A mirror driving mechanism includes a plate-shaped base portion, a mirror that is installed at the base portion, and a temperature detecting section that is installed at the base portion and that detects a temperature of the base portion. The base portion includes a thin portion that is disposed away from an outer edge of the base portion and that has a through hole extending through the base portion in a plate-thickness direction of the base portion, a thick portion that is connected to the thin portion, that is thicker than the thin portion in the plate-thickness direction of the base portion, and that extends along the outer edge so as to surround the thin portion, and a first shaft portion extends into the through hole from an outer periphery of the through hole.

A method for manufacturing a light emitting device includes: disposing a light emitting element on a base member; providing a bonding agent to the base member or a lid member; and bonding the base member on which the light emitting element is disposed and the lid member with the bonding agent by sandwiching the bonding agent in a molten state between the base member and the lid member, and pressing the lid member against the base member, increasing a distance between the base member and the lid member in a state in which the lid member is pressed against the base member, while maintaining a state in which the bonding agent contacts the base member and the lid member, and solidifying the bonding agent in a state in which the distance between the base member and the lid member is increased to bond the base member and the lid member.

A pluggable optical connector is configured to be insertable into and removable from an optical communication apparatus, and to be capable of communicating a modulation signal and a data signal with the optical communication apparatus. A wavelength-tunable light source is configured to output an output light and a local oscillation light. An optical transmission unit is configured to output an optical signal generated by modulating the output light in response to the modulation signal. An optical reception unit is configured to demodulate an optical signal received by using the local oscillation light to the data signal. Pluggable optical receptors are configured in such a manner that an optical fiber is insertable into and removable from the pluggable optical receptors, and configured to be capable of outputting the optical signal to the optical fiber and transferring the optical signal received thorough the optical fiber to the optical reception unit.

A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.

A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.

A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.

A mirror-driving mechanism includes a stage having a recessed portion, a base portion in a plate shape, a mirror in a plate shape having a reflection surface configured to reflect light, and a photo detector having a photo detecting surface configured to receive light. The base portion has a through-hole and is disposed so as to cover an opening in the recessed portion. The mirror is disposed so as to be swingable in the through-hole away from a wall surface defining the through-hole. The photo detector is disposed in the recessed portion so as to overlap a region in which the through-hole is located when viewed in a thickness direction of the base portion.

A laser system comprising high voltage AC-to-DC power converter and one or more current sources coupled to the high voltage AC-to-DC power converter without a DC-to-DC converter between the one or more current sources and the AC-to-DC power source. Each of the one or more current sources includes a high voltage switch and one or more independent safety shutoffs. A laser module is operably coupled to the one or more current source and configured to emit electromagnetic radiation wherein the one or more safety shutoffs are configured to disable emission of electromagnetic radiation from the laser module when triggered.

A method for producing a housing cover for a laser component, a housing for a laser component, and a laser component are provided. The method includes providing an at least partially radiation-permeable window including an aluminum oxide, provide a copper carrier for the window, and forming a copper oxide in an oxide region on the copper carrier. The method further includes arranging the window at the oxide region, forming a eutectic bond between the window and the copper oxide in the oxide region, and thereby fixing the window to the copper carrier.

A semiconductor light-emitting device includes light-emitting element, sealing resin and conductor. The light-emitting element has first and second surfaces spaced apart in a thickness direction with first element electrode on the first surface and with second element electrode on the second surface. The sealing resin covers at least the second surface. The conductor, forming a conduction path to the light-emitting element, includes a first interconnecting portion, an embedded portion, and a second interconnecting portion. The sealing resin has a cavity extending in the thickness direction and connected to the second element electrode. The first interconnecting portion is electrically connected to the first element electrode and extends in a direction crossing the thickness direction. The embedded portion is in the cavity and connected to the second element electrode. The second interconnecting portion is connected to the embedded portion and extends in the direction crossing the thickness direction.