A method to control the temperature of an electromagnetic pump in an apparatus wherein a liquid metal is supplied through a feed tube from a container adapted to contain a liquid metal to an evaporator device in a vacuum chamber, wherein the temperature of the electromagnetic pump is controlled by controlling one or more of the force exerted on the liquid metal in the container, the current of the electromagnetic pump, and/or the strength of the magnet field of the electromagnetic pump.

A method to control the temperature of an electromagnetic pump in an apparatus wherein a liquid metal is supplied through a feed tube from a container adapted to contain a liquid metal to an evaporator device in a vacuum chamber, wherein the temperature of the electromagnetic pump is controlled by controlling one or more of the force exerted on the liquid metal in the container, the current of the electromagnetic pump, and/or the strength of the magnet field of the electromagnetic pump.

The present disclosure relates to a technical field of fluid delivering. An electromagnetic pump is provided. The electromagnetic pump includes a drive mechanism and a magnetic assembly, where the magnetic assembly is configured to be driven by the drive mechanism to generate a varying magnetic field.

The present disclosure relates to a technical field of fluid delivering. An electromagnetic pump is provided. The electromagnetic pump includes a drive mechanism and a magnetic assembly, where the magnetic assembly is configured to be driven by the drive mechanism to generate a varying magnetic field.

A magnetofluid pump device for IGBT heat dissipation and a test method therefor are provided. The magnetofluid pump device uses a liquid metal as a coolant, which can absorb more heat than an ordinary water-cooling device and better dissipate heat for IGBT chips. Temperature and pressure changes in an inlet pipe and an outlet pipe of a magnetofluid pump can be monitored in real time through temperature sensors and pressure sensors, and temperature changes of the IGBT chips can be observed in real time through a thermal imager. The test method for the magnetofluid pump device for IGBT heat dissipation proposed by the present invention is simple and easy to implement. A magnetic fluid can be driven to flow by energizing positive and negative electrodes in the magnetofluid pump under the action of magnetic fields, and water-cooling equipment can dissipate heat for the magnetic fluid in the magnetofluid pump.

A magnetofluid pump device for IGBT heat dissipation and a test method therefor are provided. The magnetofluid pump device uses a liquid metal as a coolant, which can absorb more heat than an ordinary water-cooling device and better dissipate heat for IGBT chips. Temperature and pressure changes in an inlet pipe and an outlet pipe of a magnetofluid pump can be monitored in real time through temperature sensors and pressure sensors, and temperature changes of the IGBT chips can be observed in real time through a thermal imager. The test method for the magnetofluid pump device for IGBT heat dissipation proposed by the present invention is simple and easy to implement. A magnetic fluid can be driven to flow by energizing positive and negative electrodes in the magnetofluid pump under the action of magnetic fields, and water-cooling equipment can dissipate heat for the magnetic fluid in the magnetofluid pump.

A magnetofluid pump device for IGBT heat dissipation and a test method therefor are provided. The magnetofluid pump device uses a liquid metal as a coolant, which can absorb more heat than an ordinary water-cooling device and better dissipate heat for IGBT chips. Temperature and pressure changes in an inlet pipe and an outlet pipe of a magnetofluid pump can be monitored in real time through temperature sensors and pressure sensors, and temperature changes of the IGBT chips can be observed in real time through a thermal imager. The test method for the magnetofluid pump device for IGBT heat dissipation proposed by the present invention is simple and easy to implement. A magnetic fluid can be driven to flow by energizing positive and negative electrodes in the magnetofluid pump under the action of magnetic fields, and water-cooling equipment can dissipate heat for the magnetic fluid in the magnetofluid pump.

A magnetofluid pump device for IGBT heat dissipation and a test method therefor are provided. The magnetofluid pump device uses a liquid metal as a coolant, which can absorb more heat than an ordinary water-cooling device and better dissipate heat for IGBT chips. Temperature and pressure changes in an inlet pipe and an outlet pipe of a magnetofluid pump can be monitored in real time through temperature sensors and pressure sensors, and temperature changes of the IGBT chips can be observed in real time through a thermal imager. The test method for the magnetofluid pump device for IGBT heat dissipation proposed by the present invention is simple and easy to implement. A magnetic fluid can be driven to flow by energizing positive and negative electrodes in the magnetofluid pump under the action of magnetic fields, and water-cooling equipment can dissipate heat for the magnetic fluid in the magnetofluid pump.

Provided is an induced electromagnetic pump using a rotating magnetic field. The induced electromagnetic pump includes a flow channel pipe through which a conducting fluid passes, a fluid inlet formed at an outer surface of the flow channel pipe in one direction and through which the conducting fluid flows into the flow channel pipe, a fluid outlet formed at the outer surface at which fluid inlet is formed in the same direction thereas and through which the conducting fluid is discharged from the flow channel pipe, and a plurality of electromagnetic coils arranged at certain intervals on one surface of the flow channel pipe and connected to U-phase power, V-phase power, and W-phase.

Provided is an induced electromagnetic pump using a rotating magnetic field. The induced electromagnetic pump includes a flow channel pipe through which a conducting fluid passes, a fluid inlet formed at an outer surface of the flow channel pipe in one direction and through which the conducting fluid flows into the flow channel pipe, a fluid outlet formed at the outer surface at which fluid inlet is formed in the same direction thereas and through which the conducting fluid is discharged from the flow channel pipe, and a plurality of electromagnetic coils arranged at certain intervals on one surface of the flow channel pipe and connected to U-phase power, V-phase power, and W-phase.