Patent classifications
H01S5/1025
TWO-SEGMENT DBR LASER AND MONOLITHICALLY INTEGRATED ARRAY LIGHT SOURCE CHIP
This application provides a two-segment DBR laser and a monolithically integrated array light source chip, and relates to the field of optical communications. The two-segment DBR laser includes a grating region, a gain region, and a broadband reflector. The grating region and the broadband reflector are respectively disposed at two ends of the gain region. The grating region includes a first bottom liner, a first support structure, a first ridge waveguide structure, and a first heater. The first ridge waveguide structure is fastened by the first support structure and suspended in midair above the first bottom liner, and the first bottom liner, the first support structure, and the first ridge waveguide structure jointly form a cavity. The first heater is located on a surface that is of the first ridge waveguide structure and that faces away from the cavity.
Highly stable semiconductor lasers and sensors for III-V and silicon photonic integrated circuits
Building blocks are provided for on-chip chemical sensors and other highly-compact photonic integrated circuits combining interband or quantum cascade lasers and detectors with passive waveguides and other components integrated on a III-V or silicon. A MWIR or LWIR laser source is evanescently coupled into a passive extended or resonant-cavity waveguide that provides evanescent coupling to a sample gas (or liquid) for spectroscopic chemical sensing. In the case of an ICL, the uppermost layer of this passive waveguide has a relatively high index of refraction that enables it to form the core of the waveguide, while the ambient air, consisting of the sample gas, functions as the top cladding layer. A fraction of the propagating light beam is absorbed by the sample gas if it contains a chemical species having a fingerprint absorption feature within the spectral linewidth of the laser emission.
SURFACE-MOUNT COMPATIBLE VCSEL ARRAY
A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.
Semiconductor laser device, manufacturing method thereof, and light emitting device
A semiconductor laser device includes an optical waveguide that extends toward a first end of the semiconductor laser device. The optical waveguide includes a first clad layer, an active layer, a second clad layer, and an electrode layer in this order. A reflecting surface, which has a dielectric film and a metal film in this order from the active layer, crosses the active layer at a second end of the optical waveguide.
STRUCTURED LIGHT PROJECTION SYSTEM INCLUDING NARROW BEAM DIVERGENCE SEMICONDUCTOR SOURCES
Structured light projection system include narrow beam divergence semiconductor sources. The structured light projector system includes an array of narrow beam divergence semiconductor sources, and a projection lens operable to generate an image of the array of narrow beam divergence semiconductor source. Each narrow beam divergence semiconductor source can include an extended length mirror that helps suppress one or more longitudinal and/or transverse modes such that the beam divergence and/or the spectral width of emission is substantially reduced.
Surface-mount compatible VCSEL array
A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.
Two-section edge-emitting laser
A system includes a waveguide and an edge-emitting laser. The edge-emitting laser is configured to lase coherent light into the waveguide. The edge-emitting laser includes an optical cavity having an active gain section and a passive section. The active gain section is configured to amplify an optical power of light reflecting within the optical cavity. The passive section increases a functional length of the optical cavity such that a total length of the optical cavity reduces fringe interference of the coherent light propagating through the waveguide.
QUANTUM CASCADE LASER
A quantum cascade laser includes a laser structure including a semiconductor stack and a semiconductor support, the laser structure having a first end face and a second end face opposite the first end face. The semiconductor stack is disposed on the semiconductor support. The laser structure includes a semiconductor mesa and a buried region, the semiconductor mesa including a core layer, and the buried region embedding the semiconductor mesa. The laser structure includes a first region, a second region, and a third region. The third region is provided between the first region and the second region. The first region includes the first end face. The semiconductor mesa includes a first stripe portion, a second stripe portion, and a first tapered portion, respectively, in the first region, the second region, and the third region. The first stripe portion and the second stripe portion have different mesa widths.
LASER DIODE AND METHOD FOR MANUFACTURING THE SAME
A structure includes a base; a first mask layer disposed on the base, where the first mask layer has a first channel exposing the base, the first channel comprises a first open end and a second open end, the second open end is close to a surface of the base, the first open end is away from the surface of the base, and an area of an orthographic projection of the first open end in a plane where the base is located is smaller than an area of an orthographic projection of the first channel in the plane; and a second mask layer disposed on the first mask layer, where the second mask layer has a second channel exposing the first mask layer, and the second channel is connected to the first channel.
Laser source and method of manufacturing such
A laser source for emitting radiation in a given emission spectral band, centered on a given emission angular frequency, the central emission angular frequency is provided. The laser source comprises a laser cavity comprising a gain section having a known frequency dependent Group Delay Dispersion, and a GTI mirror arranged at one end of the gain section, having a known frequency dependent Group Delay Dispersion. The gain section and the GTI mirror are formed into a same laser medium, the laser medium having a known frequency dependent Group Delay Dispersion, and the gain section and the GTI mirror are separated by a gap of predetermined width filled with a dielectric medium thus forming a two parts laser cavity. Further, the GTI GDD at least partly compensates the sum of the Gain GDD and the material GDD in the emission spectral band.