H01S5/1053

Light-emitting semiconductor chip and method for producing a semiconductor light-emitting chip

A light-emitting semiconductor chip (100) is provided, having a first semiconductor layer (1), which is at least part of an active layer provided for generating light and which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).

INHOMOGENEOUS FOCUSING AND BROADBAND METASURFACE QUANTUM-CASCADE LASERS
20200067281 · 2020-02-27 ·

A reflectarray metasurface for quantum-cascade lasing includes: (1) a substrate; and (2) an array of subcavities disposed on the substrate. Each subcavity in the array of subcavities includes (a) a first metallic layer disposed on the substrate; (b) a layer of a quantum-cascade laser active material disposed on the first metallic layer; and (c) a second metallic layer disposed on the layer of the quantum-cascade laser active material. At least some subcavities in the array of subcavities have inhomogeneous widths, and the array of subcavities is configured to reflect an incident light of at least one resonant frequency with amplification.

Laterally tailoring current injection for laser diodes

A semiconductor laser diode includes multiple layers stacked along a first direction, in which the multiple layers include: a first multiple of semiconductor layers; an optical waveguide on the first multiple of semiconductor layers, in which the optical waveguide includes a semiconductor active region for generating laser light, and in which the optical waveguide defines a resonant cavity having an optical axis; and a second multiple of semiconductor layers on the optical waveguide region, in which a resistivity profile of at least one layer of the multiple layers varies gradually between a maximum resistivity and a minimum resistivity along a second direction extending orthogonal to the first direction, in which a distance between the maximum resistivity and the minimum resistivity is greater than at least about 2 microns.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
20200021076 · 2020-01-16 · ·

A semiconductor device includes a substrate, a semiconductor laser part formed on the substrate and having an active layer with an uniform composition and a first ridge structure, and an adjacent part formed on the substrate, having a core layer with an uniform composition and a second ridge structure, and being an optical modulator or an optical waveguide which is in contact with the semiconductor laser part, wherein the first ridge structure is largest in width at a first contact part which is in contact with the second ridge structure, and the second ridge structure is largest in width at a second contact part which is in contact with the first ridge structure.

LASER DEVICE
20190280462 · 2019-09-12 ·

A Distributed Feedback Laser comprises a layer stack comprising a p-layer, an n-layer which are arranged so as to form an pn-junction having an active layer in between. Within the layer stack, an index coupled grating layer or a grating layer is arranged which comprises a first, a second, and a third grating portion. The first, the second, and the third grating portions are asymmetrically arranged along a lateral dimension of the layer stack, wherein the second grating portion is formed without a grating structure.

ETCHED PLANARIZED VCSEL
20190207369 · 2019-07-04 ·

An etched planarized VCSEL includes: an active region; a blocking region over the active region, and defining apertures therein; and conductive channel cores in the apertures, wherein the conductive channel cores and blocking region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the blocking region over the active region; etching the apertures in the blocking region; and forming the conductive channel cores in the apertures of the blocking region. Another etched planarized VCSEL includes: an active region; a conductive region over the active region, and defining apertures therein; and blocking cores in the apertures, wherein the blocking cores and conductive region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the conductive region over the active region; etching the apertures in the conductive region; and forming the blocking cores in the apertures of the conductive region.

Semiconductor laser module
10241335 · 2019-03-26 · ·

A semiconductor laser module comprises a tapered laser diode and/or a tapered amplifier diode equipped with beam shaping optics. The tapered laser diode and/or the tapered amplifier diode includes an emission facet for emitting a laser beam along a beam axis. The beam-shaping optics comprise a plano-convex cylindrical lens oriented so as to change divergence of the beam in the fast axis direction, the plano-convex spherical cylindrical lens having a planar surface arranged facing the facet and a circular cylindrical surface facing away from the facet. The refractive index of lens may be uniform throughout the entire lens. Alternatively, the lens may have a refractive index varying in the direction of the slow axis and/or in the direction of the fast axis.

Etched planarized VCSEL
10230215 · 2019-03-12 · ·

An etched planarized VCSEL includes: an active region; a blocking region over the active region, and defining apertures therein; and conductive channel cores in the apertures, wherein the conductive channel cores and blocking region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the blocking region over the active region; etching the apertures in the blocking region; and forming the conductive channel cores in the apertures of the blocking region. Another etched planarized VCSEL includes: an active region; a conductive region over the active region, and defining apertures therein; and blocking cores in the apertures, wherein the blocking cores and conductive region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the conductive region over the active region; etching the apertures in the conductive region; and forming the blocking cores in the apertures of the conductive region.

ETCHED PLANARIZED VCSEL
20180041009 · 2018-02-08 ·

An etched planarized VCSEL includes: an active region; a blocking region over the active region, and defining apertures therein; and conductive channel cores in the apertures, wherein the conductive channel cores and blocking region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the blocking region over the active region; etching the apertures in the blocking region; and forming the conductive channel cores in the apertures of the blocking region. Another etched planarized VCSEL includes: an active region; a conductive region over the active region, and defining apertures therein; and blocking cores in the apertures, wherein the blocking cores and conductive region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the conductive region over the active region; etching the apertures in the conductive region; and forming the blocking cores in the apertures of the conductive region.

Method for mode control in multimode semiconductor waveguide lasers

One embodiment is a wide stripe semiconductor waveguide, which is cleaved at a Talbot length thereof, the wide stripe semiconductor waveguide having facets with mirror coatings. A system provides for selective pumping the wide stripe semiconductor waveguide to create and support a Talbot mode. In embodiments according to the present method and apparatus the gain is patterned so that a single unique pattern actually has the highest gain and hence it is the distribution that oscillates.