A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.

An RF filter system includes a plurality of bulk acoustic wave resonators arranged in a circuit having serial and parallel shunt configurations of resonators. Each resonator having a reflector, a support member including a surface, a first electrode including tungsten, overlying the reflector, a piezoelectric film including crystalline aluminum scandium nitride overlapping the first electrode, a second electrode including tungsten overlapping the piezoelectric film and the first electrode, and a passivation layer including silicon nitride overlying the second electrode. Portions of the support member surface of at least one resonator define a cavity region having a portion of the first electrode of the at least one resonator is located within the cavity region. The pass band circuit response has a bandwidth corresponding to a thickness of at least one of the first electrode, piezoelectric film, second electrode, and passivation layer. The system can include single crystal or polycrystalline BAW resonators.

An RF filter system includes a plurality of bulk acoustic wave resonators arranged in a circuit having serial and parallel shunt configurations of resonators. Each resonator having a reflector, a support member including a surface, a first electrode including tungsten, overlying the reflector, a piezoelectric film including crystalline aluminum scandium nitride overlapping the first electrode, a second electrode including tungsten overlapping the piezoelectric film and the first electrode, and a passivation layer including silicon nitride overlying the second electrode. Portions of the support member surface of at least one resonator define a cavity region having a portion of the first electrode of the at least one resonator is located within the cavity region. The pass band circuit response has a bandwidth corresponding to a thickness of at least one of the first electrode, piezoelectric film, second electrode, and passivation layer. The system can include single crystal or polycrystalline BAW resonators.

An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.

An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.

The present disclosure provides a film bulk acoustic resonator and a method for fabricating the film bulk acoustic resonator. The resonator includes a carrier substrate; a support layer bonded on the carrier substrate, where the support layer encloses a first cavity exposing the carrier substrate; a piezoelectric stacked structure covering the first cavity, where the piezoelectric stacked structure includes a first electrode, a piezoelectric layer, and a second electrode which are stacked sequentially from a bottom to a top; and protrusions disposed at a boundary of an effective resonance region, where the protrusions are disposed on an upper surface or a lower surface of the piezoelectric stacked structure; or a part of the protrusions is disposed on the upper surface of the piezoelectric stacked structure, and another part of the protrusions is disposed on the lower surface of the piezoelectric stacked structure.

The present disclosure provides a film bulk acoustic resonator and a method for fabricating the film bulk acoustic resonator. The resonator includes a carrier substrate; a support layer bonded on the carrier substrate, where the support layer encloses a first cavity exposing the carrier substrate; a piezoelectric stacked structure covering the first cavity, where the piezoelectric stacked structure includes a first electrode, a piezoelectric layer, and a second electrode which are stacked sequentially from a bottom to a top; and protrusions disposed at a boundary of an effective resonance region, where the protrusions are disposed on an upper surface or a lower surface of the piezoelectric stacked structure; or a part of the protrusions is disposed on the upper surface of the piezoelectric stacked structure, and another part of the protrusions is disposed on the lower surface of the piezoelectric stacked structure.

A quartz crystal resonator that includes a quartz crystal element having main surfaces extending in a plane φ degrees around a Z axis of the quartz crystal element and θ degrees around an X′ axis of the quartz crystal element; and an electrode in contact with the quartz crystal element, where x=t/T≥0.01, |φ−(−98.6x.sup.3+114.0x.sup.2−22.3x+1.3)|≤5 and |θ−(−9.5x.sup.3−10.9x.sup.2+1.4x+35.3)|≤0.5, wherein T is a thickness of the quartz crystal element and t is a thickness of the electrode.

A quartz crystal resonator that includes a quartz crystal element having main surfaces extending in a plane φ degrees around a Z axis of the quartz crystal element and θ degrees around an X′ axis of the quartz crystal element; and an electrode in contact with the quartz crystal element, where x=t/T≥0.01, |φ−(−98.6x.sup.3+114.0x.sup.2−22.3x+1.3)|≤5 and |θ−(−9.5x.sup.3−10.9x.sup.2+1.4x+35.3)|≤0.5, wherein T is a thickness of the quartz crystal element and t is a thickness of the electrode.

Examples described herein provide selective filtering by a network device for continuous 5 GHz and 6 GHz operation. Examples may include receiving, by the network device, a first signal in a 5 GHz band, and generating, by the network device, a second signal in a 6 GHz band. Examples may include selecting, by the network device, a first filter or a second filter to be applied the first signal in the 5 GHz band, wherein the first filter allows a lower frequency band to pass than the second filter in the 5 GHz band, selecting, by the network device, a third filter or a fourth filter to be applied to the second signal in the 6 GHz band, wherein the third filter allows a lower frequency band to pass than the fourth filter in the 6 GHz band, and simultaneously applying, by the network device, the selected first or second filter to the first signal and the selected third or fourth filter to the second signal.