A cavity oscillator comprising: an amplifier operable to provide energy to a local oscillating signal; a superconducting resonant cavity arranged to receive the local oscillating signal and being operable to reflect a portion of the local oscillating signal for use in a feedback circuit, to support an electromagnetic wave related to the local oscillating signal in a desired TM mode, and to output a filtered signal of a desired frequency or frequencies based on the geometry of the cavity; a feedback circuit operable to generate an error signal based on the local oscillating signal and the reflected signal; and a phase shifter arranged operable to adjust the filtered signal based on the error signal to generate an adjusted filtered signal. The amplifier can amplify the adjusted filtered signal.

A high frequency oscillator has a high frequency generation part, an oscillation part, a matching unit, rectification element parts and switch parts. The oscillation part oscillates high frequency power generated by the high frequency generation part. The matching unit is arranged between the high frequency generation part and the oscillation part, and has one or more capacitors and matching circuits having difference characteristics so as to perform matching between the high frequency generation part and the oscillation part. The rectification element parts and the matching circuits are arranged in one-to-one correspondence. The rectification element parts rectify high frequency power supplied from the high frequency generation part to the oscillation part. The switch part is connected to the corresponding rectification element part to switch the corresponding capacitor connected to the corresponding matching circuit through the corresponding rectification element part.

In an aspect, an apparatus is disclosed that includes a surface-mounted integrated circuit package housing an active oscillator circuit; an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface-mounted integrated circuit package, the integrated ceramic resonator including a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate, a conductive rod extending vertically into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity, a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit; and a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.

The present disclosure relates to an oscillator device (1, 1, 1, 1) comprising an active circuit device (2, 2), a circuit board (3) and a cavity resonator (4, 4). The active circuit device (2, 2) comprises an amplifier unit (5), and the circuit board (3) comprises a first main side (6) and a second main side (7), where the active circuit device (2, 2) is mounted to the first main side (6). The cavity resonator (4, 4) is positioned on the second main side (7). The oscillator device (1) further comprises at least one excitation via connection (8) that runs through the circuit board (3) and electrically connects the active circuit device (2, 2) to an excitation structure (9) inside the cavity resonator (4, 4).

A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive fence that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.

Vibration compensation is provided for Interferometric Noise Suppressed Oscillators (INSOs). In an INSO the error signal at the mixer output responds linearly to changes in carrier frequency. A vibration compensation signal is summed with the error signal at the input to the feedback amplifier to provide the control signal to the loop phase shifter to suppress close-in phase noise near the carrier frequency and to reduce the effects of mechanical vibrations on oscillator phase noise. The addition of the vibration compensation signal does degrade carrier suppression, hence increases the flicker noise contributed by the INSO's LNA but does so without degrading overall oscillator phase noise. In a frequency tuned configuration, the vibration compensation signal reduces the effects of mechanical vibrations on oscillator phase noise independent of the tuning voltage applied to the phase shifter.

A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive fence that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.