Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain droop due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal. Another bias compensation circuit embodiment includes a temperature-sensitive element having a positive temperature coefficient (PTC) for regulating the bias signal.

The present technology relates to a sound processing device, a method, and a program capable of suppressing an excessive amplitude and obtaining higher quality of sound. A sound processing device includes: a prediction value calculation unit that calculates a prediction value of a displacement of a speaker according to an input signal supplied to the speaker on the basis of an equivalent model of the speaker; and an amplitude control unit that performs amplitude control on the input signal in a case in which the prediction value is greater than a predetermined threshold value. The present technology can be applied to a sound reproduction system.

The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

A temperature compensation circuit comprises a temperature coefficient circuit that generates a temperature coefficient that is temperature dependent and a compensation circuit that generates a compensation signal based on an indication of temperature of an amplifier and the temperature coefficient, and based on the compensation signal, a gain of the amplifier is adjusted to improve amplifier linearity during data bursts.

A temperature compensation circuit comprises a temperature coefficient circuit that generates a temperature coefficient that is temperature dependent and a compensation circuit that generates a compensation signal based on an indication of temperature of an amplifier and the temperature coefficient, and based on the compensation signal, a gain of the amplifier is adjusted to improve amplifier linearity during data bursts.

Dynamic error vector magnitude (EVM) compensation is accomplished for radio frequency (RF) power amplifiers (PAs) which experience EVM distortion from thermal settling. Thermal settling causes gain changes in the PAs, and systems, apparatuses, and methods of the present disclosure compensate for known thermal transients of PAs.

A compensation circuit receives a sensing signal from a Hall sensor and outputs a compensated Hall sensing signal. The compensation circuit has a gain that is inversely proportional to Hall sensor drift mobility. The compensated Hall sensing signal is temperature-compensated.

A power amplifier can include an input stage that includes an amplifying transistor having an input node and an output node, such that a signal at the input node has a first power level and an amplified signal at the output node has a second power level. The power amplifier can further include a bias circuit configured to provide a bias signal to the amplifying transistor, and a feedback circuit that couples the output node of the amplifying transistor to the input node of the amplifying transistor. The feedback circuit can include a resistance and a capacitance arranged in series. The power amplifier can further include a gain compensation circuit implemented relative to the input stage such that the second power level is compensated for a variation in temperature associated with the power amplifier.

An equalizer, in at least some embodiments, comprises an amplifier configured to produce an amplified voltage signal that is a function of an ambient temperature affecting the equalizer. The equalizer also includes a linear equalizer stage coupled to the amplifier and comprising a transistor having a resistance controlled by the amplified voltage signal. The linear equalizer stage is configured to produce a voltage output signal having a gain that is dependent on the transistor resistance and on a frequency of the amplified voltage signal.

Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain droop due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal. Another bias compensation circuit embodiment includes a temperature-sensitive element having a positive temperature coefficient (PTC) for regulating the bias signal.