A laser device includes a laser oscillator configured to emit a laser beam, and an optical unit configured to receive the laser beam and emit the laser beam outside. The optical unit includes: a partially transmissive mirror configured to reflect a part of the laser beam toward the outside and transmit a remaining part of the laser beam; a diffusion plate configured to diffuse the laser beam which has passed through the partially transmissive mirror and deflect the laser beam in a predetermined direction, at a predetermined diffusion angle; and a photodiode configured to receive the laser beam deflected by the diffusion plate, and output an electric signal. The laser device is configured such that deviation of an optical axis of the laser beam is monitored based on the electric signal of the photodiode.

An addressable vertical cavity surface emitting laser (VCSEL) array may generate structured light in dot patterns. The VCSEL array includes a plurality of traces that control different groups of VCSELs, such that each group of VCSELs may be individually controlled. The VCSEL groups are arranged such that they emit a dot pattern, and by modulating which groups of VCSELs are active a density of the dot pattern may be adjusted. The VCSEL array may be part of a depth projector that projects the dot pattern into a local area. A projection assembly may replicate the dot pattern in multiple tiles.

In some implementations, an optical device (e.g., a monolithic master oscillator power amplifier (MOPA) diode) may include a first facet, one or more gratings, an amplifier structure terminated with a second facet, and an oscillator array that includes multiple singlemode oscillators coupled to the first facet and to the one or more gratings. In some implementations, the multiple singlemode oscillators may be configured to generate multiple seed beams and to transmit the multiple seed beams into the amplifier structure through the one or more gratings.

An apparatus for stacking and coating of very short cavity laser diode arrays. The apparatus includes an array holder fixture to securely hold the very short cavity laser diode arrays and spacer arrays, and a stacking plate. The array holder fixture including a top-side presser to secure a stack of very short cavity laser arrays and spacer arrays from a first end of the stack, a bottom-side presser to secure the stack of very short cavity laser arrays and spacer arrays from a second end of the stack, and a pair of side clamps. The array holder fixture is operatively coupled to the stacking plate during the stacking of the very short cavity laser diode arrays and spacer arrays.

An apparatus comprising an integrated circuit chip comprising a first surface region and a second surface region adjacent to the first surface region; a substrate coupled to the integrated circuit chip through a plurality of connections comprising solder; and underfill between the substrate and the integrated circuit chip, wherein the underfill contacts the second surface region, but does not contact the first surface region.

A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.

A light emission module includes a first light emission unit that includes a first light emission device and emits first light. The first light emission device includes a plurality of first light emission portions, each including a light emission surface, where light from a plurality of first light emission elements is emitted, a heat dissipation surface provided opposite to the light emission surface, and a connection portion being positioned between the light emission surface and the heat dissipation surface and including a wiring mounting surface where the light emission elements are electrically connected. The light emission module further includes a first optical member that reflects the first light, a housing including a base member where the first light emission unit and the first optical member are disposed and a lid member surrounding the light emission device surrounding the first light emission unit and the first optical member that are disposed on the base member, and a heat sink being connected to the heat dissipation surface and including a mounting surface where the first light emission device is mounted. The wiring mounting surface extends upward upper than a first upper surface of the housing, and a portion of the wiring mounting surface is exposed to the outside of the housing.

A seed laser is configured to emit seed laser light. A plurality of optical amplifiers is configured to generate amplified laser light by amplifying the seed laser light. Each of the optical amplifiers is configured to separately direct its respective amplified laser light to a medium without being optically combined within the laser assembly with any of the other amplified laser light emitted by other optical amplifiers in the plurality of optical amplifiers.

Configurations are disclosed for multi-wavelength optical devices and systems. In particular, multi-wavelength optical devices that include separate chips optically connected via phonic wire bonds. The disclosed configurations can utilize photonic wire bond interconnects and photonic wire bond interconnection techniques, which may facilitate low-cost implementation of wavelength division multiplexed optical systems.

A light emitting device includes semiconductor laser elements, a frame part, a light-reflective member, a step part, metal films, wires, and a first protective element. The frame part surrounds a bottom surface on which the semiconductor laser elements are disposed. The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part. The step part is formed along a second inner lateral surface of the frame part, and disposed inside of the frame. The metal films are provided on an upper surface of the step part. The wires electrically connect the semiconductor laser elements respectively to the metal films. The first protective element is disposed on the upper surface of the step part and on a light traveling side of the laser light with respect to a plane including an emitting end surface of the first semiconductor laser element.