A method for fabricating a surface emitting laser includes the steps of: preparing a processing apparatus with a first part and a second part, the processing apparatus including a first heater and a second heater that heat the first part and the second part, respectively; preparing a wafer product for forming a surface emitting laser, the wafer product including a semiconductor post including a III-V compound semiconductor layer containing aluminum as a constituent element, the III-V compound semiconductor layer being exposed at a side face of the semiconductor post; after disposing the wafer product in the second part, energizing the first heater and the second heater; supplying a first gas containing no oxidizing agent to the processing apparatus; and after stopping supplying the first gas, oxidizing the III-V compound semiconductor layer by supplying a second gas containing an oxidizing agent to the processing apparatus.

A ring cavity device includes a passive ring waveguide and an input/output waveguide horizontally coupled to the passive ring waveguide, including an active waveguide structure vertically coupled to the passive ring waveguide and/or the input/output waveguide. The active waveguide structure compensates for the loss of the passive ring waveguide. A method for fabricating a ring cavity device is also included. The ring cavity device may obtain part of the gain by vertical coupling or mixed coupling (vertical coupling followed by horizontal coupling) thus to compensate the loss in the ring cavity device. Hence, the quality factor of the ring cavity device is improved.

Methods for wavelength determination of widely tunable lasers and systems thereof may be implemented with solid-state laser based photonic systems based on photonic integrated circuit technology as well as discrete table top systems such as widely-tunable external cavity lasers and systems. The methods allow integrated wavelength control enabling immediate system wavelength calibration without the need for external wavelength monitoring instruments. Wavelength determination is achieved using a monolithic solid-state based optical cavity with a well-defined transmission or reflection function acting as a wavelength etalon. The solid-state etalon may be used with a wavelength shift tracking component, e.g., a non-balanced interferometer, to calibrate the entire laser emission tuning curve within one wavelength sweep. The method is particularly useful for integrated photonic systems based on Vernier-filter mechanism where the starting wavelength is not known a-priori, or for compact widely tunable external cavity lasers eliminating the need for calibration of wavelength via external instruments.

A photoconducting layered material arrangement for producing or detecting high frequency radiation includes a semiconductor material including an alloy comprised of InGaAs, InGaAsSb, or GaSb, with an admixture of Al, which material is applied to a suitable support substrate in a manner such that the lattices are suitably adjusted, wherewith the semiconductor material comprised of InGaAlAs, InGaAlAsSb, or GaAlSb has a band gap of more than 1 eV, as a consequence of the admixed proportion of Al. The proportion x of Al in the semiconductor material In.sub.yGa.sub.1-y-xAl.sub.xAs is between x=0.2 and x=0.35, wherewith the proportion y of In may be between 0.5 and 0.55. The support substrate is InP or GaAs.

The disclosure relates to a method for processing a laser device, for example a III-V on silicon laser, including: providing a carrier substrate; forming a grating structure on the carrier substrate, wherein the grating structure delimits a cavity on a surface of the carrier substrate; placing a die in the cavity and bonding the die to the carrier substrate, wherein the die comprises an active region including a III-V semiconductor material; transferring the die from the carrier substrate to a silicon substrate by bonding an exposed side of the die to the silicon substrate and subsequently debonding the carrier substrate from the die; and forming a photonic structure, for example a silicon waveguide, coupled to the die.

A light source device includes: a first optical element through which emission light emitted from each of semiconductor laser elements propagates; a first light receiver that receives first propagating light that has propagated through the first optical element; a laser driving controller that controls the semiconductor laser elements; and a measurement circuit that measures a first output value that indicates a received-light intensity of the first propagating light that has been received by the first light receiver. The first light receiver is disposed downstream of the first optical element. The laser driving controller drives the semiconductor laser elements by using a plurality of values of a driving current that are different from each other. The measurement circuit measures the first output value of the first propagating light received by first light receiver for each of the plurality of values of the driving current that are different from each other.

A phosphor element includes: a phosphor part having an incident face for excitation light, an opposing face opposing the incident face, and a side face, the phosphor part converting at least a part of the excitation light incident onto the incident face into a fluorescence and emitting the fluorescence from the incident face; an integral low refractive index layer on the side face and opposing face of the phosphor part and having a refractive index lower than that of the phosphor part; and an integral reflection film covering a surface of the low refractive index layer. The area of the incident face of the phosphor part is larger than the area of the opposing face.

A corrected mesa structure for a VCSEL device is particularly configured to compensate for variations in the shape of the created oxide aperture that result from anisotropic oxidation. In particular, a corrected mesa shape is derived by determining the shape of an as-created aperture formed by oxidizing a circular mesa structure, and then ascertaining the compensation required to convert the as-created shape into a desired (“target”) shaped aperture opening. The compensation value is then used to modify the shape of the mesa itself such that a following anisotropic oxidation yields a target-shaped oxide aperture.

An optical device includes a light-emitting device integrated with a memory device. The memory device include a first electrode and a second electrode, and the light-emitting device includes a third electrode and the second electrode. In such configuration, a first voltage between the second electrode and the third electrode causes the light-emitting device to emit light of a first wavelength, and a second voltage between the first electrode and the second electrode while the memory device is at OFF state causes the light-emitting device to emit light of a second wavelength shorter than the first wavelength or while the memory device is at ON state causes the light-emitting device to emit light of a third wavelength longer than the first wavelength.

An optoelectronic component includes a layer structure including an active zone that generates electromagnetic radiation and is arranged in a plane, wherein the layer structure includes a top side and four side faces, first and third side faces are arranged opposite one another, second and fourth side faces are arranged opposite one another, a strip-shaped ridge structure is arranged on the top side of the layer structure and extends between the first side face and the third side face, the first side face constitutes an emission face for electromagnetic radiation, wherein a first recess is introduced into the top side of the layer structure laterally alongside the ridge structure, a second recess is introduced into the first recess, the second recess extends as far as the second side face, and at least one third recess is introduced into a base face of the first recess laterally alongside the ridge structure.