H03F1/526

Architecture of a wideband distributed amplification device

A distributed amplification device with p inputs, p outputs, p amplification paths comprises a redundant reservoir of n amplifiers including n-p back-up amplifiers, an input redundancy ring and an output redundancy ring formed by rotary switches, the input and output redundancy rings sharing the same technology. The internal amplification pathways associated with the n-p back-up amplifiers frame in an interlaced manner the internal amplification pathways associated with the p nominal amplifiers and the amplification paths of the routing configurations each pass through at least five rotary switches. The input and output redundancy rings are topologically and geometrically configured and the family of the routing configurations is chosen such that the electrical lengths of all the paths of one and the same routing configuration of the family are equal.

World band frequency front end module, system and method thereof

The present disclosure relates to a World Band Radio Frequency Power Amplifier and a World Band Radio Frequency Front End Module. The World Band Power Amplifier can contain at least one broadband power amplifier connected to a switch which can direct an RF input signal to a plurality of transmission paths, each transmission path configured for a different frequency. The World Band RFFE Module is more integrated version of the World Band Power Amplifier that can contain broadband RF PA(s), switches, logic controls, filters, duplexers and other active and passive components. The module may also include a thermal protection system capable of effecting operation of the broadband power amplifier.

Transmission system
10027522 · 2018-07-17 · ·

According to one embodiment, a transmission system may include a plurality of signal processing apparatuses. The signal processing apparatus are connected in series. The signal processing apparatus includes a plurality of signal processors, and a switcher. The signal processors generate an output signal by performing signal processing of an input signal from an earlier-stage signal processing apparatus. The signal processors supply the output signal into which is included an abnormality signal if the input signal does not include the abnormality signal and also the output signal does not satisfy the criteria. The switcher receives a plurality of output signals output from the plurality of signal processors. The switcher supplies an output signal of the plurality of output signals.

Fault tolerant voltage regulator
10013009 · 2018-07-03 · ·

A fault tolerant voltage regulator may include a plurality of operational transconductance amplifiers. The plurality of operational transconductance amplifiers may be configured according to a unity-gain configuration. The plurality of operational transconductance amplifiers may be configured to couple in parallel to a load. The plurality of operational transconductance amplifiers may be configured to load share a load current associated with the load approximately equally among the plurality of operational transconductance amplifiers.

Electronic device and method for switching power amplifiers
09998078 · 2018-06-12 · ·

A method for an electronic device includes amplifying a signal by a first power amplifier, obtaining a temperature of the first power amplifier during the amplification of the signal, comparing the temperature of the first power amplifier to a predetermined threshold value, and switching the first power amplifier to a second power amplifier for amplifying a signal if the temperature of the first power amplifier is higher than a threshold value. An electronic device for switching power amplifiers are also disclosed.

HIGHLY STABLE TRANSFORMER
20180152096 · 2018-05-31 ·

A highly stable transformer, including a first transformer, a second transformer and a current induction device. The current induction device is provided in a load line of the first transformer for detecting an induction current in the load line of the first transformer. An induction load terminal of the current induction device is connected to a control winding. The control winding is provided in a winding of the second transformer to generate an induction voltage in the winding according to the induction current value and output a voltage value matching the load. The transformer has a zero voltage deviation, can be applied to precise appliance circuits and will not produce voltage drop. The transformer adopts active loaded lines, has good operation efficiency and good stability, saves main capacitor loss of no-load and unequal loads, and improves the startup performance of the transformer to any corresponding loads in a full-load condition.

POWER AMPLIFICATION DEVICE AND TELEVISION SIGNAL TRANSMISSION SYSTEM
20180145646 · 2018-05-24 · ·

A power amplification device capable of detaching an element relating to the power amplification of an RF signal from an element relating to the combining of RF signals. The amplifying unit 1 is provided with a plurality of groups of amplifier circuits 2 that amplifies the power of a RF signal and the plurality of groups of amplifier circuits each includes a predetermined number of the amplifier circuits 2. A combining unit 5 includes a first combiner 7 and a second combiner 8. The first combiner 7 is provided in association with the group of the amplifier circuits 2, combines RF signals output from the amplifier circuits 2 belonging to the corresponding group, and outputs the RF signal after combining. The second combiner 8 combines the RF signals output from each first combiner 7 and outputs the RF signal after combining. Each first combiner 7 is a combiner usable for an RF signal in a specific frequency band. The amplifying unit 1 is attachable to and detachable from the combining unit 5.

Arrangement and method for radio-frequency (RF) high power generation for compensating a failed power amplifier module

An arrangement and method for radio-frequency (RF) high power generation which compensate for a failed power amplifier module includes at least one power combiner having RF inputs and at least one RF output, and at least two power amplifier modules electrically connected to a respective input by at least one transmission line, and at least one RF switch formed by the at least one transmission line with a complex load electrically connected to the at least one RF switch.

Combined high power RF/microwave amplifier with multiple power amplifier units and automatic failure protection

A high power RF or microwave amplifier may amplify an RF or microwave input signal. The high power RF or microwave amplifier may include an input signal divider (DIV) that has an input port that receives the RF or microwave input signal and that divides this input signal into multiple sub-input signals; multiple power amplifier units (PAUs), each having an input port that receives an RF or microwave signal, an output port that delivers an amplified version of the received RF or microwave signal, and an interface port; an interface control unit (ICU) that communicates with each PAU through its interface port; and an output signal switching combiner unit (SCU) that coherently sums the outputs of the on-line PAUs and delivers this to an output port. The ICU may set one or more of the PAUs to amplify one of the multiple sub-input signals (hereinafter referred to as on-line PAU in on-line mode); monitor each on-line PAU to verify that it is operating within one or more pre-determined PAU specifications; and upon detecting that one of the on-line PAUs is no longer operating within the one or more pre-determined PAU specifications (malfunctioning PAU), set the malfunctioning PAU not to amplify one of the multiple sub-input signals and not to be available to be switched to the on-line mode by the ICU (hereinafter referred to as off-line PAU in off-line mode).

T-shaped power amplifier cooling plate
09692367 · 2017-06-27 · ·

Cooled electronic circuitry may include multiple and substantially parallel circuitry surfaces, each containing power amplifier circuitry, having a side edge, and includes material between at least a portion of the base plate and the side edge that provides a level of thermal conductivity of at least 167 W/m-k; and a cooling plate having a flat surface attached to each of the side edges of the circuitry surfaces in a thermally-conductive manner.