A Doherty amplifier includes: a first amplifying element to amplify a first signal; a second amplifying element to amplify a second signal having a phase difference with the first signal; a first transmission line connected to an output terminal of the first amplifying element; and a second transmission line connected to an output terminal of the second amplifying element, wherein the first transmission line and the second transmission line are equal to each other in characteristic impedance, the phase difference between the first signal and the second signal is not equal to a difference in electrical length between the second transmission line and the first transmission line, and the first signal having passed through the first transmission line and the second signal having passed through the second transmission line are subjected to different phase synthesis.

An active balun circuit includes first and second transistors having emitters electrically coupled to each other and configured to output differential signals and a circuit element coupled between the connection point of the emitter of the first transistor and the emitter of the second transistor and a reference potential. The impedance of the circuit element at a particular frequency of the input signal appears significantly larger than impedances at other frequencies. An input signal from an input terminal is inputted to the base of the first transistor. The reference potential is applied to the base of the second transistor. A supply voltage is applied to the collector of the first transistor and the collector of the second transistor. A signal from the collector of the first transistor and a signal from the collector of the second transistor are outputted as the differential signals.

A first transmission line and a second transmission line that are connected in series to each other are disposed at different positions in a thickness direction of a substrate. A third transmission line is disposed between the first transmission line and the second transmission line in the thickness direction of the substrate. The third transmission line includes a first end portion connected to one end portion of the first transmission line, and a second end portion that is AC-grounded. The first transmission line and the second transmission line are electromagnetically coupled to the third transmission line.

An embodiment of a dual-path amplifier includes a power splitter connected to first and second power amplifiers respectively connected to first and second transmission lines connected to a power combiner having a phase-offset deficit at the second harmonic frequency 2f0, where the first and second transmission lines are designed to provide a complementary phase offset at 2f0 substantially equal to the phase-offset deficit such that the two amplified signals will be combined at the power converter with a total phase offset at 2f0 of about 180 degrees in order to reduce harmonic distortion in the amplified output signal, without substantially diminishing the output power at the fundamental frequency f0. In certain PCB-based implementations, the transmission lines include metal traces and lumped elements providing different impedance transformations that achieve the complementary phase offset, where the metal traces may have significantly different physical and electrical characteristics.

To achieve miniaturization. A matching circuit is connected to a connection terminal that is one of an input terminal and an output terminal of an amplifier. A mounting substrate has a ground layer. The matching circuit includes a main line, a sub-line, and an IC chip. The main line is formed of a first conductor pattern intersecting a thickness direction of the mounting substrate, and is connected to a connection terminal of the amplifier. The sub-line is formed of a second conductor pattern intersecting the thickness direction of the mounting substrate, and is connected between the main line and the ground layer. The sub-line is opposed to the main line in the thickness direction of the mounting substrate. The IC chip is disposed on the mounting substrate, and includes an adjustment unit that adjusts impedance conversion characteristics of the matching circuit.

Systems and apparatuses are disclosed that include an RF generator configured to generate RF signals having a wavelength. Amplifiers are configured to receive and amplify the RF signals from the RF generator and are separated from each other by a separation distance in a range between about 0.2 times the wavelength and about 10.0 times the wavelength. A power management system is configured to control one or more of the amplifiers based on information received that is associated with the RF signals.

Methods and apparatus are provided. In an example aspect, an amplifier protection circuit is provided. The amplifier protection circuit comprises an input for receiving a signal from a first amplifier, and an isolation circuit between the input and an output of the amplifier protection circuit. The isolation circuit is configured to sense a backward signal propagating from the output of the amplifier protection circuit towards the input to provide a sensed signal, and to provide at least one cancellation signal based on the sensed signal to at least partially cancel the backward signal.

A decrease in isolation is suppressed when transmitting both a first transmission signal and a second transmission signal in simultaneous communication. A radio frequency module includes a first transformer and a second transformer. The first transformer is included in a first differential power amplifier to amplify the first transmission signal. The second transformer is included in a second differential power amplifier to amplify the second transmission signal to be simultaneously communicated with the first transmission signal. A direction of magnetic flux generated in the first transformer is different from a direction of magnetic flux generated in the second transformer.

A method of operating a headphone configured to be removed from and placed in close proximity to a user's ear can include generating an input signal by an input signal generating device. The method can also include determining whether an insertion event has occurred based on the generated input signal and causing the headphone to operate in 5 a low power mode responsive to an absence of an insertion event determination after a first period of time. The method can also include causing the headphone to operate in an ultra-low power mode responsive to the absence of an insertion event determination after a second period of time that occurs after the first period of time, the ultra-low power mode having a lower power consumption than the low power mode.

An amplifier (300) comprising: a first signal path comprising first amplifier circuitry (105A) configured to receive a first signal (RF1) with a frequency and a variable phase and amplitude at the frequency; a second signal path comprising second amplifier circuitry (105B) configured to receive a second signal (RF2) with the frequency, wherein at least one of the relative phase and amplitude of the second signal is fixed at the frequency; combiner circuitry (106) configured to combine an output of the first amplifier circuitry and the second amplifier circuitry.