H03B2200/0076

Combining arrangement

A combining arrangement comprises a power combiner having at least four ports. A first match-dependent oscillator is connected to input power at a first frequency to a first input port of the power combiner. A second match-dependent oscillator is connected to input power at a second frequency to a second input port of the power combiner. A mismatch is connected to a third port of the power combiner. The power combiner is operative to combine power from the first and second oscillators and, when the first and second frequencies are different, to apply a fraction of the combined power to the mismatch. The mismatch reflects at least some of the fraction of the combined power to the first and second oscillators to phase and frequency lock their outputs. A fourth output port of the power combiner is connected to receive the combined power. The power combiner attenuation is variable to adjust the proportion of the combined power split between the third port and fourth output port from 0% to 100% of the total combined power for any power values at the first input port and second input port.

ARCHITECTURE FOR VOLTAGE SHARING BETWEEN TWO OSCILLATORS
20180367097 · 2018-12-20 ·

An electronic system comprises a first and a second oscillator that are mutually cross-coupled and have one and the same resonant frequency, each oscillator comprising an electrical resonator, an active cell having a negative small-signal resistance linked to the electrical resonator, an electric power supply terminal of the active cell, an output for an oscillation signal and a terminal for connection to a ground point, wherein: the electric power supply terminal of the second oscillator and the terminal for connection to a ground point of the first oscillator are linked to one and the same point, termed dynamic ground; and the system also comprises a differential amplifier forming, with the active cell of one of the oscillators, a feedback loop designed to keep the potential of the dynamic ground point at a constant level, dependent on the reference voltage.

Methods of forming oscillator systems having annular resonant circuitry
10143091 · 2018-11-27 · ·

Systems and apparatus are provided for solid-state oscillators and related resonant circuitry. An exemplary oscillator system includes an amplifier having an amplifier input and an amplifier output and resonant circuitry coupled between the amplifier output and the amplifier input. In exemplary embodiments, the resonant circuitry includes an annular resonance structure that is substantially symmetrical and includes a pair of arcuate inductive elements. In accordance with one or more embodiments, the resonant circuitry includes an additional inductive element that is capacitively coupled to the annular resonance structure via an air gap to improve the quality factor of the resonant circuitry.

Solid state microwave generator
10110165 · 2018-10-23 · ·

An apparatus includes a spin torque oscillator, a sensor, and a processing unit. The spin torque oscillator is configured to receive a current and to generate a microwave output signal. The sensor is configured to detect the microwave output signal and to detect changes to frequency of the detected microwave output signal responsive to changes in an external magnetic field. The processing unit is configured to receive a sensed signal from the sensor. The processing unit is further configured to process the sensed signal and the changes to the frequency to determine magnitude and direction associated with the external magnetic field.

METHOD AND APPARATUS FOR CONTROLLING MISMATCH IN A VOLTAGE CONTROLLED OSCILLATOR ARRAY
20180138912 · 2018-05-17 ·

Methods and systems are provided for adaptively configuring voltage-controlled oscillator (VCO) arrays, such as to reduce mismatches among the VCOs. A plurality of voltage-controlled oscillators (VCOs), connected in parallel to a common control input, and with each VCO outputting an oscillating signal based on the common control input and an adjustment input, may be configured to reduce mismatches among the VCOs. The plurality of VCO may be configured by adjusting at least one operational parameter applicable to interconnection paths connecting outputs of the plurality of VCOs; measuring a mismatch between signals at the outputs of the plurality of VCOs with respect to a first signal parameter; and adjusting a first operational parameter applicable to one or more of the plurality of VCOs to reduce mismatch between signals at the outputs of the plurality of VCOs with respect to a first signal parameter.

METHOD AND APPARATUS FOR RECONFIGURABLE MULTICORE OSCILLATOR
20180097475 · 2018-04-05 ·

The present disclosure relates to a reconfigurable multicore inductor capacitor (LC) oscillator comprising a plurality of oscillator cores. The oscillator may be configured at run-time, at manufacturing, or at production, which may allow for the tailoring of operating characteristics of the oscillator, such as phase noise, electromagnetic interference, or power consumption, for a specific application after production. The cores are coupled through an interconnect network to a common electrical signal output. A subset of the cores may be selectively enabled while the remainder of the cores is disabled. The ability to enable only a subset of the cores allows the total number of enabled cores to be reconfigurable. Furthermore, the direction in which oscillation current flows through the inductor of the cores may be configured. Reconfiguring the number of enabled cores and/or the oscillation current direction in the cores allow operating characteristics of the oscillator to be tailored after production.

Resonant circuit including bump pads
09929123 · 2018-03-27 · ·

Aspects of this disclosure relate to a first die includes an LC resonant circuit including a first capacitive element, such as a capacitor or a varactor, and an inductive element. The LC resonant circuit is configured to generate a signal having a frequency of oscillation. The first die includes bump pads electrically coupled to both ends of the first capacitive element. A second die can be flip chip mounted on the first die. Bumps can electrically connect a second capacitive element of the second die in parallel with the first capacitive element of the first die. This can increase the Q factor of the LC resonant circuit.

DEVICE FOR TERAHERTZ SIGNAL GENERATION AND TRANSMITTER
20180041166 · 2018-02-08 · ·

A high-power transmitter with a fully-integrated phase Iocking capability is disclosed and characterized. Also provided herein is a THz radiator structure based on a return-path gap coupler, which enables the high-power generation of the disclosed transmitter, and a self-feeding oscillator suitable for TS use with the transmitter.

Power oscillator apparatus with transformer-based power combining

An oscillator circuit includes first and second oscillators arranged in a series configuration between a supply voltage node and a reference voltage node. The first and second oscillators are configured to receive a synchronizing signal for controlling synchronization in frequency and phase. An electromagnetic network provided to couple the first and the second oscillators includes a transformer with a primary circuit and a secondary circuit. The primary circuit includes a first portion coupled to the first oscillator and second portion coupled to the second oscillator. The first and second portions are connected by a circuit element for reuse of current between the first and second oscillators. The oscillator circuit is fabricated as an integrated circuit device wherein the electromagnetic network is formed in metallization layers of the device. The secondary circuit generates an output power combining power provided from the first and second portions of the primary circuit.

Oscillator circuit, corresponding apparatus and method

An oscillator has an oscillator output emitting an oscillating signal. The oscillator includes oscillator cores which each have a same circuit topology. A set of configuration switches couple a selected number of oscillator cores in parallel to generate the oscillating signal. The oscillator cores are arranged with a symmetry around a central axis. The planar inductors of the oscillator cores are arranged in a petal-like pattern with the planar inductors forming the petals of the petal-like pattern. The selected coupling of the oscillator cores in made in response to a selected phase noise threshold of a modulation device which receives the oscillating signal.