A radio-frequency module includes a module substrate, a power amplifier, and a control circuit configured to control the power amplifier. The control circuit includes a temperature sensor. The power amplifier and the control circuit are stacked one on top of another on a principal surface of the module substrate.

The present disclosure relates to systems and methods for operating transceiver circuitry to transmit or receive signals on various frequency ranges. To do so, a transmitter or a receiver of the transceiver circuitry is selectively coupled to or uncoupled from an antenna of the transceiver circuitry. Additionally, radio frequency filters may be individually or collectively coupled to and/or uncoupled from the antenna to filter different frequencies in the transmitting or receiving signals.

A filter includes series resonators on a signal path, each of the series resonator including an IDT electrode that includes first electrode fingers each including a variant portion, second electrode fingers each including no variant portion, or both the first electrode fingers and the second electrode fingers, in the IDT electrode of one or more series resonators of the series resonators, a direction connecting other-side end portions of electrode fingers crosses an acoustic wave propagation direction, the IDT electrode includes the first electrode fingers, a first portion of an IDT electrode of another series resonator centrally located in the acoustic wave propagation direction, includes only the first electrode fingers, and a second portion and a third portion on two sides of the first portion each include only the second electrode fingers.

A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.

A radio frequency module includes a switch circuit that includes selection terminals, a filter that allows the signal in the first frequency band to pass therethrough, a filter that allows the signal in the second frequency band to pass therethrough, a phase adjustment circuit that is connected to the selection terminal and the filter, and a phase adjustment circuit that is connected to the selection terminal and the filter. The filter includes an acoustic wave resonator that is formed on a substrate that has piezoelectricity. The filter includes an acoustic wave resonator that is formed on a substrate that has piezoelectricity. At least one of circuit elements that are included in the phase adjustment circuit is formed on the substrate. At least one of circuit elements that are included in the phase adjustment circuit is formed on the substrate.

A module substrate has first and second main surfaces that on opposite sides of the module substrate, a resin member that covers the second main surface, and a plurality of post electrodes that are spaced apart from each other on the second main surface and penetrate through the resin member from the second main surface. The plurality of post electrodes includes a first post electrode and a first recess recessed toward the second main surface and formed in at least part of a region of the surface of the resin member that surrounds a leading end part of the first post electrode.

A radio-frequency module includes a mount board, an antenna terminal and a ground terminal, a low-noise amplifier, a first inductor, and a second inductor. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board from one another. The low-noise amplifier includes a transistor configured to amplify a signal. The first inductor is disposed on one of the first principal surface and the second principal surface of the mount board. The first inductor is connected to the antenna terminal. The second inductor is disposed on the other of the first principal surface and the second principal surface of the mount board. The second inductor is connected between the transistor and the ground terminal.

A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.

The disclosure relates to a signal combiner for a Doherty power amplifier architecture, the signal combiner including a termination circuit on an isolation port, the termination circuit being tuned to improve performance of the Doherty power amplifier. The architecture includes a carrier amplifier and a peaking amplifier. The peaking amplifier modulates the load seen by the carrier amplifier, allowing the carrier amplifier to remain in high-efficiency, saturated operation even at back-off. This load modulation can be achieved using impedance matching networks having an impedance matched to a specific frequency. The architectures include tuned or tailored signal combiners with termination circuits on isolation ports. The termination circuits are tuned or tailored for particular operating frequencies to enhance operation.

A shunt switch. In some embodiments, the shunt switch includes a transistor stack including a first transistor and a capacitor. The transistor stack may have a first end terminal and a second end terminal, the first transistor being connected to the first end terminal, the first end terminal being connected to a switching terminal of the shunt switch. The capacitor may have a first terminal connected to the second end terminal of the transistor stack, and a second terminal connected to a low-impedance node.