A common mode noise filter includes a laminated body having insulator layers therein and first and second spiral conductors provided on layer planes different from each other. The first spiral conductor includes a first spiral conductor line, a first pad provided at an outer end of the first spiral conductor line, and a second pad provided at an inner end of the first spiral conductor line. The second spiral conductor includes a second spiral conductor line, a third pad provided at an outer end of the second spiral conductor line, and a fourth pad provided at an inner end of the second spiral conductor line. The first spiral conductor line faces the second spiral conductor line. Each of the second pad and the sixth pad overlaps none of the fourth pad and the eighth pad viewing from above.

This magnetoresistance effect element includes a first ferromagnetic layer, a second ferromagnetic layer, and a non-magnetic layer. The non-magnetic layer is between the first ferromagnetic layer and the second ferromagnetic layer. The first ferromagnetic layer contains at least partially crystallized Heusler alloy containing Co. The non-magnetic layer has a first non-magnetic region and a second non-magnetic region. Each of the second non-magnetic region is sandwiched between the first non-magnetic regions in a thickness direction of the non-magnetic layer. Atoms or molecules constituting each of the second non-magnetic regions are smaller than atoms or molecules constituting the first non-magnetic region. Each crystal structure of the second non-magnetic region is a NaCl type structure. At least a part of the second non-magnetic region is crystallized continuously with the first non-magnetic region and the first ferromagnetic layer or the second ferromagnetic layer.

An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

In a common mode choke coil having a magnetic core, a decrease in peak value of a common mode impedance in a vicinity of its resonance frequency is suppressed. A common mode choke coil includes a non-magnetic layer, a first magnetic layer formed on a top surface of the non-magnetic layer, a second magnetic layer formed on a bottom surface of the non-magnetic layer, a magnetic core provided between the first magnetic layer and the second magnetic layer so that its axis extends in a top-bottom direction, a first coil conductor embedded in the non-magnetic layer and wound around the magnetic core, a second coil conductor embedded in the non-magnetic layer and wound around the magnetic core, and a first magnetic gap provided between a top surface of the magnetic core and a bottom surface of the first magnetic layer. The magnetic core is made of a ferrite material.

This magnetoresistance effect element includes a first ferromagnetic layer, a second ferromagnetic layer, and a non-magnetic layer. The non-magnetic layer is between the first ferromagnetic layer and the second ferromagnetic layer. The first ferromagnetic layer contains at least partially crystallized Heusler alloy containing Co. The non-magnetic layer has a first non-magnetic region and a second non-magnetic region. Each of the second non-magnetic region is sandwiched between the first non-magnetic regions in a thickness direction of the non-magnetic layer. Atoms or molecules constituting each of the second non-magnetic regions are smaller than atoms or molecules constituting the first non-magnetic region. Each crystal structure of the second non-magnetic region is a NaCl type structure. At least a part of the second non-magnetic region is crystallized continuously with the first non-magnetic region and the first ferromagnetic layer or the second ferromagnetic layer.

An impedance matching device comprising a variable reactor having a main winding and control winding, wherein a generated magnet field in the core is an AC magnetic field with a magnitude exceeding a value to settle a deviation between a control target value for impedance matching and a feedback value, by changing the magnitude of the generated magnetic field by changing a control current passing through the control winding, thereby controlling inductance of the variable rector to be a predetermined value to perform impedance matching, the response delay in the impedance matching is reduced by reducing a response delay in the inductance variation of the variable reactor.

An LC composite device includes a capacitor portion, an inductor portion, and a magnetic body portion. The capacitor portion is configured of a first substrate and a thin film capacitance element formed on the first substrate through a thin film process. The inductor portion is configured of a second substrate and a thin film inductance element formed on the second substrate through a thin film process. The magnetic body portion includes a magnetic substrate, and the capacitor portion. The inductor portion and the magnetic body portion are stacked in a positional relationship in which the magnetic body portion and the inductor portion are in contact with each other.

An LC composite electronic component includes a ceramic substrate that includes a magnetic layer, a thin-film insulator layer that is formed using a thin film process on a surface of the ceramic substrate, a coil-shaped inductor element that is formed in the ceramic substrate, a capacitor element that is formed in the thin-film insulator layer, and external terminals that are formed on a surface of the thin-film insulator layer. The capacitor element is located in the thin-film insulator layer and includes a first capacitor electrode, a second capacitor electrode and a thin-film dielectric body at least part of which is arranged between the first and second capacitor electrodes. The external terminals are each respectively connected to at least one out of the inductor element and the capacitor element.

Provided is an EMC filter for rejecting external EMC noises and filtering self-generated emission radiations. The EMC filter includes a first connection port configured to receive one or more input signals from a plurality of sensors and an input power signal. The EMC filter further includes a first filter stage, a second filter stage, and a third filter stage. The first filter stage is configured to filter the received input power signal and the second filter stage is configured to filter one or more ground output signals of the EMC filter. The third filter stage is configured to filter the received one or more input signals to remove EMC noises from the received one or more input signals. The EMC filter further includes a second connection port configured to output the filtered one or more input signals and the filtered input power signal to a fleet management apparatus.

The invention specifies an inductive component for a busbar. The inductive component has two air gaps which are arranged on opposite sides of the component, wherein the air gaps are at a distance from one another in a vertical direction of the component.