Patent classifications
H03H7/0138
MULTILAYERED FILTER DEVICE
A multilayered filter device includes a multilayer stack, a band pass filter, a first band elimination filter, and a second band elimination filter. The band pass filter and the first and second band elimination filters are each constructed using the multilayer stack. The band pass filter includes a plurality of first resonators with open ends. Each band elimination filter includes a connection path, and a second resonator coupled to the connection path. The connection path includes an impedance transformer. The second resonator includes a conductor line constituting a distributed constant line.
Communication apparatus
In a communication apparatus, an analog circuit executes an analog process to a differential signal in a condition that a potential of a first conductor is a reference. A communication circuit receives, via a connection circuit, a differential signal obtained by the execution of the analog process of the analog process is executed and generates, based on the received differential signal, a signal with a reference corresponding to a potential of a second conductor. An inductor (a connection element) is connected between the first conductor and the second conductor. The connection circuit includes a circuit element other than a capacitor.
MOCA CONNECTIVITY SPLITTER AND HUB
The present invention is directed to a splitter or hub that provides plural ports for communicating MoCA signals between devices. More particularly, the present invention relates to a passive splitter to communicate MoCA signals between a gateway/amplifier port and customer devices, or a passive hub to communicate MoCA signals between customer devices. The splitter or hub includes a resistive splitter network and may include a MoCA passing filter and a test port.
Multilayered filter device
A multilayered filter device includes a multilayer stack, a band pass filter, a first band elimination filter, and a second band elimination filter. The band pass filter and the first and second band elimination filters are each constructed using the multilayer stack. The band pass filter includes a plurality of first resonators with open ends. Each band elimination filter includes a connection path, and a second resonator coupled to the connection path. The connection path includes an impedance transformer. The second resonator includes a conductor line constituting a distributed constant line.
Polyphase filter (PPF) including RC-LR sections
Polyphase filters (PPFs) can be used to generate quadrature or other phase-shifted representations of an input signal provided to the PPF. In one approach, a “passive” polyphase filter can include a combination of resistive and capacitive elements. Such a topology can be referred to as an RC-PPF topology. Another passive circuit topology can be used to provide a PPF, by replacing the resistive elements with inductive elements, and by replacing the capacitive elements with resistive elements. A filter circuit can include cascaded RC-PPF and LR-PPF sections, such as in an alternating manner (e.g., an “RC-LR” topology). In this approach, a total insertion loss of cascaded LR-PPF and RC-PPF sections can be reduced as compared to using LR-PPF or RC-PPF sections, alone.
IC CHIP
A reception-side IC chip (1a) includes a pad (15) which is connected to a transmission line (2) which is outside the chip and has a characteristic impedance Z0 of 50 Ω, a signal line (16), one end of which is connected to the pad (15), a reception-side input unit circuit (10) configured to receive a signal (S) transmitted from a transmission-side IC chip via the transmission line (2), a 50-Ω termination resistor (11), for impedance matching, which is connected between a predetermined voltage and the other end of the signal line (16) and is configured to terminate the transmission line (2), and a capacitor (12) inserted between a node (A) of the signal line (16) and the termination resistor (11) and an input terminal (In) of the reception-side input unit circuit (10). A DC-blocking circuit is formed by the capacitor (12).
MoCA connectivity splitter and hub
The present invention is directed to a splitter or hub that provides plural ports for communicating MoCA signals between devices. More particularly, the present invention relates to a passive splitter to communicate MoCA signals between a gateway/amplifier port and customer devices, or a passive hub to communicate MoCA signals between customer devices. The splitter or hub includes a resistive splitter network and may include a MoCA passing filter and a test port.
High performance inductors
Disclosed is an inductor device including a first curved metal plate, a second curved metal plate below and substantially vertically aligned with the first curved metal plate, and a first elongated via vertically aligned between the first curved metal plate and the second curved metal plate, the first elongated via configured to conductively couple the first curved metal plate to the second curved metal plate and having an aspect ratio of a width to a height of the first elongated via of at least approximately 2 to 1.
Electrical filter structure
An electrical filter structure for forwarding an electrical signal from a first port to a second port in a frequency selective manner, wherein the filter is an edge-coupled filter, the filter comprising: a plurality of coupled line sections coupled in a series, comprising at least a first coupled line section and a last coupled line section; wherein the first port is connected with the first of the coupled line sections using a first transmission line; wherein the second port is connected with the last of the coupled line sections using a second transmission line; wherein the electrical filter comprises an open stub; wherein a length of the open stub is chosen such that an electrical length of the open stub is equal, within a tolerance of +/−20 percent, to a fourth of a wavelength of a signal having a frequency of twice a passband center frequency of the filter.
Filter and front end circuit
A filter includes: first and second parallel resonant circuits including a first capacitor, a first line, a second capacitor, and a second line that are shunt-connected to a series pathway connecting the input and output terminals; and first to sixth vias penetrating through a second dielectric layer on which the first and second lines are disposed, the first via connecting the first line to the series pathway, the second via connecting the first line to the ground terminal, the third via connecting the first line at a position between the first and second vias to the first connection line at a first position, the fourth via connecting the second line to the series pathway, the fifth via connecting the second line to the ground terminal, the sixth via connecting the second line at a position between the fourth and fifth vias to the first connection line at a second position.