A semiconductor device includes a detector structure. The detector structure includes an integrated circuit on a substrate, and a photo detector on an upper surface of the integrated circuit that is opposite the substrate, where the substrate is non-native to the photo detector. A System-on-Chip apparatus includes at least one laser emitter on a non-native substrate, at least one photo detector on the non-native substrate, and an input/output circuit. The at least one photo detector of the second plurality of photo detectors is disposed on an integrated circuit between the at least one photo detector and the non-native substrate to form a detector structure.

The present disclosure describes a diode laser array module that includes a plurality of diode lasers, a cooling module, and a pin connector module. The cooling module includes a heat sink that has structural features configured to allow pins of the diode lasers to be connected to a first conductive portion of the pin connector module within a recessed area in the bottom surface of the cooling module, where a second conductive portion of the pin connector module moves beyond the recessed area and is configured to be connected to a driving circuit module at a location outside of the recessed area in the bottom surface of the cooling module. Similarly principles are u to construct a diode laser array module comprising bank packaged diode laser modules, pin connector modules for the bank packaged diode laser modules, and a cooling module.

A laser array includes a plurality of laser diodes arranged and electrically connected to one another on a surface of a non-native substrate. Respective laser diodes of the plurality of laser diodes have different orientations relative to one another on the surface of the non-native substrate. The respective laser diodes are configured to provide coherent light emission in different directions, and the laser array is configured to emit an incoherent output beam comprising the coherent light emission from the respective laser diodes. The output beam may include incoherent light having a non-uniform intensity distribution over a field of view of the laser array. Related devices and fabrication methods are also discussed.

A light source device according to an embodiment is used with a light guide member and a wavelength converting member, and includes a light-emitting element, a light sensor, and a driving unit. The light-emitting element radiates a light beam to be incident on a first end of the light guide member by being supplied with a drive current. The light sensor detects signal light, which has been incident on a second end of the light guide member and transmitted to the first end. The driving unit supplies the drive current to the light-emitting element and controls the drive current based on a result of detection of the signal light.

A diode laser arrangement for the cooling of and supply of electrical current to diode laser devices, having at least two stacks, each having a diode laser device which is configured to emit a laser beam, an upper cooling device, and a lower cooling device. The diode laser device is arranged on the upper cooling device and on the lower cooling device such that the diode laser device is arranged between the upper cooling device and the lower cooling device. The upper and lower cooling devices are in each case electrically connected to the diode laser device arranged therebetween. The upper cooling device and/or the lower cooling device of a stack are in each case formed as a microchannel cooler. The upper cooling device and/or the lower cooling device of a stack in each case have substantially no electrical insulation with respect to the diode laser device arranged therebetween.

A light emitting device includes: a base including a first wiring, a second wiring, and a third wiring; a first semiconductor laser element electrically connected to the first wiring and the second wiring, at an upper surface side of the base; and a second semiconductor laser element electrically connected to the second wiring and the third wiring, at the upper surface side of the base. The base includes a frame surrounding the first semiconductor laser element and the second semiconductor laser element in a top view. The light emitting device further includes a base cap fixed to the frame such that the first semiconductor laser element and the second semiconductor laser element are enclosed in a space defined by the base and the base cap. The first semiconductor laser element and the second semiconductor laser element are connected in series.

A self-calibrating driver circuit (100, 300, 400, 500, 700) for a laser diode is disclosed. The circuit comprises a configurable current source (105, 305, 405, 505), a current mirror (115, 315, 415) configured to mirror a current from the configurable current source to a first transistor (120, 320, 420, 520, 720) and to a second transistor (125, 325, 425, 725), and a control circuit (140, 340, 440). The control circuit is configured to monitor a current through the first transistor at a first time, and to configure the current source based on the current through the first transistor to provide a desired current to the second transistor for driving the laser diode at a subsequent second time. A radiation-emitting device comprising one or more of the self-calibrating driver circuits and at least one radiation-emitting element is also disclosed.

A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.

An optoelectronic semiconductor device comprises a plurality of laser devices. Each of the laser devices is configured to emit electromagnetic radiation. The laser devices are horizontally arranged. A first laser device of the plurality of laser devices is configured to emit electromagnetic radiation having a first wavelength different from the wavelength of a further laser device of the plurality of laser devices. A difference between the first wavelength and the wavelength of the further laser device is less than 20 nm.

A laser diode apparatus includes a laser diode array having an emission surface and a mounting surface. A heatsink is in thermal communication with the laser diode array at the mounting surface. The heatsink extends perpendicularly away from at least one edge of the emission surface. Positive and negative electrical terminal blocks are in mechanical communication with the heatsink opposite the laser diode array. Electrical foils are in electrical communication with the laser diode array and the positive and negative terminals. The electrical foils extend perpendicularly away from the emission surface. The positive and negative electrical terminal blocks are electrically isolated from the heatsink. A cross-sectional footprint of the heatsink, positive and negative electrical terminal blocks, and electrical foils is not larger than 120% of a cross-sectional footprint of the laser diode array.