Patent classifications
H01S5/305
Surface-emitting laser device and method for manufacturing surface-emitting laser device
A method for manufacturing a GaN-based surface-emitting laser by an MOVPE includes: (a) growing a first cladding layer with a {0001} growth plane; (b) growing a guide layer on the first cladding layer; (c) forming holes which are two-dimensionally periodically arranged within the guide layer; (d) etching the guide layer by ICP-RIE using a chlorine-based gas and an argon; (e) supplying a gas containing a nitrogen to cause mass-transport, and then supplying the group-III gas for growth, whereby a first embedding layer closing openings of the holes is formed to form a photonic crystal layer; and (f) growing an active layer and a second cladding layer on the first embedding layer, The step (d) includes a step of referring to already-obtained data on a relationship of an attraction voltage and a ratio of gases in the ICP-RIE with a diameter distribution of air holes embedded, and applying the attraction voltage and the ratio to the ICP-RIE.
A METHOD FOR GAN VERTICAL MICROCAVITY SURFACE EMITTING LASER (VCSEL)
Structures and methods for forming highly uniform and high-porosity gallium-nitride layers with sub-100-nm pore sizes are described. Electrochemical etching of heavily-doped gallium nitride at low bias voltages in concentrated nitric acid is used to form the porous gallium nitride. The porous layers may be used in reflective structures for integrated optical devices such as VCSELs and LEDs.
LIGHT EMITTING DEVICE WITH TRANSPARENT CONDUCTIVE GROUP-III NITRIDE LAYER
A group III-nitride semiconductor device comprises a light emitting semiconductor structure comprising a p-type layer and an n-type layer operable as a light emitting diode or laser. On top of the p-type layer there is arranged an n+ or n++-type layer of a group III-nitride, which is transparent to the light emitted from the underlying semiconductor structure and of sufficiently high electrical conductivity to provide lateral spreading of injection current for the light-emitting semiconductor structure.
Widely-tunable harmonic frequency comb in a quantum cascade laser
A wireless communication device includes a quantum cascade laser (QCL) configured to generate a terahertz (THz) or microwave carrier signal. The QCL includes a laser waveguide, a laser optical gain medium incorporated in the laser waveguide, and at least one electrode. An antenna may be integrated with the electrode. The device may be a transmitter, the electrode configured to receive an input baseband signal, the QCL configured to couple the THz or microwave carrier signal and the input baseband signal into a THz or microwave communication signal, and the antenna configured to transmit the THz or microwave communication signal. The device may be a receiver, the antenna configured to receive a THz or microwave communication signal, and the QCL configured to de-couple the THz or microwave communication signal from the THz or microwave carrier signal into an output baseband signal.
Modulation doped semiconductor laser and manufacturing method therefor
A modulation doped semiconductor laser includes a multiple quantum well composed of a plurality of layers including a plurality of first layers and a plurality of second layers stacked alternately and including an acceptor and a donor; a p-type semiconductor layer in contact with an uppermost layer of the plurality of layers; and an n-type semiconductor layer in contact with a lowermost layer of the plurality of layers, the plurality of first layers including the acceptor so that a p-type carrier concentration is 10% or more and 150% or less of the p-type semiconductor layer, the plurality of second layers containing the acceptor so that the p-type carrier concentration is 10% or more and 150% or less of the p-type semiconductor layer, the plurality of second layers containing the donor, and an effective carrier concentration corresponding to a difference between the p-type carrier concentration and an n-type carrier concentration is 10% or less of the p-type carrier concentration of the plurality of second layers.
CHARGED POLARON-POLARITONS IN AN ORGANIC SEMICONDUCTOR MICROCAVITY
A method of generating a light-matter hybrid species of charged polaritons at room temperature includes providing an organic semiconductor microcavity being a doped organic semiconductor sandwiched in a microcavity capable of generating an optical resonance and coupling light to the polaron optical transition in the organic semiconductor microcavity thereby forming polaron-polaritons. The doped organic semiconductor may be a hole/electron transport material having a polaron absorption coefficient exceeding 10.sup.2 cm.sup.−1 and capable of generating a polaron optical transition with a linewidth smaller than a predetermined threshold. The optical resonance of the microcavity has a resonance frequency matched with the polaron optical transition.
GAIN MEDIUM STRUCTURE FOR SEMICONDUCTOR OPTICAL AMPLIFIER WITH HIGH SATURATION POWER
A gain medium for semiconductor optical amplifier in high-power operation includes a substrate with n-type doping; a lower clad layer formed overlying the substrate; a lower optical confinement stack overlying the lower clad layer; an active layer comprising a multi-quantum-well heterostructure with multiple well layers characterized by about 0.8% to 1.2% compressive strain respectively separated by multiple barrier layers characterized by about −0.1% to −0.5% tensile strain. The active layer overlays the lower optical confinement stack. The gain medium further includes an upper optical confinement stack overlying the active layer, the upper optical confinement stack being set thinner than the lower optical confinement stack; an upper clad layer overlying the upper optical confinement stack; and a p-type contact layer overlying the upper clad layer.
NITRIDE-BASED SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF NITRIDE-BASED SEMICONDUCTOR CRYSTAL
A manufacturing method of a nitride-based semiconductor light-emitting element includes: forming an n-type nitride-based semiconductor layer; forming, on the n-type nitride-based semiconductor layer, a light emission layer including a nitride-based semiconductor; forming, on the light emission layer in an atmosphere containing a hydrogen gas, a p-type nitride-based semiconductor layer while doping the p-type nitride-based semiconductor layer with a p-type dopant at a concentration of at least 2.0×10.sup.18 atom/cm.sup.3; and annealing the p-type nitride-based semiconductor layer at a temperature of at least 800 degrees Celsius in an atmosphere not containing hydrogen. In this manufacturing method, a hydrogen concentration of the p-type nitride-based semiconductor layer after the annealing is at most 5.0×10.sup.18 atom/cm.sup.3 and at most 5% of the concentration of the p-type dopant, and a hydrogen concentration of the light emission layer is at most 2.0×10.sup.17 atom/cm.sup.3.
Electro-absorption optical modulator and manufacturing method thereof
A electro-absorption optical modulator includes a multiple quantum well composed of a plurality of layers including a plurality of quantum well layers and a plurality of barrier layers that are alternately stacked, the plurality of quantum well layers and the plurality of barrier layers including an acceptor and a donor; a p-type semiconductor layer in contact with an uppermost layer of the plurality of layers; and an n-type semiconductor layer in contact with a lowermost layer of the plurality of layers, the multiple quantum well being 10% or more and 150% or less of the p-type semiconductor layer in a p-type carrier concentration, and in the multiple quantum well, an effective carrier concentration which corresponds to a difference between the p-type carrier concentration and an n-type carrier concentration is ±10% or less of the p-type carrier concentration of the multiple quantum well.
ELECTRODE, SEMICONDUCTOR LASER ELEMENT, AND CHIP-ON-SUBMOUNT
An electrode comprising a Ti layer and a Pt layer that are sequentially laid on a surface of a p-type semiconductor layer. Further, a thermal impedance per unit area of a contact portion that is in contact with the surface of the p-type semiconductor layer is equal to or smaller than 1.2×10.sup.4 K/W.Math.m.sup.2.