An integrated circuit includes a first coupling terminal and a second coupling terminal disposed along a first side, an oscillation circuit which is electrically coupled to a resonator element via the first coupling terminal and the second coupling terminal, a temperature sensor, a temperature compensation circuit configured to compensate a temperature characteristic of the resonator element based on an output signal of the temperature sensor, and an output circuit to which a signal output from the oscillation circuit is input, and which is configured to output an oscillation signal, wherein d1<d0 and d2<d0, in which an end-to-end distance between the temperature sensor and the output circuit is d0, an end-to-end distance between the first coupling terminal and the output circuit is d1, and an end-to-end distance between the second coupling terminal and the output circuit is d2.

A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.

A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.

Embodiments of the present disclosure provide a server data sending method and a server data sending apparatus. The method can include: acquiring, by a server, crystal oscillator error information and operating rate information of a terminal; setting, by the server, preamble length information according to the crystal oscillator error information and the operating rate information; and sending, by the server, a downlink data frame to the terminal, the downlink data frame comprising a preamble aligned with the preamble length information.

Embodiments of the present disclosure provide a server data sending method and a server data sending apparatus. The method can include: acquiring, by a server, crystal oscillator error information and operating rate information of a terminal; setting, by the server, preamble length information according to the crystal oscillator error information and the operating rate information; and sending, by the server, a downlink data frame to the terminal, the downlink data frame comprising a preamble aligned with the preamble length information.

A circuit device includes an oscillation circuit configured to generate an oscillation signal, a first pre-driver disposed in a posterior stage of the oscillation circuit, a first output driver disposed in a posterior stage of the first pre-driver, a first regulator configured to supply a first regulated voltage to the first pre-driver, and a second regulator configured to supply a second regulated voltage to the first output driver, wherein the second regulator is shorter in transient response time than the first regulator.

Systems and methods are disclosed for adjusting clock frequencies of endpoint devices in a mesh network for narrowband and ultra-narrowband communications. An endpoint device receives a reference timing signal over a wireless network from a reference device in the network. The endpoint device determines the current value of the clock frequency of the endpoint device and further determines the frequency difference between the reference frequency of the reference timing signal and the current value of the clock frequency. Based on the frequency difference, the endpoint generates a control signal and applies the control signal to the crystal oscillator of the endpoint device to adjust the frequency of the crystal oscillator. The endpoint device communicates with another device in the network using the oscillating signal generated by the adjusted crystal oscillator.

Systems and methods are disclosed for adjusting clock frequencies of endpoint devices in a mesh network for narrowband and ultra-narrowband communications. An endpoint device receives a reference timing signal over a wireless network from a reference device in the network. The endpoint device determines the current value of the clock frequency of the endpoint device and further determines the frequency difference between the reference frequency of the reference timing signal and the current value of the clock frequency. Based on the frequency difference, the endpoint generates a control signal and applies the control signal to the crystal oscillator of the endpoint device to adjust the frequency of the crystal oscillator. The endpoint device communicates with another device in the network using the oscillating signal generated by the adjusted crystal oscillator.

A resonator device includes: a base including a semiconductor substrate; a resonator element; and a lid to be bonded to the base, the lid and the base forming a cavity for accommodating the resonator element. An integrated circuit is disposed at the semiconductor substrate, the integrated circuit including an oscillation circuit electrically coupled to the resonator element, a memory circuit configured to store a reference value of an output characteristic of the resonator element, and a determination circuit configured to compare a detection value of the output characteristic of the resonator element with the reference value and determine an airtight state inside the cavity based on a comparison result.

A resonator device includes: a base including a semiconductor substrate; a resonator element; and a lid to be bonded to the base, the lid and the base forming a cavity for accommodating the resonator element. An integrated circuit is disposed at the semiconductor substrate, the integrated circuit including an oscillation circuit electrically coupled to the resonator element, a memory circuit configured to store a reference value of an output characteristic of the resonator element, and a determination circuit configured to compare a detection value of the output characteristic of the resonator element with the reference value and determine an airtight state inside the cavity based on a comparison result.