H03H7/0107

Electronic circuit with a current ripple filter

An electronic circuit comprising an ACRF comprising an active component, an energy storage unit, an input port and an output port. The electronic circuit comprises a control unit to control the ACRF. A detector detects a short circuit at the input port or the absence of an energy supply at the input port. The control unit controls the ACRF to function as an ACRF if the detector detects a power supply connected to the input port or that there is no short circuit at the input port, and controls the ACRF to stop functioning as an ACRF and to discharge energy from its energy storage unit to its output port if the detector detects a short circuit at the input port or no power supply connected to the input port.

Electronic Devices and Method for Filtering Common Mode Disturbances from Power Electronic Devices
20180123344 · 2018-05-03 ·

An electronic device and a method for filtering common mode disturbances from a power electronic device are disclosed. In an embodiment the device includes a first capacitor coupled in series to a first one-way conductor, the first one-way conductor allowing current flow in one direction, wherein the first one-way conductor and the first capacitor are coupled between a load node and a reference potential and a second capacitor coupled in series to a second one-way conductor, the second one-way conductor allowing current flow in an opposite direction, wherein the second one-way conductor and the second capacitor are coupled between the load node and the reference potential. The device further includes a third capacitor being coupled between the load node and the reference potential, a first switch bypassing the first one-way conductor and a second switch bypassing the second one-way conductor.

LC composite component

Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil.

Memory effect reduction using low impedance biasing

A circuit includes a bias circuit for a biased transistor. The bias circuit includes a master-slave source follower circuit, a reference transistor, and a bias circuit voltage output coupled to the biased transistor and configured to provide a bias voltage. The reference transistor has a transconductance substantially identical to a transconductance of the biased transistor. A signal ground circuit may be coupled between the biased transistor and one or more components of the bias circuit that do not generate significant return currents to a power supply ground. A method includes generating a current in a reference transistor according to a first voltage generated using a master source follower circuit, generating a second voltage substantially identical to the first voltage using a slave source follower circuit, and providing the second voltage to a biased transistor. The reference transistor has a transconductance substantially identical to a transconductance of the biased transistor.

Laminated common-mode choke coil

In a common-mode choke coil, first annular conductors are helically defined from the lower layer to the upper layer, and first annular conductors are helically defined from the upper layer to the lower layer. Further, second annular conductors are helically defined from the lower layer to the upper layer, and second annular conductors are helically defined from the upper layer to the lower layer. The first annular conductors and the second annular conductors are disposed alternately in a lamination direction. The first annular conductors and the second annular conductors are disposed such that substantial portions of the annular conductors adjacent to each other in the layer direction do not overlap in a planar view. This structure achieves a compact common-mode choke coil with which the loss of normal-mode signals is small, and which is highly capable of removing common-mode noise.

LC COMPOSITE COMPONENT
20170117867 · 2017-04-27 ·

Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil.

Non-magnetic frequency selective limiters and signal-to-noise enhancers
09627730 · 2017-04-18 · ·

A non-magnetic material frequency selective limiter circuit has first and second resonators and a non-linear coupling component. The first resonator oscillates at a fundamental frequency. The second resonator oscillates at one half of the fundamental frequency. The non-linear coupling component non-linearly and parametrically couples the first resonator and the second resonator. The first resonator, second resonator and the non-linear coupling component are arranged so as to reduce the amplitude of an output signal for an input signal of frequency when an input signal amplitude is above a voltage threshold value, by converting part of the input signal to a signal at the frequency /2. The first resonator, second resonator and the non-linear coupling component are formed of non-magnetic materials.

ELECTRONIC COMPONENT
20170063322 · 2017-03-02 · ·

An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a primary coil and a secondary coil that are arranged inside the multilayer body in a stacking direction of the multilayer body; a first ground electrode and a second ground electrode that are provided in the multilayer body and between which the primary coil and the secondary coil are interposed in the stacking direction; and a ground terminal that is connected to the first ground electrode and the second ground electrode. A capacitance is generated between the first ground electrode and the primary coil or the secondary coil and a capacitance is generated between the second ground electrode and the primary coil or the secondary coil.

LC composite component

Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil.

MULTIPLEXER AND DETECTOR
20260058625 · 2026-02-26 · ·

The present disclosure provides a multiplexer and a detector. The multiplexer includes a dielectric base plate, a connection structure, and a plurality of bandpass filters with different operation frequencies. A conductive thin film layer is disposed on a side plane of the dielectric base plate, the conductive thin film layer includes a signal wire and one or more grounding plates on a side of the signal wire. The connection structure is disposed on a side, on which the conductive thin film layer is provided, of the dielectric base plate, and includes a main branch and a plurality of branches, where the main branch is connected to the plurality of branches respectively, and the main branch serves as an input port of the multiplexer. Each of the plurality of bandpass filters with different operation frequencies is disposed on the side, on which the conductive thin film layer is provided, of the dielectric base plate, and is connected to the signal wire and the one or more grounding plates. For each bandpass filter of the plurality of bandpass filters, the bandpass filter includes a first port and a second port, the first port is connected to a corresponding branch of the plurality of branches, and the second port serves as one of a plurality of output ports of the multiplexer.