upper surface and a projecting portion projecting from the upper surface, and has the second conductivity type. A second electrode is formed on the upper surface of the semiconductor substrate.

A grating coupled laser (GCL) includes an active section and a passive section. The passive section is butt coupled to the active section to form a butt joint with the active section. The active section includes an active waveguide. The passive section includes a passive waveguide, a transmit grating coupler, and a top cladding. The passive waveguide is optically coupled end to end with the active waveguide and includes a first portion and a second portion. The first portion of the passive waveguide is positioned between the second portion of the passive waveguide and the active waveguide. The transmit grating coupler is optically coupled to the passive waveguide and includes grating teeth that extend upward from the second portion of the passive waveguide. The top cladding is positioned directly above the first portion of the passive waveguide and is absent directly above at least some of the transmit grating coupler.

A criterion method of GCCS (Globally Complete Chaos Synchronization) for three-node VCSEL (Vertical Cavity Surface Emitting Laser) networks with delay coupling is provided, including steps of: providing a delay-coupled VCSEL network consisting of three identical units and dynamic equations of the VCSEL network; providing assumptions of an outer-coupling matrix and a unitary matrix under the dynamic equations of the VCSEL network; in the three-node VCSEL network, determining rate equations of i-VCSEL, determining dynamic equations of a synchronization manifold, and determining a master-stability equation; calculating three maximum Lyapunov exponents; determining a stability of a synchronization state of the three-node VCSEL network, and determining whether the synchronization manifold of the VCSEL network is a chaotic waveform. Through a master-stability function, the method for determining whether the GCCS is achieved among all node lasers is provided, which solves a difficult problem of GCCS criterion for the VCSEL networks.

A process for creating a stabilized diode laser device is disclosed, where the stabilized diode laser device includes a unibody mounting plate and several chambers aligned along a transmission axis. Various optic components are placed in the chambers, and based on a transmission through the chambers, the optic components are aligned and secured within the chambers.