To reduce interference between wiring patterns at an oscillator that outputs a plurality of oscillation signals. An oscillator includes an IC configured to output a plurality of oscillation signals using a crystal resonator, and a base plate connected to the IC. The base plate includes a crystal resonator land and a crystal resonator land that are electrically connected to the crystal resonator, a power source land electrically connected to a power source, and a first output land positioned between the crystal resonator land and the power source land to output a first oscillation signal from the IC to an outside, and a wiring pattern from the first output land passes through between the crystal resonator land and the crystal resonator land.

A crystal driver integrated circuit with external oscillation signal amplitude control including an amplifier core, an input pin and an output pin, an adjustable capacitor, and a controller. The controller operates the amplifier core in any one of multiple operating modes including an oscillator mode and a bypass mode. During the bypass mode, the controller disables the amplifier core and adjusts the adjustable capacitor so that an amplitude of an oscillation signal received via the input pin from an external oscillator has a target amplitude. The external oscillation signal may be capacitively coupled for capacitive voltage division or directly coupled for impedance attenuation. An available voltage may be provided as a source voltage to the external oscillator via the output pin. An internal voltage regulator and/or switch may be included to re-provision the output pin to provide the source voltage during the bypass mode.

Disclosed are circuits and methods for increasing an output frequency of an inductance-capacitance (LC) oscillator. In some embodiments, the LC oscillator can be implemented as a voltage-controlled oscillator (VCO) having differential outputs. When the VCO is implemented on a die, wirebond connections from the outputs to a ground results in an effective inductance that impacts a maximum frequency associated with the VCO. An electrical connection such as a wirebond between the differential outputs yields a reduction in the effective inductance thereby increasing the maximum frequency. In some embodiments, the wirebond between the differential outputs can be configured so that its contribution to mutual inductance is reduced or substantially nil.

To reduce interference between wiring patterns at an oscillator that outputs a plurality of oscillation signals. An oscillator includes an IC configured to output a plurality of oscillation signals using a crystal resonator, and a base plate connected to the IC. The base plate includes a crystal resonator land and a crystal resonator land that are electrically connected to the crystal resonator, a power source land electrically connected to a power source, and a first output land positioned between the crystal resonator land and the power source land to output a first oscillation signal from the IC to an outside, and a wiring pattern from the first output land passes through between the crystal resonator land and the crystal resonator land.

An oscillator comprising a support substrate, at least one transducer mounted on a first surface of the support substrate, and an integrated circuit element mounted on a second surface of the support substrate. The integrated circuit element includes first and second frequency generating components integrated therein. The first frequency generating component generates a first output frequency, and the second frequency generating component generates a second output frequency that is higher than the first output frequency. The oscillator also includes a ground terminal to which the second frequency generating component is closer than the first frequency generating component.

Disclosed are circuits and methods for increasing an output frequency of an inductance-capacitance (LC) oscillator. In some embodiments, the LC oscillator can be implemented as a voltage-controlled oscillator (VCO) having differential outputs. When the VCO is implemented on a die, wirebond connections from the outputs to a ground results in an effective inductance that impacts a maximum frequency associated with the VCO. An electrical connection such as a wirebond between the differential outputs yields a reduction in the effective inductance thereby increasing the maximum frequency. In some embodiments, the wirebond between the differential outputs can be configured so that its contribution to mutual inductance is reduced or substantially nil.

A semiconductor circuit includes an oscillation circuit; an output circuit that receives a first oscillation signal from the oscillation circuit and outputs a second oscillation signal; a DC circuit that receives a voltage based on a power supply voltage and outputs at least one of a DC voltage and a DC current; and a semiconductor substrate on which the oscillation circuit, the output circuit, and the DC circuit are formed. In a plan view of the semiconductor substrate, the DC circuit is disposed between the oscillation circuit and the output circuit.

An oscillator comprising a support substrate, at least one transducer mounted on a first surface of the support substrate, and an integrated circuit element mounted on a second surface of the support substrate. The integrated circuit element includes first and second frequency generating components integrated therein. The first frequency generating component generates a first output frequency, and the second frequency generating component generates a second output frequency that is higher than the first output frequency. The oscillator also includes a ground terminal to which the second frequency generating component is closer than the first frequency generating component.

Disclosed are circuits and methods for increasing an output frequency of an inductance-capacitance (LC) oscillator. In some embodiments, the LC oscillator can be implemented as a voltage-controlled oscillator (VCO) having differential outputs. When the VCO is implemented on a die, wirebond connections from the outputs to a ground results in an effective inductance that impacts a maximum frequency associated with the VCO. An electrical connection such as a wirebond between the differential outputs yields a reduction in the effective inductance thereby increasing the maximum frequency. In some embodiments, the wirebond between the differential outputs can be configured so that its contribution to mutual inductance is reduced or substantially nil.

An oscillator includes a circuit board including a supporting substrate (base member), a first VCXO (a first oscillator circuit), a second VCXO (a second oscillator circuit), and a ground terminal (terminal for ground). The first VCXO and the second VCXO are configured such that a second output frequency that is output from the second VCXO is higher than a first output frequency that is output from the first VCXO. The second VCXO is placed closer to the ground terminal than the first VCXO.