A cutting method of the invention cuts a flat wire covered with a film, using a pair of first blades, and a second blade that is arranged between the pair of first blades. This cutting method includes a step of forming tapered cuts in an upper surface of the flat wire, by the pair of first blades cutting part way into the flat wire in a thickness direction, from the upper surface of the flat wire, and a step of cutting the flat wire by the second blade, between the two cuts, so as to form a chamfer on both side surfaces next to the upper surface of the flat wire.

A cable having conductors that may be easily exposed in preparation for electrical connection, without requiring the use of tools, is provided. The insulating layer of the cable has at least one relatively weak portion extending along the length of the cable that is configured to allow the insulating layer to split, thereby exposing the wire without the use of tools.