A bi-directional coupler architecture that allows an entire radio frequency coupler to be fully integrated with other circuitry on a single IC substrate. Embodiments of the invention use a lumped component architecture instead of quarter-wave transmission lines to reduce area and limit loss on the primary signal line. In some embodiments, two directional couplers of opposite polarities are implemented at least in part using spiral secondary inductors electromagnetically coupled to a shared primary inductor signal line, thus providing a bi-directional coupler architecture.

Techniques that facilitate a superconducting combiner or separator of DC-currents and microwave signals are provided. In one example, a device includes a direct current circuit and a microwave circuit. The direct current circuit comprises a bandstop circuit and provides transmission of a direct current signal. The microwave circuit provides transmission of a microwave signal. The microwave circuit and the direct current circuit that comprises the bandstop circuit are joined by a common circuit that provides transmission of the direct current signal and the microwave signal.

A multilayered filter device includes a multilayer stack, a band pass filter, a first band elimination filter, and a second band elimination filter. The band pass filter and the first and second band elimination filters are each constructed using the multilayer stack. The band pass filter includes a plurality of first resonators with open ends. Each band elimination filter includes a connection path, and a second resonator coupled to the connection path. The connection path includes an impedance transformer. The second resonator includes a conductor line constituting a distributed constant line.

A filter includes: first and second parallel resonant circuits including a first capacitor, a first line, a second capacitor, and a second line that are shunt-connected to a series pathway connecting the input and output terminals; and first to sixth vias penetrating through a second dielectric layer on which the first and second lines are disposed, the first via connecting the first line to the series pathway, the second via connecting the first line to the ground terminal, the third via connecting the first line at a position between the first and second vias to the first connection line at a first position, the fourth via connecting the second line to the series pathway, the fifth via connecting the second line to the ground terminal, the sixth via connecting the second line at a position between the fourth and fifth vias to the first connection line at a second position.

An amplifier with switchable and tunable harmonic terminations and a variable impedance matching network is presented. The amplifier can adapt to different modes and different frequency bands of operation by appropriate switching and/or tuning of the harmonic terminations and/or the variable impedance matching network.

A radio frequency circuit includes a multilayer substrate, series arm circuits in a first path connecting the input/output terminals (T1 and T2) on the multilayer substrate, a parallel arm circuit in a second path connecting a node on the first path and a ground, a wiring A on the multilayer substrate connected to the input/output terminal (T1) as a part of the first path, a wiring B on the multilayer substrate connected to the input/output terminal (T2) as a part of the first path, and a wiring C on the multilayer substrate as a part of the second path. The parallel arm circuit includes an impedance variable circuit, the wiring A and the wiring B in a layer different from the multilayer substrate. When viewed in a plan view, the wiring C does not overlap with the wiring A and the wiring B.

A bi-directional coupler architecture that allows an entire radio frequency coupler to be fully integrated with other circuitry on a single IC substrate. Embodiments of the invention use a lumped component architecture instead of quarter-wave transmission lines to reduce area and limit loss on the primary signal line. In some embodiments, two directional couplers of opposite polarities are implemented at least in part using spiral secondary inductors electromagnetically coupled to a shared primary inductor signal line, thus providing a bi-directional coupler architecture.

There is provided an electronic gain shaper for open loop adaptive optimising of broadband microwave circuits, the gain shaper comprising operating parameter selection means adapted for providing one or more operating parameters; and a lossy tuning element operably coupled to the operating parameter selection means, wherein, in use, the gain shaper is adapted for receiving an operating mode; retrieving an operating parameter from the operating parameter selection means in accordance with the operating mode; and configuring the lossy tuning element in accordance with the operating parameter.

A flexible resonant trap circuit is provided that includes a transmission line arranged to include a helical winding that has a first helical winding segment and a second helical winding segment; and a capacitor coupled between the first and second helical winding segments.

An acoustic wave filter device includes a first resonant circuit, a second resonant circuit, a first interconnect line, and a second interconnect line. The second resonant circuit includes a second parallel-arm resonator, and a frequency-tuning circuit that allows tuning of the resonant frequency of the second parallel-arm resonator. The frequency-tuning circuit includes a capacitor, and a switching element connected in parallel with the capacitor. The first interconnect line is an interconnect line connected to the portion of the series-arm resonator located adjacent to the first input/output terminal. The second interconnect line is an interconnect line connecting the parallel-arm resonator with the switching element, or an interconnect line connecting the parallel-arm resonator with the capacitor. A first transmission line formed by the first interconnect line, and a second transmission line formed by the second interconnect line are magnetically coupled with each other.