The optical circuit of the present disclosure provides a new optical transmitter configuration that achieves both high output and high quality transmission characteristics regardless of variations at cleavage positions. The optical circuit of the present disclosure may be an optical transmitter having an AXEL configuration in which an EADFB laser and a semiconductor optical amplifier (SOA) are integrated. In a window structure portion of a chip emission edge face of the AXEL, a partially thickened bulk semiconductor layer is formed by a structure including a simulated mesa configured to be separated from an optical axis parallel to an optical axis of an emission optical waveguide.

The optical circuit of the present disclosure provides a new optical transmitter configuration that achieves both high output and high quality transmission characteristics regardless of variations at cleavage positions. The optical circuit of the present disclosure may be an optical transmitter having an AXEL configuration in which an EADFB laser and a semiconductor optical amplifier (SOA) are integrated. In a window structure portion of a chip emission edge face of the AXEL, a partially thickened bulk semiconductor layer is formed by a structure including a simulated mesa configured to be separated from an optical axis parallel to an optical axis of an emission optical waveguide.

A high-reliability low-defect semiconductor light-emitting device and a method for manufacturing same. The high-reliability low-defect semiconductor light-emitting device includes: a semiconductor substrate layer; an active layer arranged on the semiconductor substrate layer; a doped semiconductor contact layer arranged on a side of the active layer away from the semiconductor substrate layer, where the doped semiconductor contact layer includes a first area and an edge area surrounding the first area; a protection layer arranged on a side of the edge area of the doped semiconductor contact layer away from the active layer; and a front electrode layer, arranged on a side of the first area away from the active layer, where an upper surface of the front electrode layer in the first area is lower than an upper surface of the protection layer. The semiconductor light-emitting device has both high reliability and reduced process control costs.

A semiconductor laser device includes: a first conductivity side semiconductor layer, an active layer; and a second conductivity side semiconductor layer. The second conductivity side semiconductor layer includes a first semiconductor layer and a second semiconductor layer, the first semiconductor layer being closer to the active layer than the second semiconductor layer is. The second semiconductor layer defines a width of a current injection region for injecting current into an optical waveguide. The current injection region includes a width varying region in which a width varies. S1>S2, where S1 denotes a width of the width varying region on a front end face side, and S2 denotes a width of the width varying region on a rear end face side.

A semiconductor laser device includes: a first conductivity side semiconductor layer, an active layer; and a second conductivity side semiconductor layer. The second conductivity side semiconductor layer includes a first semiconductor layer and a second semiconductor layer, the first semiconductor layer being closer to the active layer than the second semiconductor layer is. The second semiconductor layer defines a width of a current injection region for injecting current into an optical waveguide. The current injection region includes a width varying region in which a width varies. S1>S2, where S1 denotes a width of the width varying region on a front end face side, and S2 denotes a width of the width varying region on a rear end face side.

The present invention relates to a laser bar with reduced lateral far-field divergence and, more particularly, to a laser bar with a uniform temperature profile in the lateral direction to reduce lateral far-field divergence.

A laser bar (1) according to the invention comprises a plurality of emitter structures arranged in parallel next to one another in the lateral direction, wherein, for the variation of the temperature profile in lateral direction, an adjustment of the dissipated thermal power of the outer emitter structures is made with respect to the inner emitter structures enclosed by the outer emitter structures.

A high brightness diode laser package includes a plurality of flared laser oscillator waveguides arranged on a stepped surface to emit respective laser beams in one or more emission directions, a plurality of optical components situated to receive the laser beams from the plurality of flared laser oscillator waveguides and to provide the beams in a closely packed relationship, and an optical fiber optically coupled to the closely packed beams for coupling the laser beams out of the diode laser package.

A semiconductor laser including current block layers disposed between a p-type clad layer and a p-type light guide layer and a current confinement region which is a region between the current block layers is configured as follows. A width of an opening portion of an insulating layer is made narrow above a wide portion of the current confinement region in which the wide portion, a tapered portion, a narrow portion, a tapered portion and the wide portion are disposed in this order between an incidence side (HR side) and an emission side (AR side), and both ends of the wide portion are covered by an insulating layer. According to such a configuration, it is possible to suppress generation of super luminescence in the wide portion, and it is thus possible to achieve improvement in beam quality and higher output of the beam.

A semiconductor laser includes a semiconductor layer sequence having an n-conducting n-region, a p-conducting p-region and an intermediate active zone, an electrically conductive p-contact layer that impresses current directly into the p-region and is made of a transparent conductive oxide, and an electrically conductive and metallic p-contact structure located directly on the p-contact layer, wherein the semiconductor layer sequence includes two facets forming resonator end faces for the laser radiation, in at least one current-protection region directly on at least one of the facets a current impression into the p-region is suppressed, the p-contact structure terminates flush with the associated facet so that the p-contact structure does not protrude beyond the associated facet and vice versa, and the p-contact layer is removed from at least one of the current-protection regions and in this current-protection region the p-contact structure is in direct contact with the p-region over the whole area.

A method of manufacturing a semiconductor laser element includes: a cleaning process of holding a semiconductor light emission element that emits light from a facet thereof in a plasma sputtering device in which a target is covered with quartz, and cleaning the facet by irradiating the facet with plasma in the plasma sputtering device; and a dielectric film formation process of transporting the cleaned semiconductor light emission element to a deposition device without exposing the semiconductor light emission element to an atmosphere, and forming a dielectric film on the cleaned facet in the deposition device.