Disclosed are an optical device capable of precise adjustment of optical output intensity, and a method for manufacturing an optical device. An optical device including a laser diode, according to one aspect of the present embodiment, comprises: a laser diode for outputting light having a predetermined wavelength; an optical output unit in which output light of the laser diode is optically coupled and the output of the optical device takes place; and an optical isolator disposed between the laser diode and the optical output unit. The output light of the laser diode passes through the optical isolator and the output of the optical device takes place through the optical output unit, and the intensity of the output light of the optical device is determined by the rotation of the optical isolator.

Provided is a thermoelectric cooler built-in stem, including a first stem member on a top face of which a temperature controlled target device such as an optical module or the like is mounted, a second stem member which opposes to the first stem member each other, and a thermoelectric cooler being sandwiched between the first stem member and the second stem member, for controlling the temperature controlled target device, whereby a space between the first stem member and the second stem member is filled by an insulating resin whose thermal conductivity is low.

Provided is a thermoelectric cooler built-in stem, including a first stem member on a top face of which a temperature controlled target device such as an optical module or the like is mounted, a second stem member which opposes to the first stem member each other, and a thermoelectric cooler being sandwiched between the first stem member and the second stem member, for controlling the temperature controlled target device, whereby a space between the first stem member and the second stem member is filled by an insulating resin whose thermal conductivity is low.

A first semiconductor device according to an embodiment of the present disclosure includes: a semiconductor element; a first housing member and a second housing member that house the semiconductor element; a first base layer formed on a bonded surface of the first housing member to the second housing member; a second base layer formed on a bonded surface of the second housing member to the first housing member; a solder bonding section that bonds the first housing member and the second housing member with the first base layer and the second base layer interposed in between; and a solder adsorption layer provided on at least one of the bonded surface of the first housing member or the bonded surface of the second housing member to be apart from the first base layer and the second base layer.

An optical assembly comprising an interdigital capacitor, one or more electrical contacts in electrical connection with the interdigital capacitor and an insulating layer covering at least a portion of the interdigital capacitor. The one or more electrical contacts and a portion of the insulating layer are configured to receive conductive adhesive. The optical assembly further comprises a metallic layer positioned between the interdigital capacitor and the portion of the insulating layer configured to receive the conductive adhesive.

In an embodiment of the present disclosure, a wiring base includes an insulative base, a signal conductor, a first lead terminal, a first ground conductor, and a second lead terminal. The insulative base includes a first face and a second face. The signal conductor is provided on the first face. The first lead terminal is provided on the signal conductor. The first lead terminal extends in a first direction and includes a portion projecting from the insulative base in plan view toward the first face. The first ground conductor is provided on the second face. The second lead terminal is provided on the first ground conductor. At least a part of the second lead terminal overlaps the first lead terminal in the plan view toward the first face.

In an embodiment of the present disclosure, a wiring base includes an insulative base, a signal conductor, a first lead terminal, a first ground conductor, and a second lead terminal. The insulative base includes a first face and a second face. The signal conductor is provided on the first face. The first lead terminal is provided on the signal conductor. The first lead terminal extends in a first direction and includes a portion projecting from the insulative base in plan view toward the first face. The first ground conductor is provided on the second face. The second lead terminal is provided on the first ground conductor. At least a part of the second lead terminal overlaps the first lead terminal in the plan view toward the first face.

An optical device includes: a base including a mounting surface; and an optical component including an optical element part, a support part including a first adhered surface bonded to the mounting surface via a photocurable first adhesive, the support part being configured to support the optical element part, and an optical opening part provided adjacent to the first adhered surface, the optical opening part allowing light for curing the first adhesive to pass through.

An opto-electric composite transmission module includes an opto-electric hybrid board, a printed wiring board, an opto-electric conversion portion, a first heat transfer member, and a case made of metal. The opto-electric hybrid board, the opto-electric conversion portion, the first heat transfer member, and a first wall of the case are disposed in order toward one side in a thickness direction. The printed wiring board integrally has a first portion and a second portion spaced apart from each other, and a connecting portion for connecting these when viewed from the top. The first portion, the second portion, and the connecting portion include a first overlapped region. The first overlapped region is overlapped with the opto-electric hybrid board without being overlapped with the opto-electric conversion portion when projected in the thickness direction. The first overlapped region is overlapped with the opto-electric conversion portion when projected in a plane direction.

A power over fiber system includes a power sourcing equipment, a powered device, an optical fiber cable and a converter. The power sourcing equipment includes a semiconductor laser that oscillates with electric power, thereby outputting feed light. The powered device includes a photoelectric conversion element that converts the feed light into electric power. The optical fiber cable has one end connectable to the power sourcing equipment and another end connectable to the powered device to transmit the feed light. The converter converts a wavelength of the feed light.