Patent classifications
H03H2001/0057
MAGNETIC CORE, INDUCTOR, AND EMI FILTER COMPRISING SAME
An inductor according to an embodiment of the present invention comprises: a first magnetic body having a toroidal shape, and including a ferrite; and a second magnetic body disposed on an outer circumferential surface or an inner circumferential surface of the first magnetic body, wherein the second magnetic body includes: resin material and a plurality of layers of metal ribbons wound along the circumferential direction of the first magnetic body, wherein the resin material comprises a first resin material disposed to cover an outer surface of the plurality of layers of metal ribbons, and a second resin material disposed in at least a part of a plurality of layers of interlayer spaces.
Electronic component
An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
Common mode noise filter
A common mode noise filter includes a laminated body having insulator layers therein and first and second spiral conductors provided on layer planes different from each other. The first spiral conductor includes a first spiral conductor line, a first pad provided at an outer end of the first spiral conductor line, and a second pad provided at an inner end of the first spiral conductor line. The second spiral conductor includes a second spiral conductor line, a third pad provided at an outer end of the second spiral conductor line, and a fourth pad provided at an inner end of the second spiral conductor line. The first spiral conductor line faces the second spiral conductor line. Each of the second pad and the sixth pad overlaps none of the fourth pad and the eighth pad viewing from above.
Power supply converter and method for manufacturing the same
A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.
Magnetoresistive effect device
A high-frequency filter includes at least one magnetoresistive effect element; a first port through which a high-frequency signal is input; a second port through which a high-frequency signal is output; and a signal line.
MAGNETORESISTANCE EFFECT DEVICE AND MAGNETORESISTANCE EFFECT MODULE
A magnetoresistance effect device includes a first port, a second port, a first circuit unit and a second circuit unit which are connected in series between the first port and the second port, a shared reference electric potential terminal or a first reference electric potential terminal and a second reference electric potential terminal, and a shared DC application terminal or a first DC application terminal and a second DC application terminal, wherein the first circuit unit and the second circuit unit include a magnetoresistance effect element and a conductor connected to one end thereof, a first end portion of the conductor is connected to a high-frequency current input side, and a second end portion of the first conductor is connected to the shared reference electric potential terminal, the first reference electric potential terminal or the second reference electric potential terminal.
MAGNETORESISTANCE EFFECT DEVICE AND MAGNETORESISTANCE EFFECT MODULE
The magnetoresistance effect device includes first and second ports, a first circuit unit and a second circuit unit connected between the first port and the second port, a shared reference electric potential terminal or a first reference electric potential terminal and a second reference electric potential terminal, and a shared DC application terminal or a first DC application terminal and a second DC application terminal, the first circuit unit includes a first magnetoresistance effect element, the second circuit unit includes a second magnetoresistance effect element and a first conductor separated from the second magnetoresistance effect element with an insulating body therebetween and a first end portion of the first conductor is connected to an input side of high frequency current such that high frequency magnetic field generated by the high frequency current flowing through the first conductor is applied to the magnetization free layer of the second magnetoresistance effect element.
Impedance matching device
An impedance matching device comprising a variable reactor having a main winding and control winding, wherein a generated magnet field in the core is an AC magnetic field with a magnitude exceeding a value to settle a deviation between a control target value for impedance matching and a feedback value, by changing the magnitude of the generated magnetic field by changing a control current passing through the control winding, thereby controlling inductance of the variable rector to be a predetermined value to perform impedance matching, the response delay in the impedance matching is reduced by reducing a response delay in the inductance variation of the variable reactor.
LC composite electronic component, and mounting structure for LC composite electronic component
An LC composite electronic component includes a ceramic substrate that includes a magnetic layer, a thin-film insulator layer that is formed using a thin film process on a surface of the ceramic substrate, a coil-shaped inductor element that is formed in the ceramic substrate, a capacitor element that is formed in the thin-film insulator layer, and external terminals that are formed on a surface of the thin-film insulator layer. The capacitor element is located in the thin-film insulator layer and includes a first capacitor electrode, a second capacitor electrode and a thin-film dielectric body at least part of which is arranged between the first and second capacitor electrodes. The external terminals are each respectively connected to at least one out of the inductor element and the capacitor element.
Flexible resistive tip cable assembly for differential probing
A flexible resistive tip cable assembly includes a probe Radio Frequency (RF) connector structured to receive a RF differential signal and a testing connection assembly. A coaxial cable is structured to conduct the RF differential signal between the probe RF connector and the testing connection assembly. The coaxial cable includes a cable for conducting the differential signal, and a plurality of magnetic elements positioned along a length of the cable and structured to isolate the differential signal from common mode interference. The magnetic elements are separated from adjacent magnetic elements by a gap with elastomeric elements is positioned in each gap to provide cable flexibility. The assembly may also include an Electrically Erasable Programmable Read Only Memory (EEPROM) loaded with an attenuation associated with the flexible resistive tip cable assembly for use in signal testing by a device coupled to the testing connection assembly.