A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

The present invention relates to a method of coating-peeling and a coating-peeling apparatus. The method of coating-peeling includes a gripping step and a peeling step, and peels by a pair of peeling blades peeling target portions of an insulating coating covering peeling target side surfaces of a rectangular conductor wire. In the gripping step, abutting sections of a pair of gripping members abut on gripping target portions of the insulating coating, whereby the rectangular conductor wire is gripped between the abutting sections. In the peeling step, in a state where the rectangular conductor wire has been gripped by the gripping members, the peeling blades are moved relatively following a surface direction of the peeling target side surfaces while opposing each other sandwiching the peeling target side surfaces, whereby the peeling target portions are peeled.

An apparatus for stripping a polymeric outer cladding on a circular core of an elongated object including: a frame having an object inlet end and a opposite outlet end, and as seen in a direction from the cable inlet end towards the outlet end a cutting device, for stripping the cladding from the core, and a centering device for centering the elongated object, the cutting device including a table rotatable around a central rotational axis R between the object inlet end and the outlet end and provided with a one cutting tool for stripping the cladding by cutting, and the centering device including at least one centering element to engage the outer surface of the core and centering the centre line of the core and the elongated object to coincide with the central rotational axis of the cutting device.

A method produces straight or bent shaped parts from insulated flat material, and a wire processing machine suitable for carrying out the method has a stripping device for stripping portions of the insulated flat material.

An exposed terminal for a wire conductor, and a process for preparing the exposed terminal includes executing, via a mechanical device, a mechanical ablation process to remove the insulative material from an outer surface of the plurality of square edges along a predefined length of the portion of the wire conductor. The process also includes executing, via a laser tool, a laser ablation process to remove the insulative material from the first pair of opposed faces along the predefined length of the portion of the wire conductor; and executing, via the laser tool, the laser ablation process to remove the insulative material from the second pair of opposed faces along the predefined length of the portion of the wire conductor.

A method for forming contact surfaces by peeling the insulation on the insulated conductor busbars for energy distribution systems.

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

A device for removing a sheath of electrical conductors of a preferably multicore cable (K), preferably comprises at least one holding arrangement/clamping device for clamping the cable (K), and a measuring arrangement (1), which can preferably be rotated about the longitudinal cable axis, for the sheath. A pull-off device (A) for the at least partially cut sheath is integrated into the device. This pull-off device (A) comprises pull-off mechanism (5), which is designed for non-positive connection to the sheath and for exertion of a force on the sheath parallel to the cable axis. The invention further relates to a method of removing an inner sheath of electrical conductors of a multicore cable (K).

According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.