Methods for fabricating gas discharge tubes. In some embodiments, a method for fabricating a gas discharge tube (GDT) device can include providing or forming an insulator substrate having first and second sides and defining an opening. The method can further include providing or forming a first electrode and a second electrode. The method can further include forming a first glass seal between the first electrode and the first side of the insulator substrate, and a second glass seal between the second electrode and the second side of the insulator substrate, such that the first and second glass seals provide a hermetic seal for a chamber defined by the opening and the first and second electrodes.

Gas discharge tube having glass seal. In some embodiments, a gas discharge tube can include an insulator layer having first and second sides and defining an opening, and first and second electrodes that cover the opening on the first and second sides of the insulator layer, respectively. The gas discharge tube can further include a first glass layer implemented between the first electrode and the first side of the insulator layer, and a second glass layer implemented between the second electrode and the second side of the insulator layer, such that the first and second glass layers provide a seal for a chamber defined by the opening and the first and second electrodes.

A triggered vacuum gap (TVG) device that has application as a closing switch for synchronized closing in distribution and transmission power systems. The TVG device controllably sustains a current arc in the device through initial current zeros created by power system transients and, thereby, prevents premature interruption of the closing operation. The TVG device includes main electrodes defining a vacuum gap therebetween and a triggering electrode providing a triggering gap between one main electrode and the triggering electrode. The TVG device also includes a triggering circuit having a high voltage impulse source that supplies a fast rising impulse voltage to the one main electrode and the triggering electrode for creation of a plasma to provide an initial breakdown of the triggering gap and a low voltage unidirectional current source that supplies current to the one main electrode and the triggering electrode once the first triggering gap breakdown has occurred.

A method for producing a gas-tight metal-ceramic join is disclosed. In an embodiment a method includes providing at least one ceramic main body having a first end face and a second end face, applying a metallization to at least a partial region of the end faces of the main body, applying a nickel layer to the metallized partial region of the end faces, applying a brazing paste to the metallized partial region of the first end face and/or the second end face of the main body, drying the brazing paste, and firing the brazing paste.

A method for producing a gas-tight metal-ceramic join is disclosed. In an embodiment a method includes providing at least one ceramic main body having a first end face and a second end face, applying a metallization to at least a partial region of the end faces of the main body, applying a nickel layer to the metallized partial region of the end faces, applying a brazing paste to the metallized partial region of the first end face and/or the second end face of the main body, drying the brazing paste, and firing the brazing paste.

A gas arrester is disclosed. In an embodiment a gas arrester for a data line system includes a discharge electrode, a plurality of individual electrodes configured to connect data lines and a common gas discharge region formed between the individual electrodes and the discharge electrode, wherein the gas arrester is configured to reduce voltage differences between lines or line pairs of the data line system with more than 2 lines.

A gas arrester is disclosed. In an embodiment a gas arrester for a data line system includes a discharge electrode, a plurality of individual electrodes configured to connect data lines and a common gas discharge region formed between the individual electrodes and the discharge electrode, wherein the gas arrester is configured to reduce voltage differences between lines or line pairs of the data line system with more than 2 lines.

Methods for fabricating gas discharge tubes. In some embodiments, a method for fabricating a gas discharge tube (GDT) device can include providing or forming an insulator substrate having first and second sides and defining an opening. The method can further include providing or forming a first electrode and a second electrode. The method can further include forming a first glass seal between the first electrode and the first side of the insulator substrate, and a second glass seal between the second electrode and the second side of the insulator substrate, such that the first and second glass seals provide a hermetic seal for a chamber defined by the opening and the first and second electrodes.

A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.