A front end module (FEM) integrated circuit (IC) architecture that uses the same LNA in each of several frequency bands extending over a wide frequency range. In some embodiments, switched impedance circuits distributed throughout the front end circuit allow selection of the frequency response and impedances that are optimized for particular performance parameters targeted for a desired device characteristic. Such switched impedance circuits tune the output and input impedance match and adjust the gain of the LNA for specific operating frequencies and gain targets. In addition, adjustments to the bias of the LNA can be used to optimize performance trade-offs between the total direct current (DC) power dissipated versus radio frequency (RF) performance. By selecting appropriate impedances throughout the circuit using switched impedance circuits, the LNA can be selectively tuned to operate optimally at a selected bias for operation within selected frequency bands.

A radio-frequency module includes a mount board, an antenna terminal and a ground terminal, a low-noise amplifier, a first inductor, and a second inductor. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board from one another. The low-noise amplifier includes a transistor configured to amplify a signal. The first inductor is disposed on one of the first principal surface and the second principal surface of the mount board. The first inductor is connected to the antenna terminal. The second inductor is disposed on the other of the first principal surface and the second principal surface of the mount board. The second inductor is connected between the transistor and the ground terminal.

A radio frequency module includes a mounting board, a power amplifier, a plurality of transmission filters, a first switch, an output matching circuit, a low-noise amplifier, and an external-connection terminal. The mounting board includes a first principal surface and a second principal surface on opposite sides of the mounting board. The first switch switches a connection between the power amplifier and the transmission filters. The output matching circuit is connected between the power amplifier and the first switch. The low-noise amplifier is disposed on the second principal surface of the mounting board. The external-connection terminal is disposed on the second principal surface of the mounting board. The power amplifier, the output matching circuit, the first switch, and the transmission filters are disposed on the mounting board in stated order in a direction that is orthogonal to a thickness direction of the mounting board.

A front-end module including a power amplifier, first and second couplers, an antenna switch, and a switch sub-assembly. The power amplifier has an input to receive a radio frequency signal and an output to provide an amplified radio frequency signal. The first coupler has an input port coupled to the output of the power amplifier, an output port coupled to an input of the antenna switch, a coupled port, and an isolated port. The second coupler has an input port coupled to an output of the antenna switch, an output port coupled to an antenna port, a coupled port, and an isolated port. The switch sub assembly connects one of the coupled port and the isolated port of the second coupler to an output of the switch assembly and the other one of the coupled port and the isolated port of the second coupler to a first termination impedance.

A receiver front end (300) having low noise amplifiers (LNAs) is disclosed herein. A cascode having a “common source” configured input FET and a “common gate” configured output FET can be turned on or off using the gate of the output FET. A first switch (235) is provided that allows a connection to be either established or broken between the source terminal of the input FET of each LNA. A drain switch (260) is provided between the drain terminals of input FETs to place the input FETs in parallel. This increases the g.sub.m of the input stage of the amplifier, thus improving the noise figure of the amplifier.

A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.

A high-frequency signal transmission-reception circuit includes a plurality of band pass filter groups each including a plurality of band pass filter pairs; a first switch including a plurality of band pass filter-side terminal groups each including a plurality of band pass filter-side terminals, and an antenna-side terminal group; a plurality of couplers configured to output respective signal strengths of high-frequency signals transmitted on a plurality of transmission paths; and a second switch including an input terminal group electrically connected to the plurality of couplers, and an output terminal configured to output a detection signal output from one of the plurality of couplers. The first switch electrically connects one band pass filter-side terminal in one band pass filter-side terminal group and one antenna-side terminal, and also electrically connects one band pass filter-side terminal in another band pass filter-side terminal group and another antenna-side terminal.

An electronic device may include wireless circuitry with a baseband processor, a transceiver circuit, a front-end module, and an antenna. The front-end module may include amplifier circuitry such as a low noise amplifier for amplifying received radio-frequency signals. The amplifier circuitry is operable in a non-carrier-aggregation mode and a carrier aggregation mode. The amplifier circuitry may include an input transformer that is coupled to multiple amplifier stages such as a common gate amplifier stage, a cascode amplifier stage, and a common source amplifier stage. The common gate amplifier stage may include switches for selectively activating a set of cross-coupled capacitors to help maintain input impedance matching in the non-carrier-aggregation mode and the carrier-aggregation mode. The common source amplifier stage may include additional switches for activating and deactivating the common source amplifier stage to help maintain the gain in the non-carrier-aggregation mode and the carrier-aggregation mode.

Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a first transmission filter, a second transmission filter, a resin layer, and a shield layer. The second transmission filter is higher in power class than the first transmission filter. The resin layer covers at least part of an outer peripheral surface of the first transmission filter and covers at least part of an outer peripheral surface of the second transmission filter. The shield layer overlaps at least part of the second transmission filter in plan view in a thickness direction of the mounting substrate. At least part of a major surface of the second transmission filter on an opposite side to the mounting substrate side is in contact with the shield layer.

A high-frequency circuit includes a power amplifier for a communication band A, and a power amplifier for a communication band B. Transmission in the communication band A, transmission in the communication band B, and reception in the communication band C can be simultaneously used. A frequency range of intermodulation distortion generated between a second harmonic wave of a transmission signal of the communication band A and a fundamental wave of a transmission signal of the communication band B, overlaps with at least part of a reception band of the communication band C. The power amplifier includes amplifying elements and an output trans including coils. One end of the coil is connected with an output of the amplifying element, the other end of the coil is connected with an output of the amplifying element, and one end of the coil is connected with an output terminal of the power amplifier.