A light emitting device includes: a substrate including a main surface; a first projection positioned on the main surface, the first projection including an upper surface and first and second lateral surfaces, wherein the first lateral surface of the first projection comprises a first reflective part, and the second lateral surface of the first projection comprises a second reflective part; a first laser element configured to irradiate laser light to the first reflective part; a second laser element configured to irradiate laser light to the second reflective part; and a first optical member fixed to the upper surface of the first projection, wherein the first optical member comprises a first lens part positioned above the first reflective part, and a second lens part positioned above the second reflective part.

A light-emitting apparatus includes: a body having an inner space and an opening, the body incorporating at least one semiconductor laser element the body being made of a metal; and a sealing glass member joined to the body, to hermetically seal the inner space. The sealing glass member has a surface adjacent to the body, the surface of the sealing glass member being provided with a base joint layer in a joint region where the sealing glass member and the body are joined together, the base joint layer being made of a metal having a thermal expansion coefficient that falls between a thermal expansion coefficient of the sealing glass member and a thermal expansion coefficient of the metal constituting the body. The sealing glass member is joined to the body with the base joint layer and a solder-containing joint layer interposed between the sealing glass member and the body.

Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.

A VCSEL array comprises series-connected VCSEL sub-arrays formed on a single chip. The VCSEL sub-arrays each comprises VCSEL emitters fabricated on a semi-insulating layer. A common cathode contact of a VCSEL sub-array is electrically connected to a common anode contact of a neighboring VCSEL sub-array. To reduce leakage, the bandgap energy level of the semi-insulating layer is higher than the photon energy of the output beam. In one embodiment, the semi-insulating layer is grown on a conductive layer. A common cathode contact of the last VCSEL sub-array in a series is electrically connected to the conductive layer. In another embodiment, multiple wire-bonding areas are electrically connected to common anode contacts of multiple VCSEL sub-arrays respectively. The wire-bonding areas provide different input impedance options for a VCSEL array.

A light emitting device includes light emitting elements that are arranged on a front surface of a substrate and emit light, a first electrode that is connected to a first line controlling light emission of a light emitting element included in a first light emitting element group, and a second electrode that is connected to a second line controlling light emission of a light emitting element included in a second light emitting element group, in which the first line is provided through a space above the light emitting element of the second light emitting element group, and a position at which the first electrode is disposed with respect to a center of the light emitting element and a position at which the second electrode is disposed with respect to a center of the light emitting element are different from each other.

A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.

Disclosed is a VCSEL array with improved optical properties. According to one aspect of the present embodiment, a VCSEL array has improved output light characteristics by minimizing the effects of resistance, inductance, and capacitance inevitably caused in a package.

A light-emitting device includes: a substrate comprising a base; a semiconductor laser element disposed on an upper surface of the base; a sealing member located above the base and fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens member fixed to the sealing member by adhesive, the lens member comprising a lens section through which light emitted from the semiconductor laser element passes. A space between the sealing member and the lens member is open to an area outside the light-emitting device.

A light-emitting module includes a wiring substrate, first and second bases, three or more first submounts, four or more second submounts, three or more first light-emitting elements, and four or more second light-emitting elements. The first and second bases are bonded to and electrically connected to the wiring substrate. The first submounts are arranged side by side along a first alignment direction on the first base, and the second submounts are arranged side by side along a second alignment direction on the second base. A number of the second submounts is greater than a number of the first submounts by one or more. The first and second light-emitting elements are arranged respectively on the first and second submounts. A length of each of the first submounts in the first alignment direction is greater than a length of each of the second submounts in the second alignment direction.

A laser connection module including: multiple superposed electrodes connected in alternating order with opposite electricity supply poles; at least one laser diode mounted between the opposite surfaces of consecutive electrodes, making contact with them; an external structure delimiting an open space located along a light-emitting area of the laser diodes and suitable for containing the set of superposed electrodes and laser diodes; at least one tightener mounted on a first end of the external structure and which presses the set of electrodes and laser diodes against a second opposite end of the structure, establishing the fixation and mutual contact thereof; and an intermediate protective plate disposed between the at least one tightener and the end electrode closest to the at least one tightener.