An embodiment of the present disclosure discloses an over-temperature protection circuitry and a driving method. The circuit includes a source circuit, a comparator circuit and an output circuit, wherein the comparator circuit includes a thermistor, a first resistor and a comparator, the source circuit is connected to a first input terminal of the comparator via the thermistor and is connected to a second input terminal of the comparator via the first resistor; and the comparator circuit is configured to compare a first signal from the first input terminal with a second signal from the second input terminal, and output a control signal according to a comparison result, the control signal is an over-temperature control signal in the case that the comparison result indicates that the temperature is greater than or equal to a protection threshold, and the output circuit is configured to output an disenabling signal.

A system for a vehicle includes an electrical port that charges a vehicle battery via a connection to a power source, and a controller configured to interrupt charging and to display an alert responsive to temperature at the connection being greater than a threshold and voltage of a control pilot terminal of the port being at an overtemperature state voltage that is different from each of disconnected, connected, ready, and fault state voltages.

A universal serial bus (USB) cable including a power conductor configured to transmit power between a first device and a second device, a configuration channel (CC) conductor configured to allow the first device and the second device to determine whether a connection has been established via the USB cable, and a first positive temperature coefficient (PTC) element coupled to the CC conductor and configured to mitigate current flowing through the CC conductor if a temperature of the first PTC element rises above a predefined trip temperature.

A short circuit protection circuit may comprise a first configuration channel line extending from a first connector, a first resistor connected to the first configuration channel line; a voltage divider connected to a junction point on the first configuration channel line, the voltage divider comprising a second resistor and a thermistor, and a field effect transistor (FET) comprising a source, gate, and drain. The thermistor may be connected to a ground line. The drain of the FET may be connected to the first resistor, the source of the FET may be connected to the ground line, and the gate of the FET may be connected to a second junction point between the second resistor and thermistor of the voltage divider.

An overvoltage protection device includes: input terminals; output terminals; at least two overvoltage protection elements for forming staggered protection levels; and at least one longitudinal element electrically connecting an input terminal and an output terminal to conduct an operating current. In order to form a first protection level, a first overvoltage protection device is connected to two input terminals on an input side upstream of the at least one longitudinal element, and, in order to form a second protection level, a second overvoltage protection element is connected to two output terminals on an output side and downstream of the at least one longitudinal element, the at least one longitudinal element influencing a response of the at least two overvoltage protection elements in case of an overvoltage. The at least one longitudinal element is provided with a thermal overload protection device for reducing a possible current flow.

A receptacle includes an outlet, an interruption mechanism structured to activate to de-energize the outlet, a temperature sensing circuit including a resistor and a thermistor arranged as a voltage divider, wherein the thermistor has a resistance proportional to temperature, a comparator circuit structured to compare an output of the temperature sensing circuit to a predetermined reference voltage and to selectively output a signal based on the comparison of the output of the temperature sensing circuit and the predetermined reference voltage. The interruption mechanism is structured to activate to de-energize the outlet in response to the comparator circuit outputting the signal.

Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.

A direct-current voltage supply circuit includes a first field effect transistor in a power line, a voltage divider including a first fixed resistor and a positive temperature coefficient thermistor between the power line and a ground line, a thyristor connected at an anode thereof to the power line, with a second field effect transistor interposed therebetween, connected at a gate thereof to a node in the voltage divider, and connected at a cathode thereof to the ground line, with a second fixed resistor interposed therebetween, and a third fixed resistor connected in parallel with the thyristor and the second field effect transistor. If abnormal heating increases the resistance of the positive temperature coefficient thermistor, the first field effect transistor is turned off and the supply of direct-current voltage is stopped.

A semiconductor package includes a die pad and leads extending from the die pad. Each lead has a free end with outer surfaces extending at angles from one another. An electrically conductive plating material covers at least portions of the outer surfaces. A die attached to the die pad is electrically connected to the leads. An insulating layer extends over the leads and the die such that the free ends of the leads are exposed.

A device includes a relative temperature detector configured to determine a temperature difference between a device temperature sensed near a switch device and an ambient temperature sensed outside the switch device. The relative temperature detector is configured to generate a relative temperature output signal based on comparing the temperature difference to a relative temperature threshold. A power detector is configured to generate a power level signal based on comparing an indication of switch power of the switch device to a power threshold. The power level signal specifies whether the indication of switch power is above or below the power threshold. A thermal capacity control is configured to disable the switch device based on the power level signal specifying that the indication of switch power is above the power threshold and based on the relative temperature output signal indicating the temperature difference is above the relative temperature threshold.